Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good
    2.
    发明授权
    Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good 有权
    环氧树脂用微胶囊型固化剂,环氧树脂用母料型固化剂组合物,单组分环氧树脂组合物,加工品

    公开(公告)号:US07927514B2

    公开(公告)日:2011-04-19

    申请号:US12223523

    申请日:2007-01-31

    IPC分类号: H01B1/12 C08F283/00 C08K5/55

    摘要: Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm−1, it is excellent in storage stability and at the same time, in reaction rapidity.

    摘要翻译: 本发明提供一种环氧树脂微胶囊型固化剂,其具有使用环氧树脂作为原料的固化剂(H)形成的芯(C)和用于覆盖芯(C)的壳(S)。 由于其特征在于环氧树脂的硬化剂(H)的平均粒径超过0.3μm且不大于12μm; 用于环氧树脂的小粒径固化剂的含量为环氧树脂的固化剂(H)的平均粒径的0.5倍以下的粒径为0.1〜15% 壳体(S)的表面上具有能够吸收波数为1630〜1680cm -1的红外线的结合组(x),能够吸收红外线的结合基(y)具有 1680〜1725cm -1的波数和能够吸收1730〜1755cm -1的波数的红外线的结合基(z),其保存稳定性优异,同时在反应中 速度快

    High-stability microencapsulated hardened for epoxy resin and epoxy resin composition
    3.
    发明授权
    High-stability microencapsulated hardened for epoxy resin and epoxy resin composition 有权
    高稳定性微胶囊硬化环氧树脂和环氧树脂组合物

    公开(公告)号:US07854860B2

    公开(公告)日:2010-12-21

    申请号:US11991785

    申请日:2006-09-29

    IPC分类号: H01B1/12 H01M2/16

    摘要: A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starking material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener.

    摘要翻译: 一种用于环氧树脂的微胶囊化潜在硬化剂,其包括芯(C)和壳(S),芯被覆盖,其特征在于,芯(C)是由环氧树脂固化剂颗粒 H),其包含胺加合物(A)和低分子胺化合物(B)作为主要成分,并且所述壳(S)在其表面上具有吸收的连接基团(x),(y)和(z) 红外线。 还提供含有硬化剂的环氧树脂组合物。

    Hardener for Epoxy Resin and Epoxy Resin Composition
    4.
    发明申请
    Hardener for Epoxy Resin and Epoxy Resin Composition 有权
    环氧树脂和环氧树脂组合物的固化剂

    公开(公告)号:US20070244268A1

    公开(公告)日:2007-10-18

    申请号:US10594594

    申请日:2005-03-30

    CPC分类号: C08G59/184 C08G59/18

    摘要: An amine hardener for epoxy resins which comprises an amine adduct (A) and a low-molecular amine compound (B) as major components, wherein the molecular weight distribution of the amine adduct (A), which is defined by the ratio of the weight-average molecular weight to the number-average molecular weight, is 3 or lower and the low-molecular amine compound (B) is contained in an amount of 0.001 to 1 part by mass per 100 parts by mass of the amine adduct (A).

    摘要翻译: 用于环氧树脂的胺固化剂,其包含胺加合物(A)和低分子胺化合物(B)作为主要组分,其中胺加合物(A)的分子量分布由重量比 平均分子量相对于数均分子量为3以下,低分子量胺化合物(B)的含量相对于100质量份胺加成物(A)为0.001〜1质量份, 。

    Hardener for epoxy resin and epoxy resin composition
    5.
    发明授权
    Hardener for epoxy resin and epoxy resin composition 有权
    环氧树脂和环氧树脂组合物的固化剂

    公开(公告)号:US07820772B2

    公开(公告)日:2010-10-26

    申请号:US10594594

    申请日:2005-03-30

    CPC分类号: C08G59/184 C08G59/18

    摘要: An amine hardener for epoxy resins which comprises an amine adduct (A) and a low-molecular amine compound (B) as major components, wherein the molecular weight distribution of the amine adduct (A), which is defined by the ratio of the weight-average molecular weight to the number-average molecular weight, is 3 or lower and the low-molecular amine compound (B) is contained in an amount of 0.001 to 1 part by mass per 100 parts by mass of the amine adduct (A).

