公开(公告)号：US20070018672A1

公开(公告)日：2007-01-25

申请号：US11188080

申请日：2005-07-23

申请人： Chris Jacobsen ,  Kenneth Parker ,  Myron Schneider ,  Tak Kwan

发明人： Chris Jacobsen ,  Kenneth Parker ,  Myron Schneider ,  Tak Kwan

IPC分类号： G01R31/26

CPC分类号： G01R31/2853 ,  G01R1/0433 ,  G01R31/312

摘要： A method and apparatus is presented for gaining socket testability through the use of a capacitive interposer engineered to create capacitive coupling between signal nodes of a circuit assembly that the tester has access to and nodes of the socket that would not otherwise have any coupling to a testable signal node of the socket. Generally, coupling capacitance is engineered into the interposer by trace and via routing between the signal node of the socket and a location in close proximity to the inaccessible socket node such that their proximity to each other couples them together.

公开(公告)号：US20070007978A1

公开(公告)日：2007-01-11

申请号：US11470344

申请日：2006-09-06

申请人： Kenneth Parker ,  Chris Jacobsen ,  Myron Schneider

发明人： Kenneth Parker ,  Chris Jacobsen ,  Myron Schneider

IPC分类号： G01R31/02

CPC分类号： G01R31/312 ,  G01R31/026 ,  G01R31/046

摘要： A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a non-contact connector test probe for a testing a connector of the circuit assembly. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, connector pins of a connector on the circuit assembly are capacitively coupled to a non-contact connector test probe, and an electrical characteristic is measured by a tester coupled to the non-contact connector test probe to determine continuity of electrical paths through the circuit assembly.

摘要翻译： 提出了一种能够通过电路组件测试电气路径的装置。 该装置可以包括用于测试电路组件的连接器的非接触式连接器测试探头。 提出了一种用于测试通过电路组件的电气路径的连续性的方法。 在该方法中，电路组件的一个或多个节点被激励，电路组件上的连接器的连接器引脚电容耦合到非接触式连接器测试探针，并且电特性由耦合到非接触式连接器的测试仪测量， 接触连接器测试探头，以确定通过电路组件的电气路径的连续性。

公开(公告)号：US20050242824A1

公开(公告)日：2005-11-03

申请号：US10836862

申请日：2004-04-28

申请人： Kenneth Parker ,  Chris Jacobsen ,  Myron Schneider

发明人： Kenneth Parker ,  Chris Jacobsen ,  Myron Schneider

IPC分类号： G01R27/26 ,  G01R31/02 ,  G01R31/04 ,  G01R31/312

CPC分类号： G01R31/312 ,  G01R31/026 ,  G01R31/046

摘要： A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a non-contact connector test probe for a testing a connector of the circuit assembly. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, connector pins of a connector on the circuit assembly are capacitively coupled to a non-contact connector test probe, and an electrical characteristic is measured by a tester coupled to the non-contact connector test probe to determine continuity of electrical paths through the circuit assembly.

摘要翻译： 提出了一种能够通过电路组件测试电气路径的装置。 该装置可以包括用于测试电路组件的连接器的非接触式连接器测试探头。 提出了一种用于测试通过电路组件的电气路径的连续性的方法。 在该方法中，电路组件的一个或多个节点被激励，电路组件上的连接器的连接器引脚电容耦合到非接触式连接器测试探针，并且电特性由耦合到非接触式连接器的测试仪测量， 接触连接器测试探头，以确定通过电路组件的电气路径的连续性。

公开(公告)号：US20060197539A1

公开(公告)日：2006-09-07

申请号：US11069406

申请日：2005-03-01

申请人： Myron Schneider ,  Kenneth Parker ,  Chris Jacobsen

发明人： Myron Schneider ,  Kenneth Parker ,  Chris Jacobsen

IPC分类号： G01R31/04

CPC分类号： G01R31/312

摘要： A method for testing for a defect condition on a node-under-implicit-test of an electrical device is presented. The technique according to the invention includes stimulating a first node of the electrical device that is capacitively coupled to the node-under-implicit-test with a known source signal, and capacitively sensing a signal on a second node of the electrical device that is capacitively coupled to the node-under-implicit-test. A defect condition such as a short or open can be determined from the capacitively sensed signal.

