Semiconductor device with mushroom electrode and manufacture method thereof
    1.
    发明授权
    Semiconductor device with mushroom electrode and manufacture method thereof 有权
    具有蘑菇电极的半导体器件及其制造方法

    公开(公告)号:US08133775B2

    公开(公告)日:2012-03-13

    申请号:US12985742

    申请日:2011-01-06

    摘要: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

    摘要翻译: 半导体器件具有:半导体衬底,具有电流流过的一对电流输入/输出区域; 形成在所述半导体基板上并具有栅电极开口的绝缘膜; 以及通过所述栅电极开口形成在所述半导体基板上的蘑菇栅极电极结构,所述蘑菇栅电极结构具有杆和形成在所述杆上的头部,所述杆在所述半导体衬底上沿着电流方向具有有限的尺寸,并且具有 向前锥形形状向上并沿着电流方向单调地增加尺寸,头部具有沿着电流方向逐步扩大的尺寸,并且杆在栅极电极开口中接触半导体衬底并且在至少一个位置附近骑绝缘膜 杆的相对端之一沿着当前方向。

    Semiconductor device with mushroom electrode and manufacture method thereof
    2.
    发明授权
    Semiconductor device with mushroom electrode and manufacture method thereof 有权
    具有蘑菇电极的半导体器件及其制造方法

    公开(公告)号:US07223645B2

    公开(公告)日:2007-05-29

    申请号:US10768092

    申请日:2004-02-02

    IPC分类号: H01L21/338 H01L21/44

    摘要: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

    摘要翻译: 半导体器件具有:半导体衬底,具有电流流过的一对电流输入/输出区域; 形成在所述半导体基板上并具有栅电极开口的绝缘膜; 以及通过所述栅电极开口形成在所述半导体基板上的蘑菇栅极电极结构,所述蘑菇栅电极结构具有杆和形成在所述杆上的头部,所述杆在所述半导体衬底上沿着电流方向具有有限的尺寸,并且具有 向前锥形形状向上并沿着电流方向单调地增加尺寸,头部具有沿着电流方向逐步扩大的尺寸,并且杆在栅极电极开口中接触半导体衬底并且在至少一个位置附近骑绝缘膜 杆的相对端之一沿着当前方向。

    SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD THEREOF
    3.
    发明申请
    SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD THEREOF 有权
    具有MUSHROOM电极的半导体器件及其制造方法

    公开(公告)号:US20110097886A1

    公开(公告)日:2011-04-28

    申请号:US12985742

    申请日:2011-01-06

    IPC分类号: H01L21/3205

    摘要: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

    摘要翻译: 半导体器件具有:半导体衬底,具有电流流过的一对电流输入/输出区域; 形成在所述半导体基板上并具有栅电极开口的绝缘膜; 以及通过所述栅电极开口形成在所述半导体基板上的蘑菇栅极电极结构,所述蘑菇栅电极结构具有杆和形成在所述杆上的头部,所述杆在所述半导体衬底上沿着电流方向具有有限的尺寸,并且具有 向前锥形形状向上并沿着电流方向单调地增加尺寸,头部具有沿着电流方向逐步扩大的尺寸,并且杆在栅极电极开口中接触半导体衬底并且在至少一个位置附近骑绝缘膜 杆的相对端之一沿着当前方向。

    Semiconductor device with mushroom electrode and manufacture method thereof
    4.
    发明授权
    Semiconductor device with mushroom electrode and manufacture method thereof 有权
    具有蘑菇电极的半导体器件及其制造方法

    公开(公告)号:US06717271B2

    公开(公告)日:2004-04-06

    申请号:US10084924

    申请日:2002-03-01

    IPC分类号: H01L2312

    摘要: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

    摘要翻译: 半导体器件具有:半导体衬底,具有电流流过的一对电流输入/输出区域; 形成在所述半导体基板上并具有栅电极开口的绝缘膜; 以及通过所述栅电极开口形成在所述半导体基板上的蘑菇栅极电极结构,所述蘑菇栅电极结构具有杆和形成在所述杆上的头部,所述杆在所述半导体衬底上沿着电流方向具有有限的尺寸,并且具有 向前锥形形状向上并沿着电流方向单调地增加尺寸,头部具有沿着电流方向逐步扩大的尺寸,并且杆在栅极电极开口中接触半导体衬底并且在至少一个位置附近骑绝缘膜 杆的相对端之一沿着当前方向。