    摘要翻译: 用于环氧树脂的胺固化剂,其包含胺加合物(A)和低分子胺化合物(B)作为主要组分,其中胺加合物(A)的分子量分布由重量比 平均分子量相对于数均分子量为3以下,低分子量胺化合物(B)的含量相对于100质量份胺加成物(A)为0.001〜1质量份, 。

    Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good
    7.
    发明申请
    Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good 有权
    用于环氧树脂的微胶囊基固化剂,环氧树脂的母料基固化剂组合物,单组分环氧树脂组合物和加工良好

    公开(公告)号:US20090186962A1

    公开(公告)日:2009-07-23

    申请号:US12223523

    申请日:2007-01-31

    IPC分类号: C08L63/00 C08J3/22

    摘要: Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm−1, it is excellent in storage stability and at the same time, in reaction rapidity.

    摘要翻译: 本发明提供一种环氧树脂微胶囊型固化剂,其具有使用环氧树脂作为原料的固化剂(H)形成的芯(C)和用于覆盖芯(C)的壳(S)。 由于其特征在于环氧树脂的硬化剂(H)的平均粒径超过0.3μm且不大于12μm; 用于环氧树脂的小粒径固化剂的含量为环氧树脂的固化剂(H)的平均粒径的0.5倍以下的粒径为0.1〜15% 壳体(S)的表面上具有能够吸收波数为1630〜1680cm -1的红外线的结合组(x),能够吸收红外线的结合基(y)具有 1680〜1725cm -1的波数和能够吸收1730〜1755cm -1的波数的红外线的结合基(z),其保存稳定性优异,同时在反应中 速度快

    Latent Hardener For Epoxy Resin and Epoxy Resin Composition
    8.
    发明申请
    Latent Hardener For Epoxy Resin and Epoxy Resin Composition 审中-公开
    环氧树脂和环氧树脂组合物的潜在固化剂

    公开(公告)号:US20080251757A1

    公开(公告)日:2008-10-16

    申请号:US11884873

    申请日:2006-02-23

    摘要: A subject of the present invention is to provide a one-pot type epoxy resin composition having both high curability and storage stability and a latent hardener for obtaining the same, and to provide anisotropic conductive materials, conductive adhesive materials, insulating adhesive materials, sealing materials, and the like which have high storage stability, solvent resistance and humidity resistance and can provide high connection reliability, adhesive strength and high sealing properties even under curing conditions such as low temperatures or short periods of time. The present invention relates to a latent hardener for epoxy resins in which a hardener (A) for epoxy resins is covered with a film (c1) obtained by reacting an isocyanate component (b1) comprising a low molecular bifunctional aliphatic isocyanate compound in an amount of 1% by mass or more and 95% by mass or less with an active hydrogen compound (b2), and to a one-pot type epoxy resin composition using the same.

    摘要翻译: 本发明的主题是提供具有高固化性和储存稳定性的一锅型环氧树脂组合物和用于获得固化性和保存稳定性的潜在硬化剂,并提供各向异性导电材料,导电粘合剂材料,绝缘粘合剂材料,密封材料 等,其具有高储存稳定性,耐溶剂性和耐湿性,并且即使在诸如低温或短时间的固化条件下也能提供高连接可靠性,粘合强度和高密封性。 本发明涉及一种用于环氧树脂的潜在性固化剂,其中环氧树脂用固化剂(A)被膜(c1)覆盖,所述膜(c1)通过使含有低分子量双官能脂肪族异氰酸酯化合物的异氰酸酯组分(b1) 使用活性氢化合物(b2)为1质量%以上且95质量%以下,使用该单盆型环氧树脂组合物。