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1.发明授权Low-cost, high-density light-emitting-diode array and fabrication method thereof 有权低成本，高密度发光二极管阵列及其制造方法公开(公告)号：US06563138B2
公开(公告)日：2003-05-13
申请号：US09750299
申请日：2000-12-29
IPC分类号： H01L3300
CPC分类号： H01L27/153
摘要： A light-emitting-diode array is formed on a substrate having an upper layer of a semiconducting material and a lower layer of an insulating or semi-insulating material. The upper layer is divided into blocks by isolation channels that cut completely through the upper layer. The light-emitting diodes, which are formed by selective diffusion of an impurity into the upper layer, are arranged in a single row, with at least two light-emitting diodes in each block of the upper layer. Each block has a block electrode that drives the light-emitting diodes in the block. The row of light-emitting diodes is paralleled by a number of shared lines which cross the isolation channels. Each shared line is coupled to a plurality of light-emitting diodes in different blocks.
摘要翻译： 在具有半导体材料的上层和绝缘或半绝缘材料的下层的基板上形成发光二极管阵列。 上层通过完全穿过上层的隔离通道分成块。 通过将杂质选择性地扩散到上层中而形成的发光二极管以单列排列，在上层的每个块中至少有两个发光二极管。 每个块具有驱动块中的发光二极管的块电极。 这排发光二极管与穿过隔离通道的多条共用线并联。 每个共享线路连接到不同块中的多个发光二极管。
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公开(公告)号：US06190935B1
公开(公告)日：2001-02-20
申请号：US09359789
申请日：1999-07-26
IPC分类号： H01L3300
CPC分类号： H01L27/153
摘要： A light-emitting-diode array is formed on a substrate having an upper layer of a semiconducting material and a lower layer of an insulating or semi-insulating material. The upper layer is divided into blocks by isolation channels that cut completely through the upper layer. The light-emitting diodes, which are formed by selective diffusion of an impurity into the upper layer, are arranged in a single row, with at least two light-emitting diodes in each block of the upper layer. Each block has a block electrode that drives the light-emitting diodes in the block. The row of light-emitting diodes is paralleled by a number of shared lines which cross the isolation channels. Each shared line is coupled to a plurality of light-emitting diodes in different blocks.
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3.发明授权Light emitting element array chip, light emitting element array drive IC and print head 失效发光元件阵列芯片，发光元件阵列驱动IC和打印头公开(公告)号：US06172701B2
公开(公告)日：2001-01-09
申请号：US09106088
申请日：1998-06-29
IPC分类号： B41J247
CPC分类号： G06K15/1247 , B41J2/45
摘要： To achieve a reduction in the size of the print head and a reduction in the cost, LED array chips 1 achieved by matrix-connecting M×N LED elements 2 with M pad electrodes to be scanned 4 and N pad electrodes to be driven 3 and LED array drive ICs 10 are mounted at a mounting substrate 41. The pad electrodes to be driven 3 are connected with drive pad electrodes 16 and the pad electrodes to be scanned 4 are connected with scan pad electrodes 17 through wires 42a and 42b respectively. The pad electrodes to be driven 3 and the pad electrodes to be scanned 4 are provided in a single row along one side or edge of the lengthwise side of the chip. The LED array drive ICs 10 are provided with a scan control unit that sequentially validates the M pad electrodes to be scanned 4 one at a time based upon a scan signal and a data control unit that supplies drive currents to the N pad electrodes to be driven 3 in conformance to individual sets of data to cause N LED elements 2 connected with a valid pad electrode to be scanned 4 to emit light, each time the valid pad electrode to be scanned 4 is switched.
摘要翻译： 为了实现打印头的尺寸的减小和成本的降低，通过矩阵连接MxN LED元件2与要扫描的M个焊盘电极4和要驱动的N个焊盘电极3和LED阵列实现的LED阵列芯片1 驱动IC 10安装在安装基板41上。待驱动的焊盘电极3与驱动焊盘电极16连接，并且待扫描的焊盘电极4分别通过导线42a和42b连接到扫描焊盘电极17。 待驱动的焊盘电极3和待扫描的焊盘电极4沿着芯片的纵向侧的一侧或边缘设置成单行。 LED阵列驱动IC10设置有扫描控制单元，其基于扫描信号和数据控制单元一次一个地依次验证要扫描的M个焊盘电极，该驱动电流向N个焊盘电极提供驱动电流 3，以使得与有效焊盘电极连接的N个LED元件2被扫描4发光，每次要扫描的有效焊盘电极4被切换。
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4.发明授权High-density light-emitting-diode array utilizing a plurality of isolation channels 失效利用多个隔离通道的高密度发光二极管阵列
公开(公告)号：US5955747A
公开(公告)日：1999-09-21
申请号：US900064
申请日：1997-07-23
CPC分类号： H01L27/153
摘要： A light-emitting-diode array is formed on a substrate having an upper layer of a semiconducting material and a lower layer of an insulating or semi-insulating material. The upper layer is divided into blocks by isolation channels that cut completely through the upper layer. The light-emitting diodes, which are formed by selective diffusion of an impurity into the upper layer, are arranged in a single row, with at least two light-emitting diodes in each block of the upper layer. Each block has a block electrode that drives the light-emitting diodes in the block. The row of light-emitting diodes is paralleled by a number of shared lines which cross the isolation channels. Each shared line is coupled to a plurality of light-emitting diodes in different blocks.
