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公开(公告)号：USD680505S1
公开(公告)日：2013-04-23
申请号：US29413509
申请日：2012-02-16
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公开(公告)号：USD664512S1
公开(公告)日：2012-07-31
申请号：US29389794
申请日：2011-04-15
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公开(公告)号：USD664511S1
公开(公告)日：2012-07-31
申请号：US29389790
申请日：2011-04-15
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公开(公告)号：USD690278S1
公开(公告)日：2013-09-24
申请号：US29413539
申请日：2012-02-16
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5.发明申请公开(公告)号：US20120094471A1
公开(公告)日：2012-04-19
申请号：US13274288
申请日：2011-10-14
申请人： Kouhei TANIGUCHI , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
发明人： Kouhei TANIGUCHI , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
CPC分类号： H01L21/6836 , C09J7/20 , C09J7/403 , C09J2201/122 , C09J2201/20 , C09J2201/28 , C09J2201/36 , C09J2201/606 , C09J2203/326 , H01L21/568 , H01L21/67132 , H01L21/78 , H01L23/3135 , H01L2924/0002 , Y10T156/10 , Y10T156/1052 , Y10T428/1476 , H01L2924/00
摘要： In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.
摘要翻译： 在晶片处理带中，如平面图所示，面对粘合剂层的中心的圆形或舌形切口部分形成为对应于到晶片环的粘贴区域到达到释放基底的深度 材料从基材膜的侧面。 由于形成切口部分，当剥离力作用在晶片处理带上时，首先剥离比缺口部分更向外的粘性材料层和基材膜的部分，并且更多的部分 向内比缺口部分保持在晶片环上处于突出状态。 因此，可以提高晶片处理带和晶片环之间的剥离强度。 还提供了制造带和半导体器件的方法。
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公开(公告)号：USD656909S1
公开(公告)日：2012-04-03
申请号：US29389788
申请日：2011-04-15
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公开(公告)号：USD656910S1
公开(公告)日：2012-04-03
申请号：US29389797
申请日：2011-04-15
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8.发明授权Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device 有权用于处理晶片的胶带，用于制造用于处理晶片的胶带的制造方法，以及半导体装置的制造方法公开(公告)号：US09076833B2
公开(公告)日：2015-07-07
申请号：US13878985
申请日：2011-10-12
申请人： Kouhei Taniguchi , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
发明人： Kouhei Taniguchi , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
CPC分类号： H01L21/6836 , C09J7/20 , C09J7/403 , C09J2201/122 , C09J2201/20 , C09J2201/28 , C09J2201/36 , C09J2201/606 , C09J2203/326 , H01L21/568 , H01L21/67132 , H01L21/78 , H01L23/3135 , H01L2924/0002 , Y10T156/10 , Y10T156/1052 , Y10T428/1476 , H01L2924/00
摘要： In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
摘要翻译： 在晶片处理带中，如平面图所示，面对粘合剂层的中心的圆形或舌状的切口部分形成为对应于到晶片环的粘贴区域到到达剥离基板的深度 从基材膜的侧面。 由于形成切口部分，当剥离力作用在晶片处理带上时，首先剥离比缺口部分更向外的粘性材料层和基材膜的部分，并且更多的部分 向内比缺口部分保持在晶片环上处于突出状态。 因此，可以提高晶片处理带和晶片环之间的剥离强度，并且可以抑制晶片处理带在工艺期间从晶圆环剥离。
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9.发明授权Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device 有权晶圆加工带，晶圆加工带的制造方法以及半导体装置的制造方法公开(公告)号：US09076832B2
公开(公告)日：2015-07-07
申请号：US13274288
申请日：2011-10-14
申请人： Kouhei Taniguchi , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
发明人： Kouhei Taniguchi , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
CPC分类号： H01L21/6836 , C09J7/20 , C09J7/403 , C09J2201/122 , C09J2201/20 , C09J2201/28 , C09J2201/36 , C09J2201/606 , C09J2203/326 , H01L21/568 , H01L21/67132 , H01L21/78 , H01L23/3135 , H01L2924/0002 , Y10T156/10 , Y10T156/1052 , Y10T428/1476 , H01L2924/00
摘要： In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.
摘要翻译： 在晶片处理带中，如平面图所示，面对粘合剂层的中心的圆形或舌形切口部分形成为对应于到晶片环的粘贴区域到达到释放基底的深度 材料从基材膜的侧面。 由于形成切口部分，当剥离力作用在晶片处理带上时，首先剥离比缺口部分更向外的粘性材料层和基材膜的部分，并且更多的部分 向内比缺口部分保持在晶片环上处于突出状态。 因此，可以提高晶片处理带和晶片环之间的剥离强度。 还提供了制造带和半导体器件的方法。
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10.发明申请TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCESSING WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权加工辊用带，用于制造加工辊的带的方法和制造半导体器件的方法公开(公告)号：US20130273718A1
公开(公告)日：2013-10-17
申请号：US13878985
申请日：2011-10-12
申请人： Kouhei Taniguchi , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
发明人： Kouhei Taniguchi , Takayuki Matsuzaki , Shinya Katou , Kouji Komorida , Michio Mashino , Tatsuya Sakuta , Rie Katou
IPC分类号： H01L21/683 , H01L21/78
CPC分类号： H01L21/6836 , C09J7/20 , C09J7/403 , C09J2201/122 , C09J2201/20 , C09J2201/28 , C09J2201/36 , C09J2201/606 , C09J2203/326 , H01L21/568 , H01L21/67132 , H01L21/78 , H01L23/3135 , H01L2924/0002 , Y10T156/10 , Y10T156/1052 , Y10T428/1476 , H01L2924/00
摘要： In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
摘要翻译： 在晶片处理带中，如平面图所示，面对粘合剂层的中心的圆形或舌状的切口部分形成为对应于到晶片环的粘贴区域到到达剥离基板的深度 从基材膜的侧面。 由于形成切口部分，当剥离力作用在晶片处理带上时，首先剥离比缺口部分更向外的粘性材料层和基材膜的部分，并且更多的部分 向内比缺口部分保持在晶片环上处于突出状态。 因此，可以提高晶片处理带和晶片环之间的剥离强度，并且可以抑制晶片处理带在工艺期间从晶圆环剥离。
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