公开(公告)号：US20080217743A1

公开(公告)日：2008-09-11

申请号：US12040447

申请日：2008-02-29

申请人： Kazuaki KOJIMA ,  Takatoshi IGARASHI ,  Kazuya MATSUMOTO

发明人： Kazuaki KOJIMA ,  Takatoshi IGARASHI ,  Kazuya MATSUMOTO

IPC分类号： H01L23/544 ,  H01L21/00

CPC分类号： H01L23/585 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to a method of manufacturing a semiconductor device, a short-circuit wiring is formed in a region on a wafer including a dicing region, and electrode pads for input and output signals of a plurality of devices disposed in a semiconductor device forming region are electrically short-circuited by the short-circuit wiring, so that occurrence of plasma damage is suppressed even if the wafer is subjected to various plasma processes. When the wafer subjected to the plasma processes is cut along the dicing region to separate a semiconductor device, the electrical short-circuit of the electrode pads by the short-circuit wiring is released, so that the functionally unwanted short-circuit of the devices or the like is appropriately released.

摘要翻译： 根据制造半导体器件的方法，在包括切割区域的晶片的区域中形成短路布线，并且设置在半导体器件形成区域中的多个器件的输入和输出信号的电极焊盘是电 短路布线短路，即使对晶片进行各种等离子体处理也能够抑制等离子体损伤的发生。 当沿着切割区切割经受等离子体处理的晶片以分离半导体器件时，通过短路布线的电极焊盘的电短路被释放，使得器件或功能上不需要的短路 适当地释放。

公开(公告)号：US20090240107A1

公开(公告)日：2009-09-24

申请号：US12401806

申请日：2009-03-11

申请人： Takatoshi IGARASHI ,  Kazuaki KOJIMA

发明人： Takatoshi IGARASHI ,  Kazuaki KOJIMA

IPC分类号： A61B1/04

CPC分类号： A61B1/273 ,  A61B1/041

摘要： An apparatus for introduction into a test body includes a functional portion for obtaining information on an inside of a test body; a power source for supplying power for driving the functional portion; and an enclosed container for accommodating the functional portion and the power source. A cross-sectional shape orthogonal to a longitudinal direction of the enclosed container is an elliptical shape to make an outer shape small to alleviate a burden on a test subject during introduction into a body by swallowing or the like for test.

摘要翻译： 用于引入测试体的装置包括用于获得测试体内部的信息的功能部分; 用于提供用于驱动功能部分的电力的电源; 以及用于容纳功能部分和电源的封闭容器。 与封闭容器的长度方向正交的截面形状是椭圆形状，以使外形小，以减轻通过吞咽等引入体内对被检体的负担。

公开(公告)号：US20110249106A1

公开(公告)日：2011-10-13

申请号：US13046133

申请日：2011-03-11

申请人： Yukiharu MAKINO ,  Takashi NAKAYAMA ,  Fukashi YOSHIZAWA ,  Takatoshi IGARASHI

发明人： Yukiharu MAKINO ,  Takashi NAKAYAMA ,  Fukashi YOSHIZAWA ,  Takatoshi IGARASHI

IPC分类号： H04N7/18 ,  H05K3/00 ,  H04N5/225

CPC分类号： H05K1/189 ,  A61B1/051 ,  H04N5/2254 ,  H04N7/183 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/10151 ,  Y10T29/49124

摘要： An image pickup apparatus includes an image pickup device chip having an image pickup device on a front face and an external connection terminal on a rear face through a via interconnect; a wiring board placed within a projection plane of the image pickup device chip and made up of an intermediate portion whose first main face is connected with the external connection terminal, a first flexing portion and a second flexing portion extended from opposite ends of the intermediate portion and bent toward the intermediate portion at a predetermined angle, and a first extension portion and a second extension portion; and a signal cable connected to the first extension portion and the second extension portion.

