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1.发明授权Radiating structural body of electronic part and radiating sheet used for the radiating structural body 失效用于辐射结构体的电子部件和辐射片的辐射结构体公开(公告)号：US07016196B2
公开(公告)日：2006-03-21
申请号：US10250686
申请日：2002-03-20
申请人： Kazuhiko Tomaru , Kunihiko Mita , Tsutomu Yoneyama
发明人： Kazuhiko Tomaru , Kunihiko Mita , Tsutomu Yoneyama
IPC分类号： H05K7/20
CPC分类号： H01L23/3735 , H01L23/3737 , H01L23/4275 , H01L2924/0002 , Y10T428/12049 , Y10T428/14 , Y10T428/1414 , H01L2924/00
摘要： A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
摘要翻译： 发热电子部件的散热结构体的特征在于，在发热电子部件和散热部件之间，具有包含金属片的散热片和层叠有发粘电子部件的散热构件的导热部件， 发热电子部件和具有粘接性的导热部件与散热部件连接。
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公开(公告)号：US07484556B2
公开(公告)日：2009-02-03
申请号：US11527641
申请日：2006-09-27
申请人： Kunihiko Mita , Kazuhiko Tomaru , Yoshitaka Aoki , Hironao Fujiki
发明人： Kunihiko Mita , Kazuhiko Tomaru , Yoshitaka Aoki , Hironao Fujiki
CPC分类号： C09K5/06 , H01L23/3737 , H01L23/4275 , H01L2924/0002 , Y10S165/905 , H01L2924/00
摘要： A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
摘要翻译： 一种散热构件，其设置在发热电子部件之间，其在运转时产生热量并达到高于室温的温度，散热部件的特征在于，散热构件在室温状态下为非流体， 电子部件的操作并且获得低粘度，在电子部件的操作期间在发热的同时软化或熔化至少使其表面流化，以便填充电子部件和散热部件而不留下任何实质的空隙，以及 散热构件由包含硅树脂和导热填料的组合物形成。
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3.发明授权公开(公告)号：US07417078B2
公开(公告)日：2008-08-26
申请号：US10250685
申请日：2002-03-20
申请人： Hironao Fujiki , Kazuhiko Tomaru , Ikuo Sakurai , Akio Suzuki , Kunihiko Mita
发明人： Hironao Fujiki , Kazuhiko Tomaru , Ikuo Sakurai , Akio Suzuki , Kunihiko Mita
CPC分类号： H05K9/0083
摘要： An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.
摘要翻译： 使用电磁波吸收导热组合物形成电磁波吸收散热物品，其放置在发热电子部件之间，发热电子部件在运转时发热，达到高于室温的温度，作为电磁波发生源 ，以及散热部件。 组合物在电子组件操作之前在室温下是非流体的，但是在电子部件的操作期间获得低粘度，在发热时软化或熔化，以使组合物的至少一个表面流化，使得组合物基本上 填充电子部件和散热部件之间的任何间隙。
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公开(公告)号：US20070023179A1
公开(公告)日：2007-02-01
申请号：US11527641
申请日：2006-09-27
申请人： Kunihiko Mita , Kazuhiko Tomaru , Yoshitaka Aoki , Hironao Fujiki
发明人： Kunihiko Mita , Kazuhiko Tomaru , Yoshitaka Aoki , Hironao Fujiki
IPC分类号： H05K7/20
CPC分类号： C09K5/06 , H01L23/3737 , H01L23/4275 , H01L2924/0002 , Y10S165/905 , H01L2924/00
摘要： A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
摘要翻译： 一种散热构件，其设置在发热电子部件之间，其在运转时产生热量并达到高于室温的温度，散热部件的特征在于，散热构件在室温状态下为非流体， 电子部件的操作并且获得低粘度，在电子部件的操作期间在发热的同时软化或熔化至少使其表面流化，以便填充电子部件和散热部件而不留下任何实质的空隙，以及 散热构件由包含硅树脂和导热填料的组合物形成。
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公开(公告)号：US6106350A
公开(公告)日：2000-08-22
申请号：US366211
申请日：1999-08-02
摘要： A method of insulating a cathode ray tube and enabling an electrical insulator to be produced without material loss and enabling improvement of the bonding strength between a stem and a stem base, which comprises a base through which pin through holes are formed and has provided projecting from the front surface thereof a tip holder, in a state with the stem pins inserted through the pin through holes and the tip held in the tip holder, said method comprising the steps of molding an electrical insulator composition comprising an uncured self-adhesive silicone rubber into a predetermined sheet shape by using a transfer mold to obtain an electrical insulator, arranging the electrical insulator in a state extending from the positions of the pin through holes on the back of the base of the stem base to the tip holder and adhering it to the back of the base, folding the portion of the electrical insulator extending to the tip holder to the inside surface of the tip holder, and attaching the stem base to the stem.
