摘要:
A semiconductor fuse is positioned between conductors for connecting wiring lines. The fuse comprises spacers positioned on adjacent ones of the conductors, and a fuse element positioned between the spacers and connected to the wiring lines. A space between the conductors comprises a first width comprising a smallest possible photolithographic width and the fuse element has a second width smaller than the first width.
摘要:
A semiconductor fuse is positioned between conductors for connecting wiring lines. The fuse comprises spacers positioned on adjacent ones of the conductors, and a fuse element positioned between the spacers and connected to the wiring lines. A space between the conductors comprises a first width comprising a smallest possible photolithographic width and the fuse element has a second width smaller than the first width.
摘要:
A semiconductor fuse is positioned between conductors for connecting wiring lines. The fuse comprises spacers positioned on adjacent ones of the conductors, and a fuse element positioned between the spacers and connected to the wiring lines. A space between the conductors comprises a first width comprising a smallest possible photolithographic width and the fuse element has a second width smaller than the first width.
摘要:
A method for forming an interconnect wiring structure, such as a fuse structure, comprises forming an opening in an insulating layer using a phase shift mask (the opening having vertical sidewalls sloped sidewalls and horizontal surfaces), depositing a conductive material in the opening and removing the conductive material from the sloped sidewalls and horizontal surfaces, wherein the conductive material remains on the vertical sidewalls as fuse links.
摘要:
A method for forming an interconnect wiring structure, such as a fuse structure, comprises forming an opening in an insulating layer using a phase shift mask (the opening having vertical sidewalls sloped sidewalls and horizontal surfaces), depositing a conductive material in the opening and removing the conductive material from the sloped sidewalls and horizontal surfaces, wherein the conductive material remains on the vertical sidewalls as fuse links.
摘要:
A programmable/reprogrammable fuse arrangement that includes two fuse links provided each with an output port and an exclusive-or gate connected to the output port of each of the two fuses, wherein the fuse arrangement is reprogrammed by successively blowing both of the two fuse links is described. The programmable/reprogrammable fuse arrangement can be extended to a plurality of fuses and cascaded exclusive-ORs such that each fuse link provides one leg of the gate and the previous stage, the second. Thus, for N fuse links and N exclusive-ORs, the fuse arrangement thus formed can be reprogrammed a total of N times by sequentially blowing one fuse link at a time. The arrangement ceases to be reprogrammable once all the fuse links have been blown. The reprogrammable fuse arrangement is of particular importance for semiconductor memories and microprocessors, as for instance, for bringing in-line redundancy units attached to a fuse link.
摘要:
A semiconductor structure comprising a semiconductor substrate, an electrically conductive level on the substrate and a metal fuse located at the conductive level wherein the fuse comprises a self-aligned dielectric etch stop layer thereon is provided along with processes for its fabrication.
摘要:
A structure and method for making a cavity fuse over a gate conductor stack. The method includes providing a semiconductor substrate having a gate conductor stack over a shallow trench isolation region, forming oxide layers on the substrate about the gate conductor stack, etching electrical contact holes through the oxide layers to the substrate, filling the electrical contact holes with a first conductive material to establish electrical contact with the gate conductor stack, etching a pattern in an uppermost oxide layer of the oxide layers, depositing a conductive layer of a second conductive material over the oxide layers and the electrical contacts, planarizing the conductive layer whereby the conductive material remains only in the pattern, anisotropically etching the oxide layers to form at least one etching hole through the oxide layers to the shallow trench isolation region, and isotropically etching at least a portion of the oxide layers about the etching hole, whereby a cavity is formed beneath at least a portion of the conductive layer pattern, the gate conductor stack comprising a fuse.
摘要:
The stresses commonly induced in the dielectrics of integrated circuits manufactured using metal patterning methods, such as reactive ion etching (RIE) and damascene techniques, can be reduced by rounding the lower corners associated with the features which are formed as part of the integrated circuit (e.g., the interconnects) before applying the outer (i.e., passivation) layer. In connection with the formation of metal lines patterned by a metal RIE process, such corner rounding can be achieved using a two-step metal etching process including a first step which produces a vertical sidewall and a second step which tapers lower portions of the vertical sidewall or which produces a tapered spacer along the lower portions of the vertical sidewall. This results in a rounded bottom corner which improves the step coverage of the overlying dielectric, in turn eliminating the potential for cracks. For metal lines patterned by damascene, such corner rounding can be achieved using a two-step trench etching process including a first step which produces a vertical sidewall, and a second step which produces a tapered sidewall along lower portions of the vertical sidewall.
摘要:
A waste fuel incineration process and system operates at very high temperatures with excess under fire air for high efficiency combustion of waste as a fuel and for decomposition of any toxic waste. The system is applicable for clean burning volume reduction of waste and for power generation and co-generation of heat. The control elements are constructed and arranged and the control circuit programmed for maintaining the primary combustion temperature at a target temperature selected in the range of approximately 1600.degree.-1800.degree. F. (871.degree.-982.degree. C.), for turning on and increasing under fire air to bring the primary combustion chamber flue gasses up to the target temperature, for maintaining the volume rate of flow of under fire air at 150% to 250% of the stoichiometric requirement for complete combustion at normal load, for reducing and turning off under fire air in a first over-temperature range extending above the target temperature, for turning on and increasing over fire air for diluting and cooling flue gasses in a second over-temperature range extending above the first over-temperature range, and for shutting down the under fire air, over fire air and waste fuel feeding cylinder and piston at a selected absolute over-temperature. A variety of safety features are disclosed including a normally closed dump stack on the secondary tower which automatically opens for natural by pass drafting in the event of power failure or excess temperature in the pollution control device. A live "V" shaped gravel bed and ash ram permits removal of slagged gravel for renewing the surface of the hearth.