公开(公告)号：US08013265B1

公开(公告)日：2011-09-06

申请号：US13043887

申请日：2011-03-09

申请人： Kazuhisa Fujita ,  Mikio Nishimura ,  Shigetaka Douzono ,  Kouichi Santo ,  Kenji Otomo

发明人： Kazuhisa Fujita ,  Mikio Nishimura ,  Shigetaka Douzono ,  Kouichi Santo ,  Kenji Otomo

IPC分类号： H01H9/02

CPC分类号： H01H9/02

摘要： A switch device includes a box-shaped case, a harness portion, and a fixing member. The harness portion is connected to a switch contact point and includes a plurality of lead lines extending out of the case. The case includes a holding body and a guide portion. The holding body includes a fixing portion protruding from an outer face of the case and provided on a tip side, and a through-hole provided under the fixing portion. The guide portion is opposed to the through-hole and formed in a substantially concave curve shape. The guide portion is formed such that an end portion further from the through-hole is positioned to be above an end portion closer to the through-hole. The fixing member extends through the through-hole and fixes the harness portion to the holding body by winding the harness portion and the fixing portion together.

摘要翻译： 开关装置包括盒形壳体，线束部分和固定构件。 线束部分连接到开关接触点并且包括延伸出壳体的多条引线。 壳体包括保持体和引导部。 保持体包括从壳体的外表面突出并设置在尖端侧的固定部和设置在固定部下方的通孔。 引导部分与通孔相对并形成为大致凹形的曲线形状。 引导部分形成为使得远离通孔的端部位于更靠近通孔的端部的上方。 固定构件延伸穿过通孔并通过将线束部分和固定部分缠绕在一起而将线束部分固定到保持体上。

公开(公告)号：US20050233122A1

公开(公告)日：2005-10-20

申请号：US11107852

申请日：2005-04-18

申请人： Mikio Nishimura ,  Toshihiko Mori ,  Kazuhiko Honjou ,  Junichi Kimura ,  Toshihiro Nishii ,  Shinji Harada ,  Motoyoshi Kitagawa

发明人： Mikio Nishimura ,  Toshihiko Mori ,  Kazuhiko Honjou ,  Junichi Kimura ,  Toshihiro Nishii ,  Shinji Harada ,  Motoyoshi Kitagawa

IPC分类号： B32B3/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H05K1/18 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K1/186 ,  H01L21/56 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/284 ,  H05K3/4652 ,  H05K2203/063 ,  Y10T428/24917

摘要： The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.

摘要翻译： 本发明提供一种能够实现小型便携式电子设备的层压基板的制造方法。 预浸料141是在第一温度范围内保持板状的热固性树脂，在第二温度范围内具有热流动性，并且在第三温度范围内固化，积分过程（118）包括加热预浸料（141）的软化（120） 到第二温度范围，并且软化浸渍在预浸料坯（141）中的树脂，在预浸料坯（141）之前压制预浸料坯（141）的强制流动（122）达到第三温度范围，并迫使树脂流入空间和间隙 半导体（105），电阻器（106）和基板（101），以及加热预浸料（141）的硬化（123）至第三温度范围。 结果，在不使用中间材料的情况下，可以用树脂牢固地填充半导体（105），电阻器（106）和基板（101）之间形成的空间和间隙。

公开(公告)号：US06712989B1

公开(公告)日：2004-03-30

申请号：US09857998

申请日：2001-06-13

申请人： Yoshio Awakura ,  Shigeyoshi Yoshida ,  Mikio Nishimura

发明人： Yoshio Awakura ,  Shigeyoshi Yoshida ,  Mikio Nishimura

IPC分类号： H01F112

CPC分类号： H05K9/0083 ,  B82Y25/00 ,  H01F1/26 ,  H01F1/375 ,  H01F10/324 ,  Y10T428/2982

摘要： A composite magnetic body is obtained without the use of halogen-based or halogen-containing materials, such as, halogen-based binding agent of halogen-based resins or elastomers, and bromine-based fire retardents. The composite magnetic body (1) comprises a soft magnetic powder (2) and a silicone rubber (3). The silicone rubber (3) should preferably be a solid silicone rubber. An electromagnet interference suppressing body is obtained using this composite magnetic body.

摘要翻译： 无需使用卤素类或卤素类的材料，例如卤素类树脂或弹性体的卤素系粘合剂，溴系阻燃剂，可以得到复合磁性体。 复合磁体（1）包括软磁性粉末（2）和硅橡胶（3）。 硅橡胶（3）应优选为固体硅橡胶。 使用该复合磁体获得电磁干扰抑制体。