摘要翻译： 一种绝缘阴极射线管的方法，能够在不产生材料损失的情况下制造电绝缘体，并且能够提高杆和杆基座之间的接合强度，该基座包括形成销孔的底座， 其前表面是一个尖端保持器，处于一个状态，其中杆销通过销穿过孔插入，并且把头保持在刀片保持器中，所述方法包括以下步骤：将包含未固化的自粘硅橡胶的电绝缘组合物模制成 通过使用转印模具来获得电绝缘体的预定片材形状，将电绝缘体布置在从茎基部的基部的背面上的销子通孔的位置延伸到尖端保持器并将其粘附到 将电绝缘体的延伸到尖端保持器的部分折叠到尖端保持器的内表面，并将其附接 茎基为茎。
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公开(公告)号：US6071630A
公开(公告)日：2000-06-06
申请号：US808378
申请日：1997-02-28
申请人： Kazuhiko Tomaru , Ryuichi Handa , Tsutomu Yoneyama
发明人： Kazuhiko Tomaru , Ryuichi Handa , Tsutomu Yoneyama
CPC分类号： H01L21/6833 , B23Q3/154 , Y10T279/23 , Y10T428/12576 , Y10T428/26
摘要： An electrostatic chuck comprises a metallic plate, a first insulating layer formed on the metallic plate and composed of a ceramic material, an electrically conductive electrode pattern formed on the first insulating layer, and a second insulating layer formed on the conductive electrode pattern and made of an elastomer. Alternatively, the first and second insulating layers may be each made of a thermally conductive silicone rubber provided that the thermally conductive silicone rubber for the second insulating layer should have a hardness of 85 or below a surface roughness of 5 .mu.m or below.
摘要翻译： 静电卡盘包括金属板，形成在金属板上并由陶瓷材料构成的第一绝缘层，形成在第一绝缘层上的导电电极图案和形成在导电电极图案上的第二绝缘层， 弹性体。 或者，第一和第二绝缘层可以各自由导热硅橡胶制成，只要第二绝缘层的导热硅橡胶的硬度应为85或低于5μm或更低的表面粗糙度。
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公开(公告)号：US06760214B2
公开(公告)日：2004-07-06
申请号：US09829420
申请日：2001-04-10
申请人： Kazuhiko Tomaru , Ryuichi Handa , Tsutomu Yoneyama
发明人： Kazuhiko Tomaru , Ryuichi Handa , Tsutomu Yoneyama
IPC分类号： H02N1300
CPC分类号： H01L21/6833
摘要： A wafer chuck used in manufacturing processes of integrated semiconductors and liquid crystal panels, more particularly, an electrostatic silicone rubber chuck for ion injectors used in an ion injection process.
摘要翻译： 用于集成半导体和液晶面板的制造工艺中的晶片卡盘，更具体地，用于离子注入工艺中使用的离子注入器的静电硅橡胶卡盘。
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公开(公告)号：US06545267B1
公开(公告)日：2003-04-08
申请号：US09466848
申请日：1999-12-20
IPC分类号： H05H302
CPC分类号： H01L21/68764 , H01J2237/31701
摘要： Wafer holders disposed in the target chamber of an ion implantation apparatus, with each of the wafer holders comprising a wafer mount and an electrically conductive elastic body that is laid on the wafer mount and has a surface for holding a wafer thereon.
摘要翻译： 设置在离子注入装置的靶室中的晶片保持器，其中每个晶片保持器包括晶片安装件和布置在晶片安装件上并具有用于在其上保持晶片的表面的导电弹性体。
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公开(公告)号：US5309840A
公开(公告)日：1994-05-10
申请号：US070184
申请日：1993-06-02
申请人： Toru Takamura , Tsutomu Yoneyama , Kazuhiko Tomaru
发明人： Toru Takamura , Tsutomu Yoneyama , Kazuhiko Tomaru
CPC分类号： B05C5/0216 , D06Q1/00 , G09F21/02 , G09F2021/023
摘要： An impasto pattern representing a desired character or mark is formed on a stretchable support, typically sportswear fabric by extruding a high viscosity liquid silicone rubber composition to the support through a nozzle of a robotic applicator having a picture drawing function to form a predetermined pattern of impasto extrudate on the support, and curing the extrudate.
摘要翻译： 在可伸展的支撑件上形成代表期望的字符或标记的粗假图案，通常是运动服装织物，通过具有图画绘制功能的机器人涂抹器的喷嘴将高粘度液体硅橡胶组合物挤出到支撑体上，以形成预定的凹凸图案 挤出在载体上，并固化挤出物。
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公开(公告)号：US06896824B2
公开(公告)日：2005-05-24
申请号：US09973924
申请日：2001-10-11
申请人： Kazuhiko Tomaru , Tsutomu Yoneyama , Ryuichi Handa
发明人： Kazuhiko Tomaru , Tsutomu Yoneyama , Ryuichi Handa
IPC分类号： C08J5/18 , C08K3/00 , C08K3/08 , C08K3/20 , C08K3/28 , C08L23/00 , C09K5/08 , H01L23/373 , H05K7/20 , H01B1/02 , C09K5/00
摘要： A heat-softening heat-radiation sheet including a polyolefin-based heat-conductive composition which comprises a polyolefin and a heat-conductive filler, has a softening point of 40° C. or above, has a thermal conductivity of 1.0 W/mK or higher, has a viscosity at 80° C. of from 1×102 to 1×105 Pa·s and has a plasticity at 25° C. in the range of from 100 to 700. This heat-radiation sheet which is in the form of a solid sheet at room temperature, can readily be attached to or detached from electronic components and a heat sink, is capable of softening by the heat generated during operation of electronic components, to have the interfacial contact thermal resistance at a negligible level, and has a superior heat-radiation performance.
摘要翻译： 包含聚烯烃和导热性填料的聚烯烃类导热性组合物的软化热散射片的软化点为40℃以上，热导率为1.0W / m·K， 更高，在80℃下具有1×10 2至1×10 5 Pa的粘度，并且在25℃下的塑性在100至 这种在室温下为固体片形式的散热片可以容易地附着到电子部件和散热器上或从电子元件拆卸，并且能够通过在电子部件的操作期间产生的热而软化， 使界面接触热阻达到可忽略的水平，具有优异的散热性能。
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