公开(公告)号：US06296553B1

公开(公告)日：2001-10-02

申请号：US09052019

申请日：1998-03-31

申请人： Kenichiro Nishi ,  Mitsuru Nukui ,  Shirou Murai ,  Kazuo Nakajima ,  Toyotaka Wada

发明人： Kenichiro Nishi ,  Mitsuru Nukui ,  Shirou Murai ,  Kazuo Nakajima ,  Toyotaka Wada

IPC分类号： B24B700

CPC分类号： B24B37/04 ,  B24B41/06 ,  B24B47/22

摘要： A workpiece receiving hole 60a for fittingly receiving a workpiece 17 is formed in the center of a rotary disk 60 which is thinner than the workpiece 17. A workpiece drive section 60b which engages a notch 17a formed for the purpose of orienting the workpiece 17 relative to crystal orientation is formed along the brim of the hole 60a. A gear 59 is rotated by a gear 62 of a motor 61, thereby rotating the rotary disk 60 and imparting torque to the workpiece 17. Accordingly, both surfaces of the workpiece are ground by means of a double disc surface grinder.

摘要翻译： 在与工件17相比更薄的旋转盘60的中心形成有用于配合接收工件17的工件接收孔60a。工件驱动部分60b，其与形成为用于使工件17相对于 沿着孔60a的边缘形成晶体取向。 齿轮59由马达61的齿轮62旋转，从而旋转旋转盘60并赋予工件17扭矩。因此，通过双盘表面研磨机研磨工件的两个表面。

公开(公告)号：US6113489A

公开(公告)日：2000-09-05

申请号：US281966

申请日：1999-03-31

申请人： Kenichiro Nishi ,  Tetsuo Okuyama ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada ,  Tomio Nakagawa

发明人： Kenichiro Nishi ,  Tetsuo Okuyama ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada ,  Tomio Nakagawa

IPC分类号： B24B27/06 ,  B24B7/17 ,  B24B7/22 ,  B24B37/00 ,  B28D5/00 ,  B28D5/02 ,  B28D5/04 ,  B24B2/19

CPC分类号： B28D5/0082 ,  B24B1/00 ,  B24B41/067 ,  B24B53/02 ,  B24B7/17 ,  B24B7/228

摘要： A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said slicing apparatus 4 are integrally superposed one on top another.

摘要翻译： 一种切割锭的方法，其中将切割工件3设置在切片装置4上，其中在圆锭1的侧表面的整个长度上延伸的保持构件2结合到锭1的侧表面 并且预切割工件3在其纵向方向上被分成多个部件，以便获得待研磨的圆盘状工件5，其特征在于，使用保持部件2，其中保持层7直接 通过具有足以在随后的研磨过程中由于研磨装置6接受旋转力的粘合强度的第一粘合剂粘合到锭块1的侧表面上的中间层8，其结合到所述保持层7中 在固定状态下，粘接强度劣于第一粘接剂的粘接强度比第二粘接剂重叠的方式，连接在所述中间层8上的支撑层11与支撑体 所述切片装置4的固定部分10一体地叠置在另一个上。

公开(公告)号：US06302769B1

公开(公告)日：2001-10-16

申请号：US09290176

申请日：1999-04-13

申请人： Kenichiro Nishi ,  Shirou Murai

发明人： Kenichiro Nishi ,  Shirou Murai

IPC分类号： B24B100

CPC分类号： H01L21/02021 ,  B24B9/065 ,  B24D5/02

摘要： In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3. Especially, the present wafer chamfering method comprises two steps: that is, a circumferential portion grinding step in which the grindstone is supported such that it stands upright or at right angles to the circumferential portion 6 of the wafer 3 at their respective mutual contact points and only the flat portion of the grindstone 8 is contacted with the mutual contact points to thereby chamfer the peripheral edge portion of the wafer 3; and, a notch portion grinding step in which the grindstone is supported such that it is inclined with respect to the diameter direction of the notch portion of the wafer 3 by an angle of about 45° in the circumferential direction of the wafer 3 and the edge portions 5 or both of the edge portions 5 and flat portion 2 are used to chamfer the notch portion 4 of the wafer 3.

