公开(公告)号：US07175405B2

公开(公告)日：2007-02-13

申请号：US10305241

申请日：2002-11-27

申请人： Kazuhiko Kobayashi ,  Tsutomu Miyagawa ,  Tomokazu Asakura ,  Shusaku Tagami ,  Hideaki Nakazawa ,  Naoya Gotoh

发明人： Kazuhiko Kobayashi ,  Tsutomu Miyagawa ,  Tomokazu Asakura ,  Shusaku Tagami ,  Hideaki Nakazawa ,  Naoya Gotoh

IPC分类号： B29C33/56 ,  B29C33/68 ,  B29C43/36 ,  B29C43/58

CPC分类号： B29C43/36 ,  B29C33/20 ,  B29C33/68 ,  B29C37/0075 ,  B29C43/18 ,  B29C43/32 ,  B29C43/58 ,  B29C2043/5825 ,  B29C2043/5833 ,  B29C2043/5891

摘要： A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.

摘要翻译： 一种压缩成型机，能够在精密夹紧工件的同时保持模具并提高模制品的质量和生产率。 压缩成型机包括固定台板; 可动压板 固定模具被固定压板固定; 可动模具由可动压板保持; 开闭机构，其包括连接到可动压板的螺杆轴，所述开闭机构转动所述螺杆轴，以使所述可动模移动和移出所述固定模，由此可以打开和关闭所述模具。 固定模具可以沿着与活动模具的开闭方向交叉的方向从固定压板取出。

公开(公告)号：US20070262049A1

公开(公告)日：2007-11-15

申请号：US11798447

申请日：2007-05-14

申请人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kazuhiko Kobayashi ,  Hideaki Nakazawa ,  Naoya Gotoh ,  Masahiko Fujisawa ,  Akira Katsuyama ,  Shuji Ide

发明人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kazuhiko Kobayashi ,  Hideaki Nakazawa ,  Naoya Gotoh ,  Masahiko Fujisawa ,  Akira Katsuyama ,  Shuji Ide

IPC分类号： B44C1/22 ,  B29C33/40

CPC分类号： B29C33/42 ,  B29C43/003 ,  B29C43/021 ,  B29C43/18 ,  B29C2043/025 ,  B29C2043/3605 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： An imprinting method carries out imprinting on a workpiece by clamping UV-curable resin between a nano-imprinting mold and a workpiece and curing the UV-curable resin using UV light. In this method, the workpiece is supported on a setting table provided with through-holes that are disposed in a planar region of the setting table on which the workpiece is set and are connected to a gas pumping/evacuating mechanism. The UV-curable resin is supplied onto the workpiece and the setting table is raised to and stopped at a filling operation position where the mold surface of the nano-imprinting mold and the surface of the workpiece are apart. After this, gas is pumped toward the lower surface of the workpiece from the through-holes and the workpiece is pressed onto the nano-imprinting mold from a center of the workpiece toward a periphery of the workpiece while gradually filling the UV-curable resin between the nano-imprinting mold and the workpiece. The UV-curable resin is cured by irradiating the UV-curable resin with UV light in a state where the workpiece is pressed onto the nano-imprinting mold by the pumping pressure of the gas.

摘要翻译： 压印方法通过将UV固化树脂夹在纳米压印模和工件之间并通过UV光固化UV固化树脂，在工件上进行压印。 在该方法中，工件被支撑在设置有设置在设置工作台的平面区域中并且与气体抽吸/排气机构连接的通孔的设置台上。 将紫外线固化树脂供给到工件上，并且将安装台升高并停止在填充操作位置，其中纳米压印模具的模具表面和工件表面分开。 此后，气体从通孔向工件的下表面泵送，并且工件从工件的中心朝向工件的周边压到纳米压印模具上，同时逐渐地将UV可固化树脂填充在 纳米压印模具和工件。 在通过气体的泵送压力将工件压在纳米压印模上的状态下，通过用UV光照射UV固化树脂来固化紫外线固化树脂。

公开(公告)号：US07407608B2

公开(公告)日：2008-08-05

申请号：US11262851

申请日：2005-11-01

申请人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuhiko Kobayashi ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

发明人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuhiko Kobayashi ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

IPC分类号： B29C45/14 ,  H01L21/56

CPC分类号： B29C33/58 ,  B29C33/10 ,  B29C33/68 ,  B29C43/18 ,  B29C43/58 ,  B29C2043/561 ,  B29C2043/5825 ,  B29C2043/5883 ,  B29C2043/5891 ,  H01L21/565 ,  H01L21/67207 ,  H01L21/67236 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

摘要： The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

摘要翻译： 树脂成形设备包括：工件供给部; 测量安装在工件上的半导体芯片的厚度的工件测量部分; 向工件供给液体树脂的树脂供给部; 树脂模制部分，具有用于使液体树脂模制工件的模制模具; 测量模制产品的树脂模制部件的厚度的产品测量部分; 产品容纳部; 以及用于控制这些部分的控制部分。 控制部分包括根据由工件测量部测量的厚度来调节由树脂供给部分供给到工件的液体树脂的量的装置。

公开(公告)号：US20060093692A1

公开(公告)日：2006-05-04

申请号：US11262851

申请日：2005-11-01

申请人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

发明人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

IPC分类号： B29C47/92

CPC分类号： B29C33/58 ,  B29C33/10 ,  B29C33/68 ,  B29C43/18 ,  B29C43/58 ,  B29C2043/561 ,  B29C2043/5825 ,  B29C2043/5883 ,  B29C2043/5891 ,  H01L21/565 ,  H01L21/67207 ,  H01L21/67236 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

摘要： The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

摘要翻译： 树脂成形设备包括：工件供给部; 测量安装在工件上的半导体芯片的厚度的工件测量部分; 向工件供给液体树脂的树脂供给部; 树脂模制部分，具有用于使液体树脂模制工件的模制模具; 测量模制产品的树脂模制部件的厚度的产品测量部分; 产品容纳部; 以及用于控制这些部分的控制部分。 控制部分包括根据由工件测量部测量的厚度来调节由树脂供给部分供给到工件的液体树脂的量的装置。