-
1.Polymer Composition for Preparing Electronic Devices by Microcontact Printing Processes and Products Prepared by the Processes 审中-公开
标题翻译: 用于通过微孔印刷工艺制备电子器件的聚合物组合物和由工艺制备的产品公开(公告)号:US20080230773A1
公开(公告)日:2008-09-25
申请号:US12052329
申请日:2008-03-20
申请人: Kimberly DICKEY , Brian T. Mayers , Sandip Agarwal , Jeffrey Carbeck , David Christopher Coffey
发明人: Kimberly DICKEY , Brian T. Mayers , Sandip Agarwal , Jeffrey Carbeck , David Christopher Coffey
CPC分类号: G03F7/0002 , B41M1/04 , B41M3/006 , B82Y10/00 , B82Y40/00 , H01L51/0004 , H01L51/0022 , Y02E10/549
摘要: The present invention is directed to methods for patterning substrates using contact printing processes and inks comprising an organic semiconductive or semiconductive polymer, inks for use with the processes, and products formed by the processes.
摘要翻译: 本发明涉及使用接触印刷方法和包含有机半导体或半导体聚合物的油墨图案化基板的方法,用于该方法的油墨以及由该方法形成的产品。
-
2.Stencils With Removable Backings for Forming Micron-Sized Features on Surfaces and Methods of Making and Using the Same 审中-公开
标题翻译: 用于在表面上形成微米尺寸特征的可拆卸背衬的模具及其制造和使用方法公开(公告)号:US20090197054A1
公开(公告)日:2009-08-06
申请号:US12237754
申请日:2008-09-25
申请人: Karan CHAUHAN , Joseph M. MCLELLAN , Sandip Agarwal , Brian T. MAYERS , Jeffrey Carbeck , Ralf Kugler , Monika Kursawe
发明人: Karan CHAUHAN , Joseph M. MCLELLAN , Sandip Agarwal , Brian T. MAYERS , Jeffrey Carbeck , Ralf Kugler , Monika Kursawe
CPC分类号: B41M3/00 , B41C1/14 , B41M3/003 , H01L21/4867 , H05K3/1225 , H05K3/143 , H05K2201/0133 , Y10T428/24802
摘要: The present invention is directed to methods for patterning substrates using elastomeric stencils having removable backings and methods of preparing the stencils.
摘要翻译: 本发明涉及使用具有可拆卸背衬的弹性模板和制备模板的方法来图案化衬底的方法。
-
公开(公告)号:US08608972B2
公开(公告)日:2013-12-17
申请号:US12483128
申请日:2009-06-11
申请人: Brian T. Mayers , Jeffrey Carbeck , Wajeeh Saadi , George M. Whitesides , Ralf Kügler , Monika Kursawe , Johannes Canisius
发明人: Brian T. Mayers , Jeffrey Carbeck , Wajeeh Saadi , George M. Whitesides , Ralf Kügler , Monika Kursawe , Johannes Canisius
IPC分类号: C03C25/68
CPC分类号: G03F7/0002 , B82Y10/00 , B82Y20/00 , B82Y40/00
摘要: The present invention is directed to methods for patterning surfaces using contact printing and pastes, and products formed therefrom.
摘要翻译: 本发明涉及使用接触印刷和糊剂以及由其形成的产品来图案化表面的方法。
-
公开(公告)号:US20080152835A1
公开(公告)日:2008-06-26
申请号:US11950703
申请日:2007-12-05
申请人: Brian T. Mayers , Jeffrey Carbeck , Wajeeh Saadi , George M. Whitesides , Ralf Kugler , Monika Kursawe , Johannes Canisius
发明人: Brian T. Mayers , Jeffrey Carbeck , Wajeeh Saadi , George M. Whitesides , Ralf Kugler , Monika Kursawe , Johannes Canisius
CPC分类号: G03F7/0002 , B82Y10/00 , B82Y40/00
摘要: The present invention is directed to methods for patterning surfaces using contact printing and pastes, pastes for use with the processes, and products formed therefrom.
摘要翻译: 本发明涉及使用接触印刷和糊剂,用于该方法的浆料以及由其形成的产品来图案化表面的方法。
-
5.Edge-Emitting Light-Emitting Diode Arrays and Methods of Making and Using the Same 审中-公开
标题翻译: 边发光二极管阵列及其制作和使用方法公开(公告)号:US20080149948A1
公开(公告)日:2008-06-26
申请号:US11950708
申请日:2007-12-05
IPC分类号: H01L33/00
摘要: The present invention is directed to edge-emitting light-emitting diode arrays, a process to prepare the edge-emitting light-emitting diode arrays, and process products prepared by the process.
