公开(公告)号：US20070295600A1

公开(公告)日：2007-12-27

申请号：US11851552

申请日：2007-09-07

申请人： Kyle Hanson ,  Kert Dolechek

发明人： Kyle Hanson ,  Kert Dolechek

IPC分类号： C25D17/00 ,  F26B19/00

CPC分类号： H01L21/6723 ,  B01D61/425 ,  C25D17/00 ,  H01L21/67005 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/68707

摘要： A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing liquid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing liquid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing liquid can flow between the first and second flow systems, and the processing component can impart a property to the processing liquid for processing a surface on a microfeature workpiece having submicron microfeatures.

摘要翻译： 一种湿化学处理室，包括固定单元，可释放地联接到固定单元的可拆卸单元，接触固定单元和可拆卸单元的密封件，以及设置在固定单元和/或可拆卸单元中的处理部件。 固定单元可以具有构造成引导处理液体通过固定单元的第一流动系统和用于将固定单元固定地附接到集成处理工具的平台或甲板的安装夹具。 可拆卸单元可以包括构造成将处理液体引导到和/或从固定单元的第一流动系统引导的第二流动系统。 密封件具有孔口，处理液体可以通过该孔口在第一和第二流动系统之间流动，并且处理部件可以赋予处理液体特性以处理具有亚微米特征的微特征工件的表面。

公开(公告)号：US20070026772A1

公开(公告)日：2007-02-01

申请号：US11191385

申请日：2005-07-28

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B24B47/00

CPC分类号： B24B7/228 ,  B24B41/068 ,  H01L21/67126 ,  H01L21/6838

摘要： The present invention provides a chuck for receiving and supporting a semiconductor workpiece for processing. The chuck includes a body for supporting the workpiece. The body is porous or has a plurality of openings, apertures or channels. A compressible corrosion resistant member is disposed around the outer periphery of the supporting body. The chuck includes a means for evacuating air from the pores or plurality of openings, apertures or channels in the body to create a vacuum. In operation, a workpiece is placed onto the supporting body. The device side of the workpiece is preferably placed on the compressible corrosion resistant member. Upon evacuating the air (or other gas) from the pores or openings in the supporting body, a vacuum is created, drawing the workpiece toward the supporting body. A seal is created and maintained between the device side of the workpiece and the compressible corrosion resistant member. Consequently, the entire backside of the workpiece is exposed for processing while at the same time the device side of the workpiece is protected from any potentially damaging process fluids. By exposing the backside of the workpiece to a chemical etchant, semiconductor workpieces can be thinned to a desired thickness.

摘要翻译： 本发明提供一种用于接收和支撑用于处理的半导体工件的卡盘。 卡盘包括用于支撑工件的主体。 身体是多孔的或具有多个开口，孔或通道。 可压缩耐腐蚀构件设置在支撑体的外周周围。 卡盘包括用于从空气或多个开口，身体中的孔或通道排出空气以产生真空的装置。 在操作中，将工件放置在支撑体上。 工件的装置侧优选地放置在可压缩耐腐蚀构件上。 在将空气（或其他气体）从支撑体中的孔或开口抽出时，产生真空，将工件拉向支撑体。 在工件的装置侧和可压缩耐腐蚀构件之间形成并保持密封。 因此，工件的整个背面被暴露用于加工，同时工件的装置侧被保护以免任何潜在的破坏性的工艺流体。 通过将工件的背面暴露于化学蚀刻剂，半导体工件可以被薄化到所需的厚度。

公开(公告)号：US20060203418A1

公开(公告)日：2006-09-14

申请号：US11420512

申请日：2006-05-26

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： H01L21/683

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供了用于处理晶片的系统和装置。 新的系统和设备允许生产更薄的晶片，同时保持坚固。 结果，由本方法生产的晶片不易破裂。 独特的系统还提供了改进的处理薄化晶片的结构，并减少了处理步骤的数量。 这导致产量提高和工艺效率提高。

公开(公告)号：US20060040467A1

公开(公告)日：2006-02-23

申请号：US10923131

申请日：2004-08-20

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

公开(公告)号：US20050224103A1

公开(公告)日：2005-10-13

申请号：US11097950

申请日：2005-04-02

申请人： Kert Dolechek ,  Ronald Breese ,  Gordon Nelson

发明人： Kert Dolechek ,  Ronald Breese ,  Gordon Nelson

IPC分类号： B08B3/02 ,  B08B9/08 ,  H01L21/00

CPC分类号： H01L21/67051 ,  B08B9/0861

摘要： A system for centrifugally cleaning containers used for holding wafers can easily be loaded and unloaded. A rotor in the system has a first plate above a second plate, and box holding positions between the plates. Spray nozzles are positioned to spray a cleaning liquid towards the rotor. A gate is moveable vertically between an up position, for loading and unloading a box into the box holding position, and a down position, for securing a box in place during centrifugal cleaning. Door holding positions are also provided between the plates, for holding container doors.