摘要翻译： 在具有半导体材料的上层和绝缘或半绝缘材料的下层的基板上形成发光二极管阵列。 上层通过完全穿过上层的隔离通道分成块。 通过将杂质选择性地扩散到上层中而形成的发光二极管以单列排列，在上层的每个块中至少有两个发光二极管。 每个块具有驱动块中的发光二极管的块电极。 这排发光二极管与穿过隔离通道的多条共用线并联。 每个共享线路连接到不同块中的多个发光二极管。
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公开(公告)号：US5869221A
公开(公告)日：1999-02-09
申请号：US997735
申请日：1997-12-24
CPC分类号： H01L27/153
摘要： A method of fabricating an LED array includes forming a first insulating film composed of aluminum oxide on a semiconductor substrate of a first conductive type; patterning the first insulating film by photolithography to form a plurality of first windows; diffusing an impurity of a second conductive type through the plurality of first windows into the first insulating film, thereby forming a plurality of diffusion regions of the second conductive type below the plurality of first windows; forming a second insulating film on the first insulating film and the plurality of first windows; patterning the second insulating film by photolithography to-remove the second insulating film from the plurality of first windows, using an etchant that does not etch the first insulating film; forming a metal film on the second insulating film and the plurality of first windows; and patterning the metal film by photolithography to form a plurality of electrodes which make electrical contact with respective diffusion regions.
摘要翻译： 制造LED阵列的方法包括在第一导电类型的半导体衬底上形成由氧化铝构成的第一绝缘膜; 通过光刻图案化第一绝缘膜以形成多个第一窗口; 将通过所述多个第一窗口的第二导电类型的杂质扩散到所述第一绝缘膜中，从而在所述多个第一窗口的下方形成所述第二导电类型的多个扩散区域; 在所述第一绝缘膜和所述多个第一窗口上形成第二绝缘膜; 使用不蚀刻第一绝缘膜的蚀刻剂通过光刻图案化第二绝缘膜以从多个第一窗口去除第二绝缘膜; 在所述第二绝缘膜和所述多个第一窗口上形成金属膜; 并通过光刻法形成金属膜以形成与各个扩散区电接触的多个电极。
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公开(公告)号：US06222208B1
公开(公告)日：2001-04-24
申请号：US09089093
申请日：1998-06-02
IPC分类号： H01L3300
CPC分类号： H01L33/30 , H01L27/153 , H01L33/025 , H01L33/24
摘要： A light-emitting diode includes a first semiconductor epitaxial layer of a first conduction type, a second semiconductor epitaxial layer of the first conduction type laminated upon the first semiconductor epitaxial layer and having an energy band gap greater than that of the first semiconductor epitaxial layer, and an area of impurities formed within the first semiconductor epitaxial layer and the second semiconductor epitaxial layer by doping impurity of a second conduction type from the side of the second semiconductor epitaxial layer. A front of the diode is located within the first semiconductor epitaxial layer.
摘要翻译： 发光二极管包括第一导电类型的第一半导体外延层，第一导电类型的第二半导体外延层，层压在第一半导体外延层上并具有大于第一半导体外延层的能带隙的能带隙， 以及通过从第二半导体外延层的侧面掺杂第二导电类型的杂质而形成在第一半导体外延层和第二半导体外延层内的杂质区域。 二极管的前部位于第一半导体外延层内。
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公开(公告)号：US06180961B2
公开(公告)日：2001-01-30
申请号：US09093609
申请日：1998-06-09
IPC分类号： H01L3300
CPC分类号： H01L33/025 , H01L27/153 , H01L33/24
摘要： A high-density semiconductor device and semiconductor device array exhibiting high light emission efficiency which can be mass-produced at low cost with high yield is provided. An LED array comprises a structure wherein an n-type GaAs buffer layer 102 is formed on an n-type GaAs substrate 101, on which are then stacked an n-type AlzGa1−zAs layer 103, an n-type AlyGa1−yAs layer 104, a semi-insulating AlxGa1−xAs layer 105, and a semi-insulating GaAs layer 106. The energy band gaps of the AlzGa1−zAs layer 103 and AlxGa1−xAs layer 105 are at least larger than the energy band gap of the AlyGa1−yAs layer 104. A pn junction is formed by selective diffusion, having a diffusion front in the semiconductor layer having the smaller energy band gap sandwiched between the semiconductor layers having the larger energy band gaps. The outermost layer forming ohmic contact is made a p-type GaAs region formed by zinc diffusion in a semi-insulating GaAs layer.