    Semiconductor device with mushroom electrode and manufacture method thereof
    5.
    发明授权
    Semiconductor device with mushroom electrode and manufacture method thereof 有权
    具有蘑菇电极的半导体器件及其制造方法

    公开(公告)号:US07888193B2

    公开(公告)日:2011-02-15

    申请号:US12726761

    申请日:2010-03-18

    摘要: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

    摘要翻译: 半导体器件具有:半导体衬底,具有电流流过的一对电流输入/输出区域; 形成在所述半导体基板上并具有栅电极开口的绝缘膜; 以及通过所述栅电极开口形成在所述半导体基板上的蘑菇栅极电极结构,所述蘑菇栅电极结构具有杆和形成在所述杆上的头部,所述杆在所述半导体衬底上沿着电流方向具有有限的尺寸,并且具有 向前锥形形状向上并沿着电流方向单调地增加尺寸,头部具有沿着电流方向逐步扩大的尺寸,并且杆在栅极电极开口中接触半导体衬底并且在至少一个位置附近骑绝缘膜 杆的相对端之一沿着当前方向。

    SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD THEREOF
    6.
    发明申请
    SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD THEREOF 有权
    具有MUSHROOM电极的半导体器件及其制造方法

    公开(公告)号:US20100173486A1

    公开(公告)日:2010-07-08

    申请号:US12726761

    申请日:2010-03-18

    IPC分类号: H01L21/28

    摘要: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

    摘要翻译: 半导体器件具有:半导体衬底,具有电流流过的一对电流输入/输出区域; 形成在所述半导体基板上并具有栅电极开口的绝缘膜; 以及通过所述栅电极开口形成在所述半导体基板上的蘑菇栅极电极结构,所述蘑菇栅电极结构具有杆和形成在所述杆上的头部,所述杆在所述半导体衬底上沿着电流方向具有有限的尺寸,并且具有 向前锥形形状向上并沿着电流方向单调地增加尺寸,头部具有沿着电流方向逐步扩大的尺寸,并且杆在栅极电极开口中接触半导体衬底并且在至少一个位置附近骑绝缘膜 杆的相对端之一沿着当前方向。

    Semiconductor device with mushroom electrode and manufacture method thereof
    8.
    发明授权
    Semiconductor device with mushroom electrode and manufacture method thereof 有权
    具有蘑菇电极的半导体器件及其制造方法

    公开(公告)号:US07335542B2

    公开(公告)日:2008-02-26

    申请号:US11713599

    申请日:2007-03-05

    IPC分类号: H01L21/338 H01L21/44

    摘要: A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.

    摘要翻译: 半导体器件具有:半导体衬底,具有电流流过的一对电流输入/输出区域; 形成在所述半导体基板上并具有栅电极开口的绝缘膜; 以及通过所述栅电极开口形成在所述半导体基板上的蘑菇栅极电极结构,所述蘑菇栅电极结构具有杆和形成在所述杆上的头部,所述杆在所述半导体衬底上沿着电流方向具有有限的尺寸,并且具有 向前锥形形状向上并沿着电流方向单调地增加尺寸,头部具有沿着电流方向逐步扩大的尺寸,并且杆在栅极电极开口中接触半导体衬底并且在至少一个位置附近骑绝缘膜 杆的相对端之一沿着当前方向。

    Compound semiconductor device and method of manufacturing the same

    公开(公告)号:US08581261B2

    公开(公告)日:2013-11-12

    申请号:US13276830

    申请日:2011-10-19

    IPC分类号: H01L29/778

    摘要: Two layers of protection films are formed such that a sheet resistance at a portion directly below the protection film is higher than that at a portion directly below the protection film. The protection films are formed, for example, of SiN film, as insulating films. The protection film is formed to be higher, for instance, in hydrogen concentration than the protection film so that the protection film is higher in refractive index the protection film. The protection film is formed to cover a gate electrode and extend to the vicinity of the gate electrode on an electron supplying layer. The protection film is formed on the entire surface to cover the protection film. According to this configuration, the gate leakage is significantly reduced by a relatively simple configuration to realize a highly-reliable compound semiconductor device achieving high voltage operation, high withstand voltage, and high output.