摘要翻译： 在晶片倒角方法中，使用盘状磨石8，其包括：作为研磨面1的周缘部; 在研磨面1的宽度方向的中央部形成的平坦部， 以及分别形成在平坦部2的宽度方向的两侧的两个边缘部5，并且形成为要倒角的圆盘状晶片3的切口部4的谷部的形状。 在操作中，在晶片倒角方法中，在旋转上述磨石8时，磨石8沿晶片3的厚度方向旋转，从而使晶片3倒角。特别地，本晶片倒角法包括两个步骤： 圆周部分磨削步骤，其中所述磨石被支撑成使得其在它们各自的相互接触点处直立或与所述晶片3的周向部分6成直角，并且所述磨石8的平坦部分仅与所述相互接触 从而使晶片3的周边部分倒角; 以及切屑部研磨工序，其中所述磨石被支撑成使得其相对于所述晶片3的所述切口部分的直径方向在所述晶片3的圆周方向上以约45°的角度倾斜，并且所述边缘 边缘部分5和平坦部分2的部分5或两者用于倒角晶片3的切口部分4。

公开(公告)号：US06220931B1

公开(公告)日：2001-04-24

申请号：US09299151

申请日：1999-04-26

申请人： Kenichiro Nishi ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada

发明人： Kenichiro Nishi ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada

IPC分类号： B24B100

CPC分类号： B24B7/228 ,  B24B41/04 ,  B24B49/16

摘要： A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

摘要翻译： 砂轮28的主轴23通过静压推力轴承26和27由用于砂轮的台架22旋转地承受。压力调节器38，其用于调节必须供给至相对的供给口26a和27a中的至少一个的压力 在静压推力轴承26,27中，在主轴23的轴线方向上相互配置。 压力调节器38具有用于改变用于阻塞流体的通道和阻塞通道的长度的改变构件。

公开(公告)号：US6036585A

公开(公告)日：2000-03-14

申请号：US48273

申请日：1998-03-26

申请人： Kenichiro Nishi ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada

发明人： Kenichiro Nishi ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada

IPC分类号： B24B7/22 ,  B24B41/04 ,  B24B49/16 ,  B24B7/17

CPC分类号： B24B7/228 ,  B24B41/04 ,  B24B49/16

摘要： A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

摘要翻译： 砂轮28的主轴23通过静压推力轴承26和27由用于砂轮的台架22旋转地承受。压力调节器38，其用于调节必须供给至相对的供给口26a和27a中的至少一个的压力 在静压推力轴承26,27中，在主轴23的轴线方向上相互配置。 压力调节器38具有用于改变用于阻塞流体的通道和阻塞通道的长度的改变构件。

公开(公告)号：US20120020755A1

公开(公告)日：2012-01-26

申请号：US13258767

申请日：2010-03-12

申请人： Koji Hiroshima ,  Muneyoshi Horii ,  Shirou Murai

发明人： Koji Hiroshima ,  Muneyoshi Horii ,  Shirou Murai

IPC分类号： B23C1/02 ,  B23Q1/01

CPC分类号： B23Q1/015 ,  B23Q1/626 ,  Y10T409/305824 ,  Y10T409/307112 ,  Y10T409/308288 ,  Y10T409/30868 ,  Y10T409/309576 ,  Y10T483/1795

摘要： A horizontal machine tool (1) includes a base frame (10) where workpiece support faces (11c) for supporting a workpiece are formed at front portions; an X-axis saddle (20) attached to a back-face portion (12b) of the base frame (10) through an X-axis movement mechanism (50) universally slidably in a left-right direction; a Y-axis saddle (30) attached to the X-axis saddle (20) through a Y-axis movement mechanism (60) universally slidably in an up-down direction; and a spindle device (40) attached to the Y-axis saddle (30) through a Z-axis movement mechanism (70) universally slidably in a front-rear direction. According to this configuration, it is possible to make a whole of the horizontal machine tool a small size and lightweight and to enhance machining accuracy of the workpiece.

摘要翻译： 水平机床（1）包括：底架（10），其前部形成有用于支撑工件的工件支撑面（11c） X轴鞍座（20），其通过X轴移动机构（50）在左右方向上可滑动地附接到所述基座（10）的背面部分（12b） Y轴鞍座（30），其通过Y轴移动机构（60）在X轴鞍座（20）上沿上下方向可滑动地附接; 以及主轴装置（40），其通过Z轴运动机构（70）在前后方向上可滑动地附接到Y轴鞍座（30）。 根据该结构，能够使整个水平机床的尺寸小，重量轻，提高工件的加工精度。

公开(公告)号：US06332834B1

公开(公告)日：2001-12-25

申请号：US09538968

申请日：2000-03-31

申请人： Mitsuru Nukui ,  Shirou Murai ,  Michihiro Takata ,  Tetsuo Okuyama ,  Muneaki Kaga ,  Toyotaka Wada

