公开(公告)号：US06208419B1

公开(公告)日：2001-03-27

申请号：US09438062

申请日：1999-11-10

申请人： Kiyohumi Yamamoto ,  Hiroshi Maeda ,  Satoshi Mino ,  Kazuhiro Nishida

发明人： Kiyohumi Yamamoto ,  Hiroshi Maeda ,  Satoshi Mino ,  Kazuhiro Nishida

IPC分类号： G01B1100

CPC分类号： H01L21/67144 ,  H01L21/681 ,  H01L24/75 ,  H01L2924/12036 ,  H01L2924/12042 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/328 ,  H05K2201/10106 ,  H05K2203/107 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A bonding apparatus has a probe for causing an LED chip to emit light before the LED chip is bonded on a board, an imaging system for recognizing the center of a light-emitting area of the LED chip and recognizing coordinates of a contour reference point of the LED chip with respect to the recognized center of the light-emitting area, and a light-emitting-element holding mechanism for positioning the LED chip in a bonding position on the board based on the recognized coordinates of the contour reference point. The center of the light-emitting area of the LED chip can be positioned highly accurately in a desired position on the board without being adversely affected by variations in the contour dimensions of the LED chip.

摘要翻译： 接合装置具有用于在LED芯片接合在基板上之前使LED芯片发光的探针，用于识别LED芯片的发光区域的中心并识别轮廓参考点的坐标的成像系统 所述LED芯片相对于所识别的所述发光区域的中心，以及发光元件保持机构，用于基于识别出的所述轮廓基准点的坐标将所述LED芯片定位在所述基板上的接合位置。 LED芯片的发光区域的中心可以高度精确地定位在板上的期望位置，而不受LED芯片的轮廓尺寸的变化的不利影响。

公开(公告)号：US20050275746A1

公开(公告)日：2005-12-15

申请号：US11151340

申请日：2005-06-14

申请人： Kazuhiro Nishida ,  Hiroshi Maeda ,  Kiyohumi Yamamoto

发明人： Kazuhiro Nishida ,  Hiroshi Maeda ,  Kiyohumi Yamamoto

IPC分类号： G02B7/02 ,  G02B13/00 ,  H01L27/14 ,  H01L31/0232 ,  H04N5/225 ,  H04N5/335 ,  H04N101/00

CPC分类号： G02B7/02 ,  G02B13/008 ,  H01L27/14618 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16235 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014

摘要： An optical filter layer composed of an infrared cut filter layer, an optical low pass filter layer and the like is formed on a glass substrate. The optical filter layer is made either by attaching or depositing. The glass substrate with the optical filter layer is attached to a semiconductor wafer, in which imaging sections are arranged in a matrix. The glass substrate and the semiconductor wafer are diced along each imaging section to separate individual solid state imaging device.

摘要翻译： 在玻璃基板上形成由红外截止滤光层，光学低通滤光层等构成的滤光层。 滤光层是通过附着或沉积制成的。 具有滤光层的玻璃基板安装在半导体晶片上，其中成像部分被排列成矩阵。 沿着每个成像部分切割玻璃基板和半导体晶片以分离单独的固态成像装置。

公开(公告)号：US20090002532A1

公开(公告)日：2009-01-01

申请号：US12200444

申请日：2008-08-28

申请人： Kazuhiro Nishida ,  Hiroshi Maeda ,  Kiyohumi Yamamoto

发明人： Kazuhiro Nishida ,  Hiroshi Maeda ,  Kiyohumi Yamamoto

IPC分类号： H04N5/335 ,  H04N5/225

CPC分类号： G02B7/02 ,  G02B13/008 ,  H01L27/14618 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16235 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014

摘要： An optical filter layer composed of an infrared cut filter layer, an optical low pass filter layer and the like is formed on a glass substrate. The optical filter layer is made either by attaching or depositing. The glass substrate with the optical filter layer is attached to a semiconductor wafer, in which imaging sections are arranged in a matrix. The glass substrate and the semiconductor wafer are diced along each imaging section to separate individual solid state imaging device.