摘要翻译： 用于离心清洁用于保持晶片的容器的系统可以容易地被装载和卸载。 系统中的转子具有在第二板上方的第一板和板之间的箱保持位置。 喷嘴被定位成朝向转子喷射清洁液体。 门可以在向上位置之间垂直移动，用于将盒装入和卸载到盒保持位置中，以及向下位置，用于在离心清洁期间将盒固定在适当位置。 在板之间还设有门保持位置，用于容纳门。

公开(公告)号：US06732945B2

公开(公告)日：2004-05-11

申请号：US10205776

申请日：2002-07-26

申请人： Kert Dolechek

发明人： Kert Dolechek

IPC分类号： A01G2500

CPC分类号： H01L21/6708 ,  H01L21/67075 ,  H01L21/67253 ,  Y10S134/902

摘要： A semiconductor processing system has a liquid chemical metering and delivery system including a process tank and a metering vessel. Fluid level detectors detect the fluid level in the process tank and metering vessel. A two stage fill valve fills the metering vessel from bottom to top. A dispense valve dispenses the metered contents of the vessel into a process tank via gravity, to form a chemical solution in the process tank, with high mixing accuracy. The volumes of the metering vessel and process tank and the inflow and outflow rates are set to provide 100% up time to a process chamber which uses the chemical solution to process semiconductor wafers or other flat media.

摘要翻译： 半导体处理系统具有包括处理罐和计量容器的液体化学计量和输送系统。 液位检测器检测工艺罐和计量容器中的液位。 两级填充阀从底部到顶部填充计量容器。 分配阀通过重力将容器的计量内容物分配到处理罐中，以高混合精度在处理罐中形成化学溶液。 计量容器和处理罐的体积以及流入和流出速率被设定为使用化学溶液处理半导体晶片或其它平坦介质的处理室提供100％的上升时间。

公开(公告)号：US06446644B1

公开(公告)日：2002-09-10

申请号：US09609879

申请日：2000-07-05

申请人： Kert Dolechek

发明人： Kert Dolechek

IPC分类号： B08B300

CPC分类号： H01L21/6708 ,  H01L21/67075 ,  H01L21/67253 ,  Y10S134/902

摘要： A semiconductor processing system has a liquid chemical metering and delivery system including a process tank and a metering vessel. Fluid level detectors detect the fluid level in the process tank and metering vessel. A two stage fill valve fills the metering vessel from bottom to top. A dispense valve dispenses the metered contents of the vessel into a process tank via gravity, to form a chemical solution in the process tank, with high mixing accuracy. The volumes of the metering vessel and process tank and the inflow and outflow rates are set to provide 100% up time to a process chamber which uses the chemical solution to process semiconductor wafers or other flat media.

摘要翻译： 半导体处理系统具有包括处理罐和计量容器的液体化学计量和输送系统。 液位检测器检测工艺罐和计量容器中的液位。 两级填充阀从底部到顶部填充计量容器。 分配阀通过重力将容器的计量内容物分配到处理罐中，以高混合精度在处理罐中形成化学溶液。 计量容器和处理罐的体积以及流入和流出速率被设定为使用化学溶液处理半导体晶片或其它平坦介质的处理室提供100％的上升时间。

公开(公告)号：US20080063853A1

公开(公告)日：2008-03-13

申请号：US11977909

申请日：2007-10-26

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B32B27/32

CPC分类号： H01L21/6835 ,  H01L2924/3025

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

公开(公告)号：US20060220329A1

公开(公告)日：2006-10-05

申请号：US11423582

申请日：2006-06-12

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B23B31/00

CPC分类号： H01L21/6835 ,  H01L2221/6834 ,  Y10T279/35

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US20060046499A1

公开(公告)日：2006-03-02

申请号：US10923436

申请日：2004-08-20

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： H01L21/302

CPC分类号： H01L21/6835 ,  H01L2221/6834 ,  Y10T279/35

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。