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18 条记录 (耗时 0.018 秒)

    Miter saw for displaying angle of cutter blade cutting workpiece
    8.
    发明授权
    Miter saw for displaying angle of cutter blade cutting workpiece 有权
    斜切锯用于显示刀片切割工件的角度

    公开(公告)号：US07039548B2

    公开(公告)日：2006-05-02

    申请号：US10960719

    申请日：2004-10-08

    申请人： Nobuhiro Takano ,  Eisaku Oka ,  Hiromi Ozawa ,  Yoshikazu Kawano ,  Kenrou Ishimaru ,  Tomoyuki Kawahara ,  Hiroyuki Saitou

    发明人： Nobuhiro Takano ,  Eisaku Oka ,  Hiromi Ozawa ,  Yoshikazu Kawano ,  Kenrou Ishimaru ,  Tomoyuki Kawahara ,  Hiroyuki Saitou

    IPC分类号： G01C1/00 ,  G01B3/56 ,  G01B5/24

    CPC分类号： B23D59/001 ,  B23D45/044 ,  B23D45/046 ,  Y10T83/856 ,  Y10T83/863 ,  Y10T83/8773

    摘要： A miter saw for displaying angle of a cutter blade cutting the workpiece. The miter saw has a base mounting a workpiece thereon, a movable member movably supported to the base, and a cutting unit connected to the movable member for supporting the cutter blade. A positioning portion is associated with the movable member and provides a predetermined nominal position of the movable member with respect to the base. The predetermined nominal position includes a reference position and other positions labeled angle. A detector detects the position of the movable member with respect to the base. A processor sets an angle between the reference position and the predetermined nominal position as a displayed moving amount when the movable member is positioned at the predetermined nominal position. Otherwise, the processor computes the moving amount based on the output signal from the detector.

    摘要翻译： 用于显示刀片切割工件的角度的斜切锯。 斜切锯具有将工件安装在其上的基座，可移动地支撑在基座上的可动构件，以及连接到用于支撑切割刀片的可动构件的切割单元。 定位部分与可移动部件相关联并且提供可移动部件相对于基部的预定标称位置。 预定的标称位置包括参考位置和标记为角度的其他位置。 检测器检测可动构件相对于基座的位置。 当可移动部件位于预定的标称位置时，处理器将参考位置和预定的标称位置之间的角度设置为显示的移动量。 否则，处理器基于来自检测器的输出信号来计算移动量。

    Method of coating a copper film on a ceramic substrate
    9.
    发明授权
    Method of coating a copper film on a ceramic substrate 失效
    在陶瓷基板上涂布铜膜的方法

    公开(公告)号：US5925403A

    公开(公告)日：1999-07-20

    申请号：US811011

    申请日：1997-03-04

    申请人： Izuru Yoshizawa ,  Hiroaki Takahashi ,  Tomoyuki Kawahara

    发明人： Izuru Yoshizawa ,  Hiroaki Takahashi ,  Tomoyuki Kawahara

    IPC分类号： C04B41/51 ,  C04B41/88 ,  C23C18/18 ,  C23C18/28 ,  C23C26/00 ,  H05K3/38 ,  B05D5/12

    CPC分类号： H05K3/38 ,  C04B41/5127 ,  C04B41/88 ,  C23C18/1851 ,  C23C18/1865 ,  C23C18/1882 ,  C23C18/1889 ,  C23C18/28 ,  C23C26/00

    摘要： An undercoat containing copper and bismuth and/or vanadium is formed on a ceramic substrate such as Al.sub.2 O.sub.3. When the undercoat contains copper and bismuth, the ceramic substrate having the undercoat is heated at a temperature between 600.degree. C. and 1100.degree. C. in an oxidative atmosphere to obtain a fired undercoat on the ceramic substrate. The fired undercoat is formed with copper oxide particles and a binder phase containing bismuth and copper for bonding between adjacent copper oxide particles. A bismuth content in the fired undercoat is determined within a range of 10 to 90 wt %. When the undercoat contains copper and vanadium, the ceramic substrate having the undercoat is heated at a temperature between 450.degree. C. and 1100.degree. C. in the oxidative atmosphere to obtain a fired undercoat which is formed with copper oxide particles and a binder phase containing vanadium and copper. A vanadium content in the fired undercoat is determined within a range of 3 to 63 wt %. The copper oxide particles are reduced by the use of a reducing solution to obtain a reduced undercoat having metallic copper particles. The copper particles are partially exposed on a top surface of the reduced undercoat. Copper is coated on the top surface of the reduced undercoat to obtain a copper film on the ceramic substrate.

    摘要翻译： 在诸如Al 2 O 3的陶瓷衬底上形成含有铜和铋和/或钒的底涂层。 当底漆含有铜和铋时，将具有底涂层的陶瓷基材在氧化气氛中在600℃至1100℃的温度下加热，以在陶瓷基材上得到烧制的底涂层。 烧制的底涂层由氧化铜颗粒和含有铋和铜的粘结相形成，用于在相邻的氧化铜颗粒之间进行粘合。 烧成的底涂层中的铋含量在10〜90重量％的范围内。 当底涂层含有铜和钒时，将具有底涂层的陶瓷基材在氧化气氛中在450℃至1100℃的温度下加热，得到由氧化铜颗粒和粘结相形成的烧制底涂层， 钒和铜。 烧成的底涂层中的钒含量在3〜63重量％的范围内。 通过使用还原溶液还原氧化铜颗粒，得到具有金属铜颗粒的还原底涂层。 铜颗粒部分暴露在还原底涂层的顶表面上。 在还原的底涂层的顶表面上涂覆铜，以在陶瓷基片上获得铜膜。