摘要翻译： 在玻璃基板上形成由红外截止滤光层，光学低通滤光层等构成的滤光层。 滤光层是通过附着或沉积制成的。 具有滤光层的玻璃基板安装在半导体晶片上，其中成像部分被排列成矩阵。 沿着每个成像部分切割玻璃基板和半导体晶片以分离单独的固态成像装置。

公开(公告)号：US5299411A

公开(公告)日：1994-04-05

申请号：US982035

申请日：1992-11-24

申请人： Kiyohumi Yamamoto ,  Hiroshi Maeda ,  Susumu Suzuki

发明人： Kiyohumi Yamamoto ,  Hiroshi Maeda ,  Susumu Suzuki

IPC分类号： B65B11/04 ,  B65B25/14

CPC分类号： B65B25/148

摘要： A wrapping sheet is disposed on a roll so that marginal portions of the wrapping sheet extend beyond the respective side faces of the roll. A wrapping sheet winding apparatus for winding the wrapping sheet around the roll has a pair of chucks which are drivingly engaged with a core of the roll and rotate the roll to wind therearound the wrapping sheet. Each of the chucks is provided with suction holes formed on the outer peripheral surface thereof.

摘要翻译： 包装片设置在卷筒上，使得包装片的边缘部分延伸超出卷的相应侧面。 用于将包裹片卷绕在卷上的包装纸卷绕装置具有一对卡盘，该卡盘与卷轴的芯部驱动地接合，并使卷筒旋转以围绕包装片卷绕。 每个卡盘设置有形成在其外周面上的吸孔。

公开(公告)号：US06266891B1

公开(公告)日：2001-07-31

申请号：US09404193

申请日：1999-09-23

申请人： Kiyohumi Yamamoto

发明人： Kiyohumi Yamamoto

IPC分类号： G01C1125

CPC分类号： H01L21/67144 ,  H01L21/681

摘要： A bonding apparatus for bonding a component on a board at a predetermined position thereon has a displacement mechanism for displacing a board holding unit for holding a board and a component holding unit for holding a component relatively to each other to reach a bonding position, a laser distance measuring mechanism for measuring a distance of said board holding unit or said component holding unit from said bonding position directly with a laser beam, and an imaging mechanism for detecting a position of said component with cameras and positionally correcting the component if necessary. The bonding apparatus allows components, i.e., LED chips, to be positioned highly accurately without being affected by spaced intervals between the components.

摘要翻译： 一种用于将板上的部件组合在其上的预定位置的接合装置具有用于移动用于保持板的板保持单元的位移机构和用于保持相对于彼此的部件到达接合位置的部件保持单元，激光 距离测量机构，用于直接用激光束测量所述板保持单元或所述部件保持单元的距离与所述接合位置的距离;以及成像机构，用于利用照相机检测所述部件的位置，并且如果需要则对所述部件进行位置校正。 接合装置允许组件即LED芯片高精度地定位，而不受组件之间间隔的影响。

公开(公告)号：US06369884B1

公开(公告)日：2002-04-09

申请号：US09548273

申请日：2000-04-12

申请人： Kiyohumi Yamamoto ,  Katsuhiro Miura

发明人： Kiyohumi Yamamoto ,  Katsuhiro Miura

IPC分类号： G01J100

CPC分类号： H01L21/681 ,  H01L21/67144 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/10106 ,  H05K2203/166 ,  Y02P70/613

摘要： A light-transmissive support disk supports a tube for attracting an LED chip, and a light-transmissive electrically conductive film is disposed on the support base. The LED chip is electrically connected to a negative terminal of a DC power supply by the light-transmissive electrically conductive film. An imaging unit is disposed coaxially with the tube and has a CCD camera for capturing an image of a light-emitting state of the LED chip via the support disk and a cover member when the LED chip attracted by the tube emits light. The light-emitting center of the LED chip can be detected accurately, and bonded easily and highly accurately on a board at a desired position thereon.

摘要翻译： 透光支撑盘支撑用于吸引LED芯片的管，并且透光导电膜设置在支撑基座上。 LED芯片通过透光性导电膜与直流电源的负极电连接。 成像单元与管同轴设置，并且具有CCD相机，用于当由管吸引的LED芯片发光时，经由支撑盘和盖构件捕获LED芯片的发光状态的图像。 可以精确地检测LED芯片的发光中心，并且在其上的期望位置处的板上容易且高精度地粘合。