摘要:
The paste composition for forming a back electrode of solar cell 10 provided by the present invention contains, as solids, an aluminum powder, a glass powder and a composite powder composed of a particulate composite of a metal oxide with a silicon-containing organic or inorganic compound. This composite powder is contained in an amount of at least 0.01 mass % but less than 0.45 mass % given 100 mass % as the total of the composite powder, the aluminum powder and the glass powder.
摘要:
The paste composition for forming a back electrode of solar cell 10 provided by the present invention contains, as solids, an aluminum powder, a glass powder and a composite powder composed of a particulate composite of a metal oxide with a silicon-containing organic or inorganic compound. This composite powder is contained in an amount of at least 0.01 mass % but less than 0.45 mass % given 100 mass % as the total of the composite powder, the aluminum powder and the glass powder.
摘要:
A paste composition for forming a back surface electrode of a solar cell 10 provided by the present invention contains, as solid matter, an aluminum powder, a glass powder, and a composite powder composed of a granular composite material of titanium oxide and an organic or inorganic compound containing silicon. When the total amount of the composite powder, the aluminum powder, and the glass powder is 100% by mass, the composite powder is contained in a ratio of 0.45% by mass or more and 1% by mass or less.
摘要:
A paste composition for forming a back surface electrode of a solar cell 10 provided by the present invention contains, as solid matter, an aluminum powder, a glass powder, and a composite powder composed of a granular composite material of titanium oxide and an organic or inorganic compound containing silicon. When the total amount of the composite powder, the aluminum powder, and the glass powder is 100% by mass, the composite powder is contained in a ratio of 0.45% by mass or more and 1% by mass or less.
摘要:
An interdigital electrode of a SAW device is protected by a protective layer during a photo-lithography etching process which is used to apply a bonding pad. As the bonding pad can be formed by the photo-lithography etching process, it is possible to obtain regularly shaped bonding pads without damaging the characteristics of the SAW device.