-
公开(公告)号：US20100314056A1
公开(公告)日：2010-12-16
申请号：US12746887
申请日：2008-12-05
CPC分类号： D21C9/142 , D21C9/1036 , D21C9/147 , D21C9/153 , D21C9/163
摘要： Provided is a process for producing bleached pulp, including subjecting unbleached pulp, which is obtained by cooking a lignocellulose substance, to alkali-oxygen bleaching treatment and then subjecting the alkali-oxygen bleached pulp to chlorine-free bleaching treatment including chlorine dioxide treatment, wherein in at least one chlorine dioxide treatment stage in which the chlorine dioxide treatment is performed, monopersulfuric acid is used in combination. The amount of chlorine dioxide to be used is reduced and the colour reversion resistance of the bleached pulp is improved by this process.
摘要翻译： 本发明提供一种漂白纸浆的制造方法，其特征在于，将通过蒸煮木质纤维素物质得到的未漂白的纸浆进行碱氧漂白处理，然后对碱性氧漂白纸浆进行无氯漂白处理，包括二氧化氯处理，其中 在进行二氧化氯处理的至少一个二氧化氯处理阶段中，组合使用单过硫酸。 通过该方法可以减少二氧化氯的使用量，并且改善漂白纸浆的耐逆转性。
-
公开(公告)号：US08900408B2
公开(公告)日：2014-12-02
申请号：US12746887
申请日：2008-12-05
CPC分类号： D21C9/142 , D21C9/1036 , D21C9/147 , D21C9/153 , D21C9/163
摘要： Provided is a process for producing bleached pulp, including subjecting unbleached pulp, which is obtained by cooking a lignocellulose substance, to alkali-oxygen bleaching treatment and then subjecting the alkali-oxygen bleached pulp to chlorine-free bleaching treatment including chlorine dioxide treatment, wherein in at least one chlorine dioxide treatment stage in which the chlorine dioxide treatment is performed, monopersulfuric acid is used in combination. The amount of chlorine dioxide to be used is reduced and the color reversion resistance of the bleached pulp is improved by this process.
摘要翻译： 本发明提供一种漂白纸浆的制造方法，其特征在于，将通过蒸煮木质纤维素物质得到的未漂白的纸浆进行碱氧漂白处理，然后对碱性氧漂白纸浆进行无氯漂白处理，包括二氧化氯处理，其中 在进行二氧化氯处理的至少一个二氧化氯处理阶段中，组合使用单过硫酸。 通过该方法可以减少二氧化氯的使用量，并且改善漂白纸浆的耐逆转性。
-
公开(公告)号：US20070099810A1
公开(公告)日：2007-05-03
申请号：US11259256
申请日：2005-10-27
申请人： Hiroshi Matsunaga , Masaru Ohto , Hiroshi Yoshida , Eiko Kuwabara , Ming Fang , Lourdes Dominguez
发明人： Hiroshi Matsunaga , Masaru Ohto , Hiroshi Yoshida , Eiko Kuwabara , Ming Fang , Lourdes Dominguez
CPC分类号： C11D3/0073 , C11D3/044 , C11D3/43 , C11D7/06 , C11D7/5004
摘要： A cleaning liquid which comprises at least one selected from potassium hydroxide or sodium hydroxide in an amount of 0.01 to 10% by weight, water-soluble organic solvent in an amount of 5 to 80% by weight, a corrosion inhibitor at least one selected from the group consisting of group IX metal of the Periodic Table, group IX metal alloy and group XI metal of the Periodic Table in an amount of 0.0001% by weight and water. The present provides a cleaning liquid and a cleaning method both capable of removing photoresists or its deposits and attached articles on the surface of treated substances such as organosiloxane-based anti-reflection film, configuration protective coat or so without corroding the treated substances, particularly low dielectric constant film, group IX metals of the Periodic Table and their alloy, and group XI metals of the Periodic Table.
摘要翻译： 一种清洗液，其含有0.01〜10重量％的氢氧化钾或氢氧化钠中的至少1种，5〜80重量％的水溶性有机溶剂，至少1种选自 由元素周期表第IX族金属，第IX族金属合金和元素周期表第XI族金属组成的组为0.0001％（重量）和水。 本发明提供一种能够除去光致抗蚀剂或其沉积物和附着物品的清洗液和清洁方法，例如在有机硅氧烷类防反射膜，构型保护层等的表面处理，而不会腐蚀处理物质，特别是低 介电常数薄膜，元素周期表第IX族金属及其合金，以及元素周期表第XI族金属。
-
4.发明申请公开(公告)号：US20100051066A1
公开(公告)日：2010-03-04
申请号：US12158077
申请日：2006-12-14
申请人： Eiko Kuwabara , Hideo Kashiwagi , Hiroshi Matsunaga , Masaru Ohto
发明人： Eiko Kuwabara , Hideo Kashiwagi , Hiroshi Matsunaga , Masaru Ohto
CPC分类号： H05K3/26 , C11D3/3947 , C11D7/3281 , C11D11/0047 , G03F7/423 , G03F7/425 , H05K3/0041 , H05K3/388 , H05K2203/0796 , H05K2203/124
摘要： A composition for removing a residue from a wiring board containing an oxidizing agent and an azole compound and having a pH of from 1 to 7 and a cleaning method of a wiring board for removing a residue after dry etching by using this composition are provided. By using the composition for removing a residue of the present invention, in manufacturing a wiring board, residues remaining after dry etching which are derived from a resist or metals can be effectively removed without corroding titanium or titanium alloys with high corrosiveness. In particular, a semiconductor device using a wiring board containing titanium or titanium alloys can be efficiently manufactured.
摘要翻译： 提供一种用于从含有氧化剂和唑类化合物并且pH为1至7的布线板除去残余物的组合物，以及通过使用该组合物在干法蚀刻之后除去残留物的布线板的清洁方法。 通过使用除去本发明的残渣的组合物，在制造布线板时，可以有效地除去从抗蚀剂或金属衍生的干蚀刻后剩余的残留物，而不会腐蚀具有高腐蚀性的钛或钛合金。 特别地，可以有效地制造使用含有钛或钛合金的布线板的半导体装置。
-
-
-
搜索结果
4 条记录 (耗时 0.017 秒)