摘要翻译： 提出了一种用于测试电气设备的隐式节点下的缺陷状况的方法。 根据本发明的技术包括利用已知的源信号刺激电容耦合到隐式测量节点的电气设备的第一节点，并电容地感测电容性的电子设备的第二节点上的信号 耦合到隐式测试节点。 诸如短路或开路的缺陷状况可以从电容感测信号确定。

公开(公告)号：US20070001686A1

公开(公告)日：2007-01-04

申请号：US11170365

申请日：2005-06-29

申请人： Kenneth Parker ,  Myron Schneider

发明人： Kenneth Parker ,  Myron Schneider

IPC分类号： G01R31/28

CPC分类号： G01R31/312

摘要： A method and apparatus for detecting open defects on non-probed node under test of an electrical device using capacitive lead frame technology is presented. In accordance with the method of the invention, a probed node neighboring the non-probed node under test is stimulated with a known source signal. A sensor of a capacitive sensing probe is capacitively coupled to at least the probed node and non-probed node under test of the electrical device, and a measuring device coupled to the capacitive sensing probe measures a capacitively coupled signal present between the sensor of the probe and at least the probed and non-probed node of the electrical device. Based on the value of the capacitively sensed signal, a known expected “defect-free” capacitively sensed signal measurement and/or a known expected “open” capacitively sensed signal measurement, a determination is made of whether an open defect exists on the non-probed node under test of the electrical device.

摘要翻译： 提出了一种使用电容引线框架技术在电气设备测试下检测非探测节点上的开放缺陷的方法和装置。 根据本发明的方法，用已知的源信号来刺激与被测探测的非探测节点相邻的探测节点。 电容式感测探头的传感器电容耦合到至少被电气设备测试的探测节点和非探测节点，并且耦合到电容感测探头的测量装置测量存在于探针传感器之间的电容耦合信号 以及至少探测和未探测的电气设备的节点。 基于电容感测信号的值，已知的预期的“无缺陷”电容感测信号测量和/或已知的预期“开放”电容感测信号测量，确定在非易失性存储器 被检测的电气设备节点。

公开(公告)号：US20070001687A1

公开(公告)日：2007-01-04

申请号：US11170366

申请日：2005-06-29

申请人： Myron Schneider ,  Eddie Williamson

发明人： Myron Schneider ,  Eddie Williamson

IPC分类号： G01R27/02

CPC分类号： G01R31/312 ,  G01R31/046 ,  G01R31/275 ,  G01R31/319

摘要： Capacitive leadframe testing techniques are improved through knowledge of characteristics of semiconductor junctions specific to nodes of device under test (DUT) that are connected to nodes under test of the DUT.

公开(公告)号：US20050134286A1

公开(公告)日：2005-06-23

申请号：US10741555

申请日：2003-12-19

申请人： Myron Schneider

发明人： Myron Schneider

IPC分类号： G06F19/00

CPC分类号： G01R31/2846 ,  G01R31/2812 ,  G01R31/312

摘要： In a method for evaluating device interconnect, test data values corresponding to each of a number of interconnects of a device under test (DUT) are obtained. For a given interconnect of the DUT, one or more relationships between two or more of the test data values are evaluated to determine whether the given interconnect is acceptable. In a corresponding method for defining acceptable device interconnect, a plurality of known-good test data values are generated. The known-good test data values correspond to each of a number of interconnects for a device. For a given interconnect of the device, one or more relationships between two or more of the test data values are identified. A factor in identifying the relationships is a likelihood that one or more of the identified relationships will be impacted by the quality of the given interconnect. The relationships between test data values are quantified using the known-good test data values. The identified and quantified relationships are then used to define a function for evaluating the interconnect of a DUT.

摘要翻译： 在用于评估设备互连的方法中，获得与被测设备（DUT）的多个互连中的每一个对应的测试数据值。 对于DUT的给定互连，评估两个或更多个测试数据值之间的一个或多个关系，以确定给定互连是否可接受。 在用于定义可接受的设备互连的相应方法中，生成多个已知良好的测试数据值。 已知良好的测试数据值对应于设备的多个互连中的每一个。 对于设备的给定互连，识别两个或更多个测试数据值之间的一个或多个关系。 识别关系的一个因素是一个或多个所识别的关系将受到给定互连的质量的影响。 使用已知良好的测试数据值来量化测试数据值之间的关系。 然后，使用所识别的和量化的关系来定义用于评估DUT的互连的功能。