发明人： Mitsuru Nukui ,  Shirou Murai ,  Michihiro Takata ,  Tetsuo Okuyama ,  Muneaki Kaga ,  Toyotaka Wada

IPC分类号： B24B100

CPC分类号： B24B9/065 ,  B24B41/005 ,  B24B47/20

摘要： A workpiece 23 formed of a circular thin plate is rotated about its center as an axis L1. Each of disk-shaped rotating grinding wheels 27 and 28, while being rotated about an axis L3 extending in a direction substantially parallel to the plane of the workpiece 23 and perpendicular to the radial direction of the workpiece 23, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece 23 along an outer peripheral edge portion 23a of the workpiece 23. Consequently, the outer peripheral edge portion 23a of the workpiece 23 is ground by an outer peripheral surface of each of the rotating grinding wheels 27 and 28. In this case, it is preferred that two grinding wheels 27 and 28 for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

摘要翻译： 由圆形薄板形成的工件23作为轴线L1绕其中心旋转。 每个圆盘状的旋转磨轮27和28在绕基本上平行于工件23的平面并垂直于工件23的径向方向的轴线L3上旋转的同时进行相对进给运动 沿着工件23的外周边缘部23a在工件23的正面和反面两侧。因此，工件23的外周边缘部23a被每个旋转砂轮27的外周面研磨 在这种情况下，优选的是用于粗磨和精磨的两个磨轮27和28作为盘形旋转砂轮，并且由同一台进行粗磨和精磨。

公开(公告)号：US06722956B2

公开(公告)日：2004-04-20

申请号：US09748385

申请日：2000-12-27

申请人： Tetsuo Okuyama ,  Shirou Murai ,  Kunihiro Saita ,  Toyotaka Wada ,  Tomoyuki Kawatsu

发明人： Tetsuo Okuyama ,  Shirou Murai ,  Kunihiro Saita ,  Toyotaka Wada ,  Tomoyuki Kawatsu

IPC分类号： B24B100

CPC分类号： B24B41/047 ,  B24B7/228 ,  B24B45/00 ,  Y10T483/10 ,  Y10T483/17 ,  Y10T483/1736 ,  Y10T483/174

摘要： A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), there can be mounted not only the rough grindstone member but also a cover member (36). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member (20), the cover member (36) is mounted onto the tool mounting portion (25) to thereby prevent the tool mounting portion (25) from being soiled.

摘要翻译： 精加工磨石构件（20）通过螺栓固定在心轴（10）上。 在主轴（10）中形成有可以安装粗磨石构件的工具安装部（25）。 在工具安装部（25）中，不仅可以安装粗磨石构件，还可以安装盖构件（36）。 在使用粗砂轮构件粗略磨削硅晶片之后，当使用精加工磨石构件（20）对硅晶片进行精磨时，将盖构件（36）安装到工具安装部（25）上，从而防止工具安装 部分（25）被弄脏。

公开(公告)号：US06439969B1

公开(公告)日：2002-08-27

申请号：US09522910

申请日：2000-03-10

申请人： Kikuo Koma ,  Shirou Murai ,  Muneaki Kaga ,  Michihiro Takata

发明人： Kikuo Koma ,  Shirou Murai ,  Muneaki Kaga ,  Michihiro Takata

IPC分类号： B24B100

CPC分类号： H01L23/544 ,  H01L2223/54493 ,  H01L2924/0002 ,  H01L2924/00

摘要： Chamfering C1 is performed along the edge of a notch groove by the center 01 of a grindstone 5. Change to grindstone center 02 is performed to perform chamfering C2 along the edge of the notch groove. Similarly, chamfering C3, C4 and C5 are formed. A grindstone having a large diameter can be employed. Only control of the diameter of the grindstone is required to maintain the shape. Satisfactory surface roughness can be realized. It is possible to improve surface roughness of a notch groove of a wafer and realize high efficiency.

摘要翻译： 通过磨石5的中心01沿着切口槽的边缘进行倒角C1。进行磨石中心02的切换，沿着切口槽的边缘进行倒角C2。 类似地，形成倒角C3，C4和C5。 可以使用具有大直径的磨石。 只需要控制砂轮的直径来保持砂轮的形状。 可以实现令人满意的表面粗糙度。 可以提高晶片的切口槽的表面粗糙度，实现高效率。