公开(公告)号：US07320423B2

公开(公告)日：2008-01-22

申请号：US10715809

申请日：2003-11-17

Applicant: Krishnan Suresh ,  David T. Beatson

Inventor： Krishnan Suresh ,  David T. Beatson

IPC: B23K37/00 ,  B23K31/00 ,  B23K31/02

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K37/02 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.

Abstract translation: 公开了一种用于将导线接合到半导体器件的引线接合机。 引线接合机包括具有安装到其上的接合工具的引线接合头。 接合工具适于将线端附接到半导体器件。 接合头的至少一部分可围绕第一水平轴线枢转，以便提供接合工具的垂直位移。 接合头也可旋转地安装到接合机上，以允许接合工具围绕垂直定向的旋转轴线旋转。 该机器还包括用于支撑至少一个待接线的半导体器件的工作台。 传送系统用于沿着与接合头相对的方向，在与接合头的水平枢转轴线大致正交的方向上平移工作台。

公开(公告)号：US20080183524A1

公开(公告)日：2008-07-31

申请号：US12022552

申请日：2008-01-30

Applicant: Krishnan Suresh ,  Sankara Hari Gopalakrishnan

Inventor： Krishnan Suresh ,  Sankara Hari Gopalakrishnan

IPC: G06Q99/00 ,  G06F3/14

CPC classification number: G06F17/5018 ,  G06F2217/80 ,  G06Q10/0639

Abstract: An engineering simulation tool uses boundary regions of proposed design modifications to a finite design element to assess the impact of those proposed design modifications. This tool allows a designer to incorporate a new design feature into a proposed model and generate simulated performance results for the proposed design without re-execution of finite element method.

Abstract translation: 工程仿真工具使用拟议设计修改的边界区域对有限设计元素进行评估，以评估所提出的设计修改的影响。 该工具允许设计人员将新的设计特征纳入所提出的模型中，并为所提出的设计生成模拟性能结果，而无需重新执行有限元方法。

公开(公告)号：US20060277008A1

公开(公告)日：2006-12-07

申请号：US11143294

申请日：2005-06-02

Applicant: Krishnan Suresh

Inventor： Krishnan Suresh

IPC: G06F17/10

CPC classification number: G06F17/5018 ,  G06F2217/41 ,  G06F2217/42

Abstract: A method for simplifying engineering analysis of CAD geometric models, one which retains much of the accuracy of detailed finite element (FE) analysis while avoiding its computational burdens, is described. A skeleton, such as an exact or approximate medial mesh, is defined within the model, and the skeleton is then meshed. Known field values (physical values of interest, and/or their derivatives) are then “projected” onto the skeleton, as by interpolation or coordinate transformation, and these field values and the governing equations for the model and its engineering problem are then used to solve for unknown field values across all or desired portions of the skeletal mesh. The newly-determined field values may then be projected outwardly from the skeletal mesh to the remainder of the geometric model, again via interpolation or other methods. The method is found to be particularly efficient and accurate (again in comparison to standard FE methods) when applied to thin geometric objects, e.g., metal or plastic sheet, ribbed plates, thin cavities in plastics-forming molds, etc.

Abstract translation: 描述了一种简化CAD几何模型的工程分析的方法，其中保留了详细的有限元（FE）分析的大部分精度，同时避免了其计算负担。 在模型中定义骨架，如精确或近似的内侧网格，然后将骨架网格化。 然后将已知场值（感兴趣的物理值和/或其衍生物）“投影”到骨架上，如通过插值或坐标变换，然后将这些场值和模型的控制方程及其工程问题用于 解决骨架网格的所有或所需部分的未知字段值。 然后可以再次通过插值或其他方法将新确定的场值从骨架网格向外投射到几何模型的其余部分。 当应用于薄的几何物体（例如金属或塑料片，肋板，塑料成形模具中的薄腔）等时，发现该方法特别有效和准确（再次与标准FE方法相比）。

