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22 条记录 (耗时 0.034 秒)

    Method and apparatus for grinding a workpiece
    1.
    发明授权
    Method and apparatus for grinding a workpiece 失效
    用于研磨工件的方法和设备

    公开(公告)号：US06332834B1

    公开(公告)日：2001-12-25

    申请号：US09538968

    申请日：2000-03-31

    申请人： Mitsuru Nukui ,  Shirou Murai ,  Michihiro Takata ,  Tetsuo Okuyama ,  Muneaki Kaga ,  Toyotaka Wada

    发明人： Mitsuru Nukui ,  Shirou Murai ,  Michihiro Takata ,  Tetsuo Okuyama ,  Muneaki Kaga ,  Toyotaka Wada

    IPC分类号： B24B100

    CPC分类号： B24B9/065 ,  B24B41/005 ,  B24B47/20

    摘要： A workpiece 23 formed of a circular thin plate is rotated about its center as an axis L1. Each of disk-shaped rotating grinding wheels 27 and 28, while being rotated about an axis L3 extending in a direction substantially parallel to the plane of the workpiece 23 and perpendicular to the radial direction of the workpiece 23, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece 23 along an outer peripheral edge portion 23a of the workpiece 23. Consequently, the outer peripheral edge portion 23a of the workpiece 23 is ground by an outer peripheral surface of each of the rotating grinding wheels 27 and 28. In this case, it is preferred that two grinding wheels 27 and 28 for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

    摘要翻译： 由圆形薄板形成的工件23作为轴线L1绕其中心旋转。 每个圆盘状的旋转磨轮27和28在绕基本上平行于工件23的平面并垂直于工件23的径向方向的轴线L3上旋转的同时进行相对进给运动 沿着工件23的外周边缘部23a在工件23的正面和反面两侧。因此，工件23的外周边缘部23a被每个旋转砂轮27的外周面研磨 在这种情况下，优选的是用于粗磨和精磨的两个磨轮27和28作为盘形旋转砂轮，并且由同一台进行粗磨和精磨。

    Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus
    2.
    发明授权
    Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus 失效
    锭式切片方法，锭制造方法和切片锭磨机

    公开(公告)号：US6113489A

    公开(公告)日：2000-09-05

    申请号：US281966

    申请日：1999-03-31

    申请人： Kenichiro Nishi ,  Tetsuo Okuyama ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada ,  Tomio Nakagawa

    发明人： Kenichiro Nishi ,  Tetsuo Okuyama ,  Mitsuru Nukui ,  Kazuo Nakajima ,  Shirou Murai ,  Toyotaka Wada ,  Tomio Nakagawa

    IPC分类号： B24B27/06 ,  B24B7/17 ,  B24B7/22 ,  B24B37/00 ,  B28D5/00 ,  B28D5/02 ,  B28D5/04 ,  B24B2/19

    CPC分类号： B28D5/0082 ,  B24B1/00 ,  B24B41/067 ,  B24B53/02 ,  B24B7/17 ,  B24B7/228

    摘要： A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said slicing apparatus 4 are integrally superposed one on top another.

    摘要翻译： 一种切割锭的方法，其中将切割工件3设置在切片装置4上，其中在圆锭1的侧表面的整个长度上延伸的保持构件2结合到锭1的侧表面 并且预切割工件3在其纵向方向上被分成多个部件，以便获得待研磨的圆盘状工件5，其特征在于，使用保持部件2，其中保持层7直接 通过具有足以在随后的研磨过程中由于研磨装置6接受旋转力的粘合强度的第一粘合剂粘合到锭块1的侧表面上的中间层8，其结合到所述保持层7中 在固定状态下，粘接强度劣于第一粘接剂的粘接强度比第二粘接剂重叠的方式，连接在所述中间层8上的支撑层11与支撑体 所述切片装置4的固定部分10一体地叠置在另一个上。

    Working apparatus
    3.
    发明授权
    Working apparatus 失效
    工作装置

    公开(公告)号：US06722956B2

    公开(公告)日：2004-04-20

    申请号：US09748385

    申请日：2000-12-27

    申请人： Tetsuo Okuyama ,  Shirou Murai ,  Kunihiro Saita ,  Toyotaka Wada ,  Tomoyuki Kawatsu

    发明人： Tetsuo Okuyama ,  Shirou Murai ,  Kunihiro Saita ,  Toyotaka Wada ,  Tomoyuki Kawatsu

    IPC分类号： B24B100

    CPC分类号： B24B41/047 ,  B24B7/228 ,  B24B45/00 ,  Y10T483/10 ,  Y10T483/17 ,  Y10T483/1736 ,  Y10T483/174

    摘要： A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), there can be mounted not only the rough grindstone member but also a cover member (36). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member (20), the cover member (36) is mounted onto the tool mounting portion (25) to thereby prevent the tool mounting portion (25) from being soiled.

