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97 条记录 (耗时 0.024 秒)

    Composite substrate and manufacturing method thereof
    2.
    发明授权
    Composite substrate and manufacturing method thereof 有权
    复合基板及其制造方法

    公开(公告)号：US08288918B2

    公开(公告)日：2012-10-16

    申请号：US12641741

    申请日：2009-12-18

    申请人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

    发明人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

    IPC分类号： H03H9/25

    CPC分类号： H03H9/0585 ,  H01L41/313 ,  H01L41/337

    摘要： A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.

    摘要翻译： 制备支撑基板和压电基板。 支撑基板的表面通过有机粘合剂层粘合到压电基板的背面而形成层压基板。 随后，将层叠基板的外周面进行研磨，使得压电基板的周面，有机粘合剂层的外周面和支撑基板的有机粘合层侧的周面与 彼此。 随后，对压电基片的表面进行抛光，以减小压电基片的厚度并进行表面的镜面抛光。

    Surface acoustic wave devices
    3.
    发明授权
    Surface acoustic wave devices 有权
    声表面波器件

    公开(公告)号：US07911111B2

    公开(公告)日：2011-03-22

    申请号：US12393437

    申请日：2009-02-26

    申请人： Kenji Suzuki ,  Takashi Yoshino

    发明人： Kenji Suzuki ,  Takashi Yoshino

    IPC分类号： H03H9/25

    CPC分类号： H03H9/02834 ,  H03H3/10 ,  H03H9/02574

    摘要： A surface acoustic wave device has a supporting substrates, a propagation substrate A made of a piezoelectric single crystal, an organic adhesive layer having a thickness of 0.1 to 1.0 μm and bonding the supporting substrate and the propagation substrate, and a surface acoustic wave filter or resonator provided on the propagation substrate. The temperature coefficient of frequency of the surface acoustic wave device can be thereby reduced.

    摘要翻译： 表面声波装置具有支撑基板，由压电单晶构成的传播基板A，厚度为0.1〜1.0μm的有机粘合层，并将支撑基板和传播基板接合，以及声表面波滤波器 设置在传播基板上的谐振器。 能够降低声表面波装置的频率的温度系数。

    COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
    复合基板及其制造方法

    公开(公告)号：US20120273117A1

    公开(公告)日：2012-11-01

    申请号：US13546200

    申请日：2012-07-11

    申请人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

    发明人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

    IPC分类号： H01L41/22

    CPC分类号： H03H9/0585 ,  H01L41/313 ,  H01L41/337

    摘要： A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.

    摘要翻译： 制备支撑基板和压电基板。 支撑基板的表面通过有机粘合剂层粘合到压电基板的背面而形成层压基板。 随后，将层叠基板的外周面进行研磨，使得压电基板的周面，有机粘合剂层的外周面和支撑基板的有机粘合层侧的周面与 彼此。 随后，对压电基片的表面进行抛光，以减小压电基片的厚度并进行表面的镜面抛光。

    SURFACE ACOUSTIC WAVE DEVICES
    5.
    发明申请
    SURFACE ACOUSTIC WAVE DEVICES 有权
    表面声波设备

    公开(公告)号：US20090256444A1

    公开(公告)日：2009-10-15

    申请号：US12393437

    申请日：2009-02-26

    申请人： Kenji Suzuki ,  Takashi Yoshino

    发明人： Kenji Suzuki ,  Takashi Yoshino

    IPC分类号： H01L41/107

    CPC分类号： H03H9/02834 ,  H03H3/10 ,  H03H9/02574

    摘要： A surface acoustic wave device has a supporting substrates, a propagation substrate 3A made of a piezoelectric single crystal, an organic adhesive layer 2 having a thickness of 0.1 to 1.0 μm and bonding the supporting substrate 1 and the propagation substrate 3A, and a surface acoustic wave filter or resonator provided on the propagation substrate. The temperature coefficient of frequency of the surface acoustic wave device can be thereby reduced.