摘要翻译： 提供了一种可以以低成本，高产率批量生产的高发光效率的高密度半导体器件和半导体器件阵列。 LED阵列包括其中n型GaAs缓冲层102形成在n型GaAs衬底101上的结构，然后将n型GaAs缓冲层102层叠在n型AlzGa1-zAs层103，n型AllyGa1-yAs层104 ，半绝缘Al x Ga 1-x As层105和半绝缘GaAs层106.AlzGa1-zAs层103和AlxGa1-xAs层105的能带隙至少大于Al y Ga 1-x As层105的能带隙。 通过选择性扩散形成pn结，在半导体层中具有在具有较大能带间隙的半导体层之间具有较小能带隙的扩散前沿。 形成欧姆接触的最外层是在半绝缘GaAs层中通过锌扩散形成的p型GaAs区。
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8.发明授权High-resolution light-sensing and light-emitting diode array and fabrication method thereof 有权高分辨率光感应和发光二极管阵列及其制造方法
公开(公告)号：US6136627A
公开(公告)日：2000-10-24
申请号：US137073
申请日：1998-08-20
IPC分类号： H01L27/144 , H01L27/146 , H01L27/15 , H01L31/0224 , H01L31/10 , H01L31/12 , H01L33/00 , H01L21/225
CPC分类号： H01L31/022408 , H01L27/1446 , H01L27/14601 , H01L27/14643 , H01L27/14683 , H01L27/153 , H01L31/125 , H01L33/0008 , H01L27/156
摘要： A light-sensing/emitting diode array chip has impurity diffusion regions with a depth of at least 0.5 .mu.m but not more than 2 .mu.m in a semiconductor substrate. Each impurity diffusion region is preferably divided into a first region, used for emitting or sensing light, and a wider second region, used for electrode contact. The second regions are located on alternate sides of the array line, permitting a small array pitch to be combined with a large contact area. In a wafer process for fabrication of the chips, a diffusion mask has both windows defining the impurity diffusion regions, and dicing line marks. The dicing line marks are narrowed where they pass adjacent to the windows at the ends of the chip. In the electrode fabrication step, a photomask with an enlarged pattern is used, to allow for misalignment with the diffusion mask.
摘要翻译： 光敏/发光二极管阵列芯片在半导体衬底中具有深度至少为0.5μm但不大于2μm的杂质扩散区域。 每个杂质扩散区优选分为用于发射或感测光的第一区域和用于电极接触的较宽的第二区域。 第二区域位于阵列线的另一侧，允许小的阵列间距与大的接触面积组合。 在用于制造芯片的晶片工艺中，扩散掩模具有限定杂质扩散区域的两个窗口和切割线标记。 切割线标记在其靠近芯片端部的窗口的地方变窄。 在电极制造步骤中，使用具有放大图案的光掩模，以允许与扩散掩模的未对准。
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公开(公告)号：US6054724A
公开(公告)日：2000-04-25
申请号：US923816
申请日：1997-09-04
CPC分类号： H01L27/153 , H01L33/0008
摘要： A compound semiconductor layer of a first conductivity type is formed on a substrate, and a diffusion region of a second conductivity type is formed on the compound semiconductor layer. The light-emitting diode has a high emitted light power, using a large-diameter wafer.
摘要翻译： 在衬底上形成第一导电类型的化合物半导体层，并且在化合物半导体层上形成第二导电类型的扩散区域。 发光二极管使用大直径晶片具有高发射光功率。
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10.发明授权Light-emitting diode array with anti-reflection coating providing reduced internal reflection 失效具有抗反射涂层的发光二极管阵列提供减少的内部反射
公开(公告)号：US5530268A
公开(公告)日：1996-06-25
申请号：US326499
申请日：1994-10-20
CPC分类号： H01L33/44 , H01L27/153
摘要： An LED array is fabricated by forming an insulating film on a semiconductor substrate of a first conductive type, forming a plurality of windows in the insulating film, and diffusing an impurity of a second conductive type through these windows to create a plurality of diffusion regions. In addition, an anti-reflection coating consisting of one or more transparent dielectric thin films is formed on the diffusion regions where they are exposed in the windows. The thickness of the anti-reflection coating, or of its constituent thin films, is optimized for maximum transmission of light.
摘要翻译： 通过在第一导电类型的半导体衬底上形成绝缘膜，在绝缘膜中形成多个窗口并且通过这些窗口扩散第二导电类型的杂质以形成多个扩散区域来制造LED阵列。 此外，在由窗口露出的扩散区域上形成由一个或多个透明电介质薄膜组成的防反射涂层。 抗反射涂层或其组成薄膜的厚度被优化用于光的最大透射。
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