    摘要翻译： 精加工磨石构件（20）通过螺栓固定在心轴（10）上。 在主轴（10）中形成有可以安装粗磨石构件的工具安装部（25）。 在工具安装部（25）中，不仅可以安装粗磨石构件，还可以安装盖构件（36）。 在使用粗砂轮构件粗略磨削硅晶片之后，当使用精加工磨石构件（20）对硅晶片进行精磨时，将盖构件（36）安装到工具安装部（25）上，从而防止工具安装 部分（25）被弄脏。

    Flip-chip resin-encapsulated semiconductor device
    5.
    发明授权
    Flip-chip resin-encapsulated semiconductor device 失效
    倒装芯片树脂封装的半导体器件

    公开(公告)号：US06228688B1

    公开(公告)日：2001-05-08

    申请号：US09017228

    申请日：1998-02-02

    申请人： Hideo Ohta ,  Tetsuo Okuyama

    发明人： Hideo Ohta ,  Tetsuo Okuyama

    IPC分类号： H01L2148

    CPC分类号： H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83104 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/00

    摘要： A method of manufacturing a resin-encapsulated semiconductor device, which includes the steps of, mounting a semiconductor element facedown on a substrate provided with a wiring circuit with a main surface of the semiconductor element being faced to the substrate, positioning the substrate bearing the semiconductor element in a mold together with a sealing resin, and applying a pressure onto the sealing resin to move the sealing resin to a space between the semiconductor element and the substrate, to the sides of the semiconductor element and to the bottom surface of the semiconductor element, thereby sealing the semiconductor element with the sealing resin.

    摘要翻译： 一种制造树脂封装的半导体器件的方法，其包括以下步骤：将半导体元件面朝下安装在具有布线电路的基板上，其中半导体元件的主表面面向基板，定位承载半导体的基板 元件与密封树脂一起在模具中，并且向密封树脂施加压力以将密封树脂移动到半导体元件和基板之间的空间，到半导体元件的侧面和半导体元件的底表面 从而用密封树脂密封半导体元件。

    Decolorizable ink and printer
    6.
    发明授权
    Decolorizable ink and printer 失效
    可脱色油墨和打印机

    公开(公告)号：US5922115A

    公开(公告)日：1999-07-13

    申请号：US900708

    申请日：1997-07-25

    申请人： Kenji Sano ,  Katsuyuki Naito ,  Satoshi Takayama ,  Sawako Fujioka ,  Tetsuo Okuyama

    发明人： Kenji Sano ,  Katsuyuki Naito ,  Satoshi Takayama ,  Sawako Fujioka ,  Tetsuo Okuyama

    IPC分类号： C09D11/00

    CPC分类号： C09D11/50

    摘要： Decolorizable ink consisting of an ink composition dispersed in a solvent, the ink composition comprising a color former, a developer and a decolorizer, wherein the color former and developer are in a colored state by interaction between them and the decolorizer has a property to dissolve preferentially the developer when the ink composition is melted.

    摘要翻译： 由分散在溶剂中的油墨组合物组成的可脱色油墨，该油墨组合物包含成色剂，显影剂和消色剂，其中着色剂和显影剂通过它们与消色剂之间的相互作用处于着色状态，具有优先溶解的性质 当油墨组合物熔化时的显影剂。

    Decolorizable ink and printer
    8.
    发明授权
    Decolorizable ink and printer 失效
    可脱色油墨和打印机

    公开(公告)号：US6017386A

    公开(公告)日：2000-01-25

    申请号：US235476

    申请日：1999-01-22

    申请人： Kenji Sano ,  Katsuyuki Naito ,  Satoshi Takayama ,  Sawako Fujioka ,  Tetsuo Okuyama ,  Shigeru Machida

    发明人： Kenji Sano ,  Katsuyuki Naito ,  Satoshi Takayama ,  Sawako Fujioka ,  Tetsuo Okuyama ,  Shigeru Machida

    IPC分类号： C09D11/00

    CPC分类号： C09D11/50

    摘要： A decolorizable image forming material comprising a color former, a developer and a decolorizer, the decolorizer comprising a highly amorphous phase separation inhibitor and a slightly amorphous phase separation inhibitor. A cyclic sugar alcohol is used as the highly amorphous phase separation inhibitor, and a non-aromatic cyclic compound having five-membered or larger ring substituted by a hydroxyl group or a derivative of a cyclic sugar alcohol is used as the slightly amorphous phase separation inhibitor. The decolorizable image forming material can be decolored easily after image formation by a solvent and the decolored state of which can be maintained stably, thereby making it possible to reuse paper sheets.

    摘要翻译： 包含成色剂，显色剂和消色剂的脱色图像形成材料，所述消色剂包含高度无定形相分离抑制剂和微不定形相分离抑制剂。 使用环状糖醇作为高度无定形相分离抑制剂，并且使用由羟基取代的五元环或更多环的环状化合物或环状糖醇衍生物的非芳族环状化合物作为微小的无定形相分离抑制剂 。 可脱色成像材料在通过溶剂成像后可以容易地脱色，并且其脱色状态可以保持稳定，从而可以再利用纸张。