    摘要翻译： 表面声波装置具有支撑基板，由压电单晶构成的传播基板3A，厚度为0.1〜1.0μm的有机粘合层2，并且将支撑基板1和传播基板3A接合，以及表面声学 设置在传播基板上的滤波器或谐振器。 能够降低声表面波装置的频率的温度系数。

    Composite substrate and manufacturing method thereof
    6.
    发明授权
    Composite substrate and manufacturing method thereof 有权
    复合基板及其制造方法

    公开(公告)号：US08585847B2

    公开(公告)日：2013-11-19

    申请号：US13546200

    申请日：2012-07-11

    申请人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

    发明人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

    IPC分类号： H01L41/22

    CPC分类号： H03H9/0585 ,  H01L41/313 ,  H01L41/337

    摘要： A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.

    摘要翻译： 制备支撑基板和压电基板。 支撑基板的表面通过有机粘合剂层粘合到压电基板的背面而形成层压基板。 随后，将层叠基板的外周面进行研磨，使得压电基板的周面，有机粘合剂层的外周面和支撑基板的有机粘合层侧的周面与 彼此。 随后，对压电基片的表面进行抛光，以减小压电基片的厚度并进行表面的镜面抛光。

    Surface acoustic wave devices
    8.
    发明授权
    Surface acoustic wave devices 有权
    声表面波器件

    公开(公告)号：US08115365B2

    公开(公告)日：2012-02-14

    申请号：US12614597

    申请日：2009-11-09

    申请人： Kenji Suzuki ,  Takashi Yoshino

    发明人： Kenji Suzuki ,  Takashi Yoshino

    IPC分类号： H03H9/25

    CPC分类号： H03H3/10 ,  H03H9/02574 ,  H03H9/02834

    摘要： A surface acoustic wave device has a supporting substrate, a propagation substrate made of a piezoelectric single crystal, an organic adhesive layer having a thickness of 0.1 to 1.0 μm and bonding the supporting substrate and the propagation substrate, and a surface acoustic wave filter provided on the propagation substrate.

    摘要翻译： 表面声波装置具有支撑基板，由压电单晶构成的传播基板，厚度为0.1〜1.0μm的有机粘合层，并且将支撑基板和传播基板接合，并且将声表面波滤波器设置在 传播基片。

    Data converting apparatus, method, and computer product
    9.
    发明授权
    Data converting apparatus, method, and computer product 有权
    数据转换装置，方法和计算机产品

    公开(公告)号：US08326850B2

    公开(公告)日：2012-12-04

    申请号：US12837801

    申请日：2010-07-16

    申请人： Kazuo Mineno ,  Takashi Yoshino

    发明人： Kazuo Mineno ,  Takashi Yoshino

    IPC分类号： G06F17/30

    CPC分类号： G06F17/30569 ,  G06F17/30914

    摘要： A data converting apparatus includes a storage unit that stores encoded meta-definition information, a data converting function, a conversion rule table, and a conversion rule; an input unit that receives input of data to be converted; a detecting unit that uses the encoded meta-definition information to detect metadata codes for a conversion source and a conversion destination for which the conversion rule code matches; a determining unit that determines whether the detected metadata codes match; a specifying unit that, by referring to a conversion rule and based on the determination result at the determining unit, specifies the data converting function, according to the combination of the metadata codes for the conversion source and for the conversion destination; and a converting unit that uses the specified data converting function to convert the data of the conversion source to have a property prescribed by metadata for the conversion destination.

    摘要翻译： 数据转换装置包括存储编码的元定义信息的存储单元，数据转换功能，转换规则表和转换规则; 接收要转换的数据的输入的输入单元; 检测单元，其使用编码的元定义信息来检测转换源和转换规则码匹配的转换目的地的元数据代码; 确定单元，确定检测到的元数据代码是否匹配; 指定单元，通过参照转换规则并且基于确定单元的确定结果，根据转换源和转换目的地的元数据代码的组合来指定数据转换功能; 以及转换单元，其使用指定的数据转换功能将转换源的数据转换为具有用于转换目的地的元数据规定的属性。