摘要翻译： 图像拾取装置包括：图像拾取器件芯片，其具有通过通孔互连的正面上的图像拾取器件和后表面上的外部连接端子; 放置在摄像元件芯片的投影平面内并由第一主面与外部连接端子连接的中间部分构成的布线板，从中间部分的相对端延伸的第一弯曲部分和第二弯曲部分 并以预定的角度向中间部分弯曲，以及第一延伸部分和第二延伸部分; 以及连接到第一延伸部分和第二延伸部分的信号电缆。

公开(公告)号：US20110080474A1

公开(公告)日：2011-04-07

申请号：US12896225

申请日：2010-10-01

申请人： Takatoshi IGARASHI

发明人： Takatoshi IGARASHI

IPC分类号： H04N7/18 ,  H04N5/335

CPC分类号： H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/1464 ,  H01L2924/0002 ,  H04N5/2257 ,  H04N2005/2255 ,  H04N2209/042 ,  H01L2924/00

摘要： An image pickup device according to the present invention including an image pickup device main body having a semiconductor substrate provided with a light-receiving section and a wiring layer laminated on the semiconductor substrate, has a first surface which causes light to enter the light-receiving section and positioned on the image pickup device main body on the side of the wiring layer and a second surface which causes light to enter the light-receiving section and positioned on the image pickup device main body on the side of the semiconductor substrate so as to oppose the first surface.

摘要翻译： 根据本发明的图像拾取装置包括具有设置有光接收部分的半导体基板和层叠在半导体基板上的布线层的图像拾取装置主体，具有使光进入受光部的第一表面 并且位于图像拾取装置主体上的布线层一侧，并且第二表面使光进入光接收部并位于半导体基板侧的图像拾取装置主体上，从而 反对第一个表面。

公开(公告)号：US20100225004A1

公开(公告)日：2010-09-09

申请号：US12714849

申请日：2010-03-01

申请人： Takatoshi IGARASHI

发明人： Takatoshi IGARASHI

IPC分类号： H01L23/488 ,  H01L23/48 ,  H01L21/768 ,  H01L21/60

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/12 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor apparatus including a semiconductor substrate having a first principal surface on which an electric circuit is formed and a second principal surface opposed to the first principal surface, and a through hole that penetrates the first principal surface and the second principal surface, a multilayered wiring layer having a plurality of conductive wiring layers connected to the electric circuit and a plurality of inter-layer insulating layers having an insulating layer opening of a same size and at a same position as a through hole opening which is an opening of the first principal surface of the through hole, an electrode pad that covers the insulating layer opening connected to the conductive wiring layer and a lead-out wiring layer having a through wiring layer connected to the electrode pad formed inside the through hole and a connection wiring layer formed integral with the through wiring layer.

摘要翻译： 一种半导体装置，包括具有形成有电路的第一主面的半导体衬底和与第一主面相对的第二主面，以及贯通第一主面和第二主面的通孔，多层布线 层，其具有连接到所述电路的多个导电布线层，以及多个层间绝缘层，所述绝缘层开口具有与所述第一主表面的开口相同的尺寸的绝缘层开口和与所述第一主表面的开口相同的位置 所述通孔的电极焊盘覆盖与所述导电布线层连接的所述绝缘层开口，以及引出布线层，所述引出布线层具有连接到形成于所述通孔内部的所述电极焊盘的贯通布线层;以及连接布线层， 通过布线层。

公开(公告)号：US20100091168A1

公开(公告)日：2010-04-15

申请号：US12575045

申请日：2009-10-07

申请人： Takatoshi IGARASHI ,  Noriyuki FUJIMORI

发明人： Takatoshi IGARASHI ,  Noriyuki FUJIMORI

IPC分类号： H04N5/225 ,  H01L31/18

CPC分类号： H04N5/2254 ,  G02B3/0056 ,  G02B5/188 ,  G02B5/189 ,  G03B17/00 ,  H01L27/14627 ,  H01L27/14685

摘要： A solid-state image pickup apparatus includes a solid-state image pickup device, a microlens member laminated on the solid-state image pickup device, and a flat plate-like cover glass attached onto a region excluding a pixel region on the microlens member as viewed in a planar manner from above the microlens member to seal the pixel region of the solid-state image pickup device.

摘要翻译： 固态图像拾取装置包括固态图像拾取装置，层叠在固态图像拾取装置上的微透镜部件和附接到除了微透镜部件上的像素区域之外的区域上的平板状覆盖玻璃， 从微透镜部件的上方以平面方式观察，以密封固态图像拾取装置的像素区域。