SEMICONDUCTOR STORAGE DEVICE AND MEMORY SYSTEM

    公开(公告)号:US20230317181A1

    公开(公告)日:2023-10-05

    申请号:US17902754

    申请日:2022-09-02

    CPC classification number: G11C16/3445 G11C16/08 G11C16/16 G11C16/24

    Abstract: A semiconductor storage device of embodiments includes a block constituted with a plurality of strings each including a plurality of memory cell transistors, a plurality of word lines, a bit line, a source line, and a control circuit configured to perform erase operation on the plurality of memory cell transistors, and the control circuit changes setting of first erase-verify operation included in the erase operation for an open block including a memory cell transistor having an erase level and setting of second erase-verify operation included in erase operation for a closed block not including a memory cell transistor having an erase block.

    MEMORY DEVICE AND MEMORY SYSTEM
    2.
    发明申请

    公开(公告)号:US20230064140A1

    公开(公告)日:2023-03-02

    申请号:US17686835

    申请日:2022-03-04

    Abstract: A second conductor, third conductor, and fourth conductor sandwiches a first layer together with a first semiconductor. The fourth conductor is positioned farther from the first conductor than the third conductor, which is positioned farther from first conductor than the second conductor. A first circuit is configured to apply a first potential to the first and second conductors, apply a second potential lower than the first potential to the third conductor in parallel with the application of the first potential, and apply a third potential higher than the second potential and lower than the first potential to the fourth conductor in parallel with the application of the first potential.

    SEMICONDUCTOR MEMORY DEVICE
    3.
    发明公开

    公开(公告)号:US20230307060A1

    公开(公告)日:2023-09-28

    申请号:US17930625

    申请日:2022-09-08

    Abstract: A semiconductor memory device performs a write operation and an erase operation. The write operation includes a first program operation that applies a first program voltage to a first conductive layer. The first program voltage increases by a first offset voltage together with an increase in an execution count of a first write loop. An erase operation includes a program voltage control operation and an erase voltage supply operation that applies an erase voltage to a first wiring. The program voltage control operation includes a second program operation that applies a second program voltage to a third conductive layer. The second program voltage increases by a second offset voltage together with an increase in a number of times of execution of a second write loop. A magnitude of the first program voltage is adjusted according to a magnitude of the second program voltage.

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