公开(公告)号：US6165629A

公开(公告)日：2000-12-26

申请号：US6414

申请日：1993-01-21

申请人： Krishna Gandhi Sachdev ,  Benedikt Maria Johannes Kellner ,  Kathleen Mary McGuire ,  Peter Jerome Sorce

发明人： Krishna Gandhi Sachdev ,  Benedikt Maria Johannes Kellner ,  Kathleen Mary McGuire ,  Peter Jerome Sorce

IPC分类号： H01L23/522 ,  C08G73/10 ,  H01L21/48 ,  H01L21/768 ,  H01L23/538 ,  H05K1/05 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B15/08

CPC分类号： H01L23/5384 ,  H01L21/486 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/007 ,  H05K3/388 ,  H05K3/4076 ,  H05K3/423 ,  H05K3/445 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4641 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0152 ,  Y10T29/49165 ,  Y10T428/12361 ,  Y10T428/12382 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/24777 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

摘要翻译： 本发明一般涉及薄膜互连的结构和工艺，更具体地说涉及具有改进的尺寸稳定性和电性能的多层薄膜互连结构的结构和工艺。 本发明还涉及多层薄膜结构的制造方法。 单个薄膜结构被称为补偿器，并且在尺寸完整性方面起着地面/参考平面和稳定实体的作用。 补偿器主要由具有金属化通孔图案和作为绝缘体的高温稳定聚合物的金属片构成。

公开(公告)号：US06228511B1

公开(公告)日：2001-05-08

申请号：US09429814

申请日：1999-10-29

申请人： Krishna Gandhi Sachdev ,  Benedikt Maria Johannes Kellner ,  Kathleen Mary Mc Guire ,  Peter Jerome Sorce

发明人： Krishna Gandhi Sachdev ,  Benedikt Maria Johannes Kellner ,  Kathleen Mary Mc Guire ,  Peter Jerome Sorce

IPC分类号： B32B302

CPC分类号： H01L23/5384 ,  H01L21/486 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/007 ,  H05K3/388 ,  H05K3/4076 ,  H05K3/423 ,  H05K3/445 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4641 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0152 ,  Y10T29/49165 ,  Y10T428/12361 ,  Y10T428/12382 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/24777 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

摘要翻译： 本发明一般涉及薄膜互连的结构和工艺，更具体地说涉及具有改进的尺寸稳定性和电性能的多层薄膜互连结构的结构和工艺。 本发明还涉及多层薄膜结构的制造方法。 单个薄膜结构被称为补偿器，并且在尺寸完整性方面起着地面/参考平面和稳定实体的作用。 补偿器主要由具有金属化通孔图案和作为绝缘体的高温稳定聚合物的金属片构成。