公开(公告)号：US11883926B2

公开(公告)日：2024-01-30

申请号：US17319637

申请日：2021-05-13

Applicant: Kioxia Corporation

Inventor： Takahiko Kawasaki ,  Yukiteru Matsui ,  Akifumi Gawase

IPC: B24B37/26 ,  B24B37/24 ,  B24B53/017 ,  H01L21/768 ,  H01L21/321 ,  H01L21/3105 ,  H01L23/532

CPC classification number: B24B37/26 ,  B24B37/24 ,  B24B53/017 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76805 ,  H01L21/76819 ,  H01L21/76895 ,  H01L23/53257

Abstract: A polishing pad is described. The polishing pad includes a surface having plural recess portions, and a substrate is polished by the surface. In the pad, an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more.