摘要:
A semiconductor electric power conversion device includes a converter unit and an inverter unit, each having a group of parallel capacitors and multiple switching elements. Subdivided positive conductive connections associated with the converter unit and divided positive conductive connections associated with the inverter unit are formed at a positive side conductor connected to capacitors; while divided negative conductive connections associated with the converter unit and divided negative-polarity conductive connections associated with the inverter unit are formed at a negative polarity side conductor, connected to capacitors. The positive and negative polarity conductors have a multilayer structure with a dielectric plate interposed therebetween. Converter positive and negative polarity conductors are formed into a multilayer structure with the dielectric plate sandwiched between them, and inverter positive and negative polarity conductors are formed into a multilayer structure with the dielectric plate sandwiched therebetween.
摘要:
A power converter is disclosed, in which the sum of the length of that portion of a control signal line which is in opposite relation to an area of a main circuit wiring where a main circuit current flows and a plurality of tabular conductors are in superposed relation with each other, the length of that portion of the control signal line which is in opposite relation to an area of the main circuit wiring where the main circuit current does not flow and the length of that portion of the control signal line which is located outside an end of the main circuit wiring, is substantially equal to the total wiring length of the signal control line.
摘要:
An overheat detecting circuit according to an embodiment of the invention includes: a current source for generating a constant current; an overheat detecting element unit that operates with a first current generated in accordance with the constant current and generates a first voltage based on a semiconductor substrate temperature; and a detecting circuit unit that operates a second current generated in accordance with the constant current, and generates a second voltage corresponding to a predetermined semiconductor substrate temperature to detect overheating based on a voltage difference between the first voltage and a reference voltage and a voltage difference between the second voltage and the reference voltage.
摘要:
An elevator having a power feeding apparatus effective for reducing the installation space for the elevator is disclosed.The dimension of the power transmission part disposed at the hoist way and the dimension of the power receiving part mounted on the counter weight, each measured in the direction along which the counter weight moves are made different from each other.
摘要:
A semiconductor power module capable of efficiently utilizing the performance of the module and facilitating management of the module in custody. The semiconductor power module having one or more semiconductor power switching elements and a drive unit is provided with a non-volatile memory for storing use history of the module and a drive unit. The use history contains information of one of the number of switching times of the semiconductor power switching element, the number of over-current detections of the semiconductor power switching element and a temperature rise of the semiconductor power module.
摘要:
Superconducting magnet system using a liquid helium for its operation and a permanent current switch and a system thereof applied to the superconducting magnet system employing a permanent current loop created by a superconducting material developing superconductivity when cooled. The system includes a superconducting magnet dipped in the liquid helium, the permanent current switch for driving or interrupting the superconducting magnet, and a cryostat for accommodating the superconducting magnet and the permanent current switch, and the permanent current switch is arranged over a liquid surface of the liquid helium.
摘要:
A semiconductor power module capable of efficiently utilizing the performance of the module and facilitating management of the module in custody. The semiconductor power module having one or more semiconductor power switching elements and a drive unit is provided with a non-volatile memory for storing use history of the module and a drive unit. The use history contains information of one of the number of switching times of the semiconductor power switching element, the number of over-current detections of the semiconductor power switching element and a temperature rise of the semiconductor power module.
摘要:
An overheat detecting circuit according to an embodiment of the invention includes: a current source for generating a constant current; an overheat detecting element unit that operates with a first current generated in accordance with the constant current and generates a first voltage based on a semiconductor substrate temperature; and a detecting circuit unit that operates a second current generated in accordance with the constant current, and generates a second voltage corresponding to a predetermined semiconductor substrate temperature to detect overheating based on a voltage difference between the first voltage and a reference voltage and a voltage difference between the second voltage and the reference voltage.
摘要:
When the overcurrent detection circuit detects that a voltage drop of the output transistor exceeds a threshold value, it turns on the switch by the first operational amplifier. In the shut-down signal generation circuit, the capacitor is charged with a charge current determined based on a current depending on the voltage drop of the output transistor. The shut-down signal generation circuit generates a shut-down signal to turn off the output switch when a voltage of the capacitor exceeds a voltage of the inverting input terminal of the second operational amplifier.
摘要:
A semiconductor device of a SOI (silicon on insulator) structure includes a P-type silicon support substrate, a first insulating layer formed on the semiconductor support substrate, and an SOI layer formed on the first insulating layer. A first hole is formed to penetrate through the semiconductor layer and the first insulating layer, and a P-type polysilicon layer is filled in the first hole so that the P-type polysilicon layer is electrically connected to the semiconductor support substrate. A second insulating layer is formed on the SOI layer. A second hole is formed to penetrate through the second insulating layer in alignment with the first hole, and an aluminum electrode is formed on the second insulating layer to fill the second hole, so that the aluminum electrode is electrically connected through the P-type polysilicon layer to the silicon support substrate. Thus, the potential of the silicon support substrate can be fixed through the aluminum electrode formed on the SOI layer side.