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    Resin composition for inner coat of semiconductor chip
    1.
    发明授权
    Resin composition for inner coat of semiconductor chip 失效
    半导体芯片内层用树脂组合物

    公开(公告)号：US5096990A

    公开(公告)日：1992-03-17

    申请号：US423113

    申请日：1989-10-19

    申请人： Kazuhiro Takayanagi ,  Masayuki Tsuchida ,  Atsushi Koshimura ,  Nobumasa Ohtake ,  Tamio Kimura

    发明人： Kazuhiro Takayanagi ,  Masayuki Tsuchida ,  Atsushi Koshimura ,  Nobumasa Ohtake ,  Tamio Kimura

    IPC分类号： C08L83/04

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70

    摘要： Resin compositions for the inner coat of semiconductors which include(A) 100 parts by weight of a polysiloxane having vinyl groups and having a viscosity of 100 to 800cP at 25.degree. C., said polysiloxane having a general formula ##STR1## in which V represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, R represents a methyl group or a phenyl group and both k and l represent natural numbers which are variables within the range of 0.01.ltoreq.l/(k+l).ltoreq.0.2,(B) 1 to 35 parts by weight of a polysiloxane haivng a viscosity of 2 to 500cP at 25.degree. C., said polysiloxane having a general formula ##STR2## in which Me represents a methyl group, and both m and n represent natural numbers which are variables within the range of 0.05.ltoreq.n/(M+n).ltoreq.0.3,(C) 0.1 to 20% by weight of a organopolysiloxane per total amount of the above-described (A) plus (B), the organopolysiloxane having, per molecule, at least one hydrogen atom bound with a silicon atom and at lest one group having the general formula (R.sub.1 O).sub.3 SiCH.sub.2 CH.sub.2 -- in which R.sub.1 represents a lower alkyl group or a group R.sub.2 (OCH.sub.2 CH.sub.2).sub.p -- in which R.sub.2 represents a methyl group or an ethyl group and p represents a positive number of 3 or less, and(D) platinum catalyst for the addition reaction are provided.

    摘要翻译： 用于半导体内层的树脂组合物包括：（A）100重量份具有乙烯基的聚硅氧烷，在25℃下的粘度为100至800cP，所述聚硅氧烷具有通式“IMAGE”，其中V表示 乙烯基，Me表示甲基，Ph表示苯基，R表示甲基或苯基，k和l都表示自然数，其为0.01≤l/（k + 1）范围内的变量 ），（B）1〜35重量份在25℃下粘度为2〜500cP的聚硅氧烷，所述聚硅氧烷具有通式“IMAGE”，其中Me表示甲基，两者均为 m和n表示作为0.05≤n/（M + n）≤0.3的变量的自然数，（C）相对于上述（a）的总量的有机聚硅氧烷的0.1〜20重量％ A）加上（B），每分子具有至少一个与硅原子结合的氢原子和至少一个组合的有机聚硅氧烷 g为通式（R1O）3SiCH2CH2-，其中R1表示低级烷基或R2（OCH2CH2）p-，R2表示甲基或乙基，p表示正数3以下，（ D）用于加成反应的铂催化剂。