摘要翻译: 本发明涉及边缘发光发光二极管阵列,制备边缘发光二极管阵列的方法以及通过该方法制备的处理产物。
-
公开(公告)号:US20100163526A1
公开(公告)日:2010-07-01
申请号:US12493757
申请日:2009-06-29
IPC分类号: C23F1/00
CPC分类号: B05D5/00 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/306
摘要: The present invention is directed to substrates comprising amplified patterns, methods for making the amplified patterns, and methods of using the amplified patterns to form surface features on the substrates.
摘要翻译: 本发明涉及包括放大图案的基板,用于制作放大图案的方法,以及使用放大图案在基板上形成表面特征的方法。
-
公开(公告)号:US20090302001A1
公开(公告)日:2009-12-10
申请号:US12483128
申请日:2009-06-11
申请人: Brian T. MAYERS , Jeffrey Carbeck , Wajeeh Saadi , George M. Whitesides , Ralf Kugler , Monika Kursawe , Johannes Canisius
发明人: Brian T. MAYERS , Jeffrey Carbeck , Wajeeh Saadi , George M. Whitesides , Ralf Kugler , Monika Kursawe , Johannes Canisius
IPC分类号: C03C25/68
CPC分类号: G03F7/0002 , B82Y10/00 , B82Y20/00 , B82Y40/00
摘要: The present invention is directed to methods for patterning surfaces using contact printing and pastes, and products formed therefrom.
摘要翻译: 本发明涉及使用接触印刷和糊剂以及由其形成的产品来图案化表面的方法。
-
公开(公告)号:US08635749B2
公开(公告)日:2014-01-28
申请号:US12844314
申请日:2010-07-27
申请人: Brian Mayers , Sandip Agarwal , Jeffrey Carbeck , David Ledoux , Kevin Randall Stewart , George M. Whitesides , Adam Winkleman
发明人: Brian Mayers , Sandip Agarwal , Jeffrey Carbeck , David Ledoux , Kevin Randall Stewart , George M. Whitesides , Adam Winkleman
IPC分类号: A44B18/00
CPC分类号: C09J7/00 , C09J2201/626
摘要: Disclosed are adhesive systems and methods of making and using such systems. Exemplary adhesive systems include protrusions and/or grooves that can interleave to form a reversible adhesive interaction.
摘要翻译: 公开了制造和使用这种系统的粘合剂系统和方法。 示例性的粘合剂系统包括可以交织以形成可逆粘合剂相互作用的突起和/或凹槽。
-
公开(公告)号:US20110016675A1
公开(公告)日:2011-01-27
申请号:US12844314
申请日:2010-07-27
申请人: Brian MAYERS , Sandip Agarwal , Jeffrey Carbeck , David Ledoux , Kevin Randall Stewart , George M. Whitesides , Adam Winkleman
发明人: Brian MAYERS , Sandip Agarwal , Jeffrey Carbeck , David Ledoux , Kevin Randall Stewart , George M. Whitesides , Adam Winkleman
IPC分类号: A44B18/00
CPC分类号: C09J7/00 , C09J2201/626
摘要: The present invention is directed to adhesive systems and methods of making and using such systems. Exemplary adhesive systems comprise protrusions and/or grooves that can interleave to form a reversible adhesive interaction.
摘要翻译: 本发明涉及制造和使用这种系统的粘合剂体系和方法。 示例性粘合剂系统包括可以交织以形成可逆粘合剂相互作用的突起和/或凹槽。
-
公开(公告)号:US20110171430A1
公开(公告)日:2011-07-14
申请号:US13014182
申请日:2011-01-26
申请人: Brian MAYERS , Sandip Agarwal , Jeffrey Carbeck , David Ledoux , Kevin Randall Stewart , George M. Whitesides , Adam Winkleman
发明人: Brian MAYERS , Sandip Agarwal , Jeffrey Carbeck , David Ledoux , Kevin Randall Stewart , George M. Whitesides , Adam Winkleman
CPC分类号: C09J183/06 , B32B3/30 , B32B37/1292 , B32B2037/1246 , B32B2355/00 , B32B2367/00 , B32B2383/00 , B32B2405/00 , C09J7/00 , C09J167/00 , C09J2201/626 , C09J2467/003 , C09J2483/003 , Y10T156/10 , Y10T428/24562 , Y10T428/24612
摘要: The present invention is directed to adhesive systems and methods of making and using such systems. Exemplary adhesive systems comprise protrusions and/or grooves that can interleave to form a reversible adhesive interaction.
-
-
-
-
-
-
-
-
-