公开(公告)号：US20100190413A1

公开(公告)日：2010-07-29

申请号：US12754385

申请日：2010-04-05

申请人： Kazuhiko NISHIMOTO ,  Kouji Taira ,  Kenichi Suenaga ,  Yuichi Honma

发明人： Kazuhiko NISHIMOTO ,  Kouji Taira ,  Kenichi Suenaga ,  Yuichi Honma

IPC分类号： B24B1/00 ,  C09K3/14 ,  C09G1/02

CPC分类号： G11B5/8404 ,  B24B37/0056 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463

摘要： A polishing composition containing an abrasive and water, wherein the polishing composition has a pH of from 0.1 to 7, and satisfies the following conditions: (1) that the number of polishing particles having sizes of 0.56 μm or more and less than 1 μm is 500,000 or less per 1 cm3 of the polishing composition; and (2) that the ratio of polishing particles having sizes of 1 μm or more is 0.001% by weight or less to the entire polishing particles in the polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, recording disk substrates, such as magnetic disks, optical disks, and opto-magnetic disks, photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.

摘要翻译： 1.一种抛光组合物，其含有研磨剂和水，其中，所述研磨用组合物的pH为0.1〜7，满足以下条件：（1）尺寸为0.56μm以上且小于1μm的研磨粒子数为 每1cm3抛光组合物500,000或更少; （2）研磨用组合物中的研磨粒子的整体的比例为1μm以上的研磨粒子的比例为0.001重量％以下。 抛光组合物适用于抛光用于精密部件的基板，例如磁盘，光盘，光磁盘，光掩模基板，光学透镜，光学镜，光学棱镜和半导体基板等记录盘基板，以及 类似。

公开(公告)号：US20060030243A1

公开(公告)日：2006-02-09

申请号：US11184960

申请日：2005-07-20

申请人： Kazuhiko Nishimoto ,  Kouji Taira ,  Kenichi Suenaga ,  Yuichi Honma

发明人： Kazuhiko Nishimoto ,  Kouji Taira ,  Kenichi Suenaga ,  Yuichi Honma

IPC分类号： B24D3/02 ,  B24B1/00

CPC分类号： G11B5/8404 ,  B24B37/0056 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463

摘要： A polishing composition containing an abrasive and water, wherein the polishing composition has a pH of from 0.1 to 7, and satisfies the following conditions: (1) that the number of polishing particles having sizes of 0.56 μm or more and less than 1 μm is 500,000 or less per 1 cm3 of the polishing composition; and (2) that the ratio of polishing particles having sizes of 1 μm or more is 0.001% by weight or less to the entire polishing particles in the polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, recording disk substrates, such as magnetic disks, optical disks, and opto-magnetic disks, photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.

摘要翻译： 1.一种抛光组合物，其含有研磨剂和水，其中，所述研磨用组合物的pH为0.1〜7，满足以下条件：（1）尺寸为0.56μm以上且小于1μm的研磨粒子数为 每抛光组合物1cm 3以上500,000以下; （2）研磨用组合物中的研磨粒子的整体的比例为1μm以上的研磨粒子的比例为0.001重量％以下。 抛光组合物适用于抛光用于精密部件的基板，例如磁盘，光盘，光磁盘，光掩模基板，光学透镜，光学镜，光学棱镜和半导体基板等记录盘基板，以及 类似。

公开(公告)号：US20050221726A1

公开(公告)日：2005-10-06

申请号：US11095564

申请日：2005-04-01

申请人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

发明人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

IPC分类号： B24B1/00 ,  B24B37/00 ,  B24D3/02 ,  C09G1/02 ,  C09K3/14

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1409

摘要： The present invention relates to a polishing composition containing an abrasive having an average particle size of from 1 to 30 nm and water, wherein the abrasive has a packing ratio of from 79 to 90% by weight; a method for manufacturing a substrate, including the steps of introducing the above polishing composition between a substrate and a polishing pad, and polishing the substrate, while contacting the substrate with the polishing composition; and a method for reducing scratches of a substrate to be polished, including the step of polishing the substrate to be polished with the above polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, substrates for magnetic recording media, such as magnetic disks, and opto-magnetic disks, photomask substrates, optical disks, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.

摘要翻译： 本发明涉及一种含有平均粒径为1〜30nm的研磨剂和水的抛光组合物，其中研磨剂的填充率为79〜90重量％ 一种制造基板的方法，包括以下步骤：在基板和抛光垫之间引入上述抛光组合物，并在将基板与抛光组合物接触的同时研磨基板; 以及减少待研磨的基板的划痕的方法，包括用上述抛光组合物抛光待抛光的基板的步骤。 抛光组合物适用于抛光用于精密部件的基板，例如磁记录介质如磁盘，光磁盘，光掩模基板，光盘，光学透镜，光学镜，光学棱镜和半导体基板 ，等等。

公开(公告)号：US07267702B2

公开(公告)日：2007-09-11

申请号：US11095564

申请日：2005-04-01

申请人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

发明人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

IPC分类号： B24B1/00 ,  B24B37/00 ,  C09G1/02 ,  C09G1/04 ,  C09K3/14

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1409

摘要： A polishing composition is provided containing an abrasive having an average particle size of from 1 to 30 nm and water, wherein the abrasive has a packing ratio of from 79 to 90% by weight; a method for manufacturing a substrate, including the steps of introducing the above polishing composition between a substrate and a polishing pad, and polishing the substrate, while contacting the substrate with the polishing composition; and a method for reducing scratches of a substrate to be polished, including the step of polishing the substrate to be polished with the above polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, substrates for magnetic recording media, such as magnetic disks, and opto-magnetic disks, photomask substrates, optical disks, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.

摘要翻译： 提供了含有平均粒度为1〜30nm的研磨剂和水的抛光组合物，其中研磨剂的填充率为79〜90重量％ 一种制造基板的方法，包括以下步骤：在基板和抛光垫之间引入上述抛光组合物，并在将基板与抛光组合物接触的同时研磨基板; 以及减少待研磨的基板的划痕的方法，包括用上述抛光组合物抛光待抛光的基板的步骤。 抛光组合物适用于抛光用于精密部件的基板，例如磁记录介质如磁盘，光磁盘，光掩模基板，光盘，光学透镜，光学镜，光学棱镜和半导体基板 ，等等。