公开(公告)号：US08309974B2

公开(公告)日：2012-11-13

申请号：US12881204

申请日：2010-09-14

申请人： Katsuyoshi Nakayama ,  Akihiro Hishinuma ,  Rui Yanagawa ,  Kazuyoshi Orihara ,  Yasuko Osaki ,  Kenji Imakita ,  Takashi Ootsuki ,  Hideaki Hayashi ,  Shinji Honda

发明人： Katsuyoshi Nakayama ,  Akihiro Hishinuma ,  Rui Yanagawa ,  Kazuyoshi Orihara ,  Yasuko Osaki ,  Kenji Imakita ,  Takashi Ootsuki ,  Hideaki Hayashi ,  Shinji Honda

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12

CPC分类号： C04B35/119 ,  C03C14/004 ,  C04B35/117 ,  C04B2235/36 ,  C04B2235/6025 ,  C04B2235/96 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0206 ,  H05K1/0306 ,  H01L2924/00

摘要： To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate.A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO2, from 13 to 18% of B2O3, from 9 to 23% of CaO, from 3 to 8% of Al2O3 and from 0.5 to 6% of at least one of K2O and Na2O in total, and a ceramic filler.

摘要翻译： 提供一种发光二极管封装，其中热通孔的突起的高度减小而不降低绝缘基板的弯曲强度。 一种发光二极管封装，其包括安装在基板上的发光二极管元件，其中所述基板通过烧制玻璃陶瓷组合物获得，所述玻璃陶瓷组合物含有玻璃粉末，所述玻璃陶瓷组合物含有以摩尔百分数表示的57至65％的SiO 2， 至18％的B 2 O 3，9至23％的CaO，3至8％的Al 2 O 3和0.5至6％的至少一种K 2 O和Na 2 O，以及陶瓷填料。

公开(公告)号：US20110001162A1

公开(公告)日：2011-01-06

申请号：US12881204

申请日：2010-09-14

申请人： Katsuyoshi NAKAYAMA ,  Akihiro Hishinuma ,  Rui Yanagawa ,  Kazuyoshi Orihara ,  Yasuko Osaki ,  Kenji Imakita ,  Takashi Ootsuki ,  Hideaki Hayashi ,  Shinji Honda

发明人： Katsuyoshi NAKAYAMA ,  Akihiro Hishinuma ,  Rui Yanagawa ,  Kazuyoshi Orihara ,  Yasuko Osaki ,  Kenji Imakita ,  Takashi Ootsuki ,  Hideaki Hayashi ,  Shinji Honda

IPC分类号： H01L33/64

CPC分类号： C04B35/119 ,  C03C14/004 ,  C04B35/117 ,  C04B2235/36 ,  C04B2235/6025 ,  C04B2235/96 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0206 ,  H05K1/0306 ,  H01L2924/00

摘要： To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate.A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO2, from 13 to 18% of B2O3, from 9 to 23% of CaO, from 3 to 8% of Al2O3 and from 0.5 to 6% of at least one of K2O and Na2O in total, and a ceramic filler.

摘要翻译： 提供一种发光二极管封装，其中热通孔的突起的高度减小而不降低绝缘基板的弯曲强度。 一种发光二极管封装，其包括安装在基板上的发光二极管元件，其中所述基板通过烧制玻璃陶瓷组合物获得，所述玻璃陶瓷组合物含有玻璃粉末，所述玻璃陶瓷组合物含有以摩尔百分数表示的57至65％的SiO 2， 至18％的B 2 O 3，9至23％的CaO，3至8％的Al 2 O 3和0.5至6％的至少一种K 2 O和Na 2 O，以及陶瓷填料。