公开(公告)号：US08355893B2

公开(公告)日：2013-01-15

申请号：US12333743

申请日：2008-12-12

Applicant: Krishnan Suresh ,  Kavous Jorabchi ,  Josh Danczyk

Inventor： Krishnan Suresh ,  Kavous Jorabchi ,  Josh Danczyk

IPC: G06F17/50

CPC classification number: G06F17/5018 ,  G06F2217/08

Abstract: A method and system for simulating and analyzing the behavior of a structural component of a computerized model in response to a simulated event to determine an optimized shape for the component is disclosed. The shape is optimized using an implicit dimensional reduction rather than an explicit geometric replacement by discarding data of a 3D discretization that has little or no bearing on the performance of the component to a simulated event. The reduced dataset is then collapsed onto a lower dimension projection that is applied over a force vector that is representative of the simulated event to determine the behavior of the component to the simulated event. Optimization tools may then be used to modify the physical attributes of the component and performance of the component once again simulated until an optimized component is determined.

Abstract translation: 公开了一种用于模拟和分析响应于模拟事件以确定组件的优化形状的计算机化模型的结构部件的行为的方法和系统。 使用隐式尺寸减少而不是显式几何替换来优化形状，通过丢弃对组件对模拟事件的性能很少或没有影响的3D离散化的数据。 然后，将缩小的数据集折叠到较小尺寸的投影上，该投影应用在表示模拟事件的力向量上，以确定组件对模拟事件的行为。 然后可以使用优化工具来再次模拟组件的物理属性和性能，直到确定优化的组件。

公开(公告)号：US20100153077A1

公开(公告)日：2010-06-17

申请号：US12333743

申请日：2008-12-12

Applicant: Krishnan Suresh ,  Kavous Jorabchi ,  Josh Danczyk

Inventor： Krishnan Suresh ,  Kavous Jorabchi ,  Josh Danczyk

IPC: G06F17/10

CPC classification number: G06F17/5018 ,  G06F2217/08

Abstract: A method and system for simulating and analyzing the behavior of a structural component of a computerized model in response to a simulated event to determine an optimized shape for the component is disclosed. The shape is optimized using an implicit dimensional reduction rather than an explicit geometric replacement by discarding data of a 3D discretization that has little or no bearing on the performance of the component to a simulated event. The reduced dataset is then collapsed onto a lower dimension projection that is applied over a force vector that is representative of the simulated event to determine the behavior of the component to the simulated event. Optimization tools may then be used to modify the physical attributes of the component and performance of the component once again simulated until an optimized component is determined.

Abstract translation: 公开了一种用于模拟和分析响应于模拟事件以确定组件的优化形状的计算机化模型的结构部件的行为的方法和系统。 使用隐式尺寸减少而不是显式几何替换来优化形状，通过丢弃对组件对模拟事件的性能很少或没有影响的3D离散化的数据。 然后，将缩小的数据集折叠到较小尺寸的投影上，该投影应用在表示模拟事件的力向量上，以确定组件对模拟事件的行为。 然后可以使用优化工具来再次模拟组件的物理属性和性能，直到确定优化的组件。

公开(公告)号：US06386433B1

公开(公告)日：2002-05-14

申请号：US09636667

申请日：2000-08-11

Applicant: Eli Razon ,  Vaughn Svendsen ,  Robert Kowtko ,  Kyle Dury ,  Krishnan Suresh

Inventor： Eli Razon ,  Vaughn Svendsen ,  Robert Kowtko ,  Kyle Dury ,  Krishnan Suresh

IPC: B23K120

CPC classification number: B23K3/0623 ,  B23K2101/36 ,  H05K3/3478

Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.

Abstract translation: 公开了一种用于高速，可靠和可重复地将焊料材料递送和回流到衬底上的装置和方法。 该装置具有可重新定位的毛细管，以将单个焊料材料引导到基板上的特定位置。 能量源通过毛细管引导到焊料上以将焊料回流到衬底。 该装置提供将焊料材料单独引入毛细管并且将焊料材料从储存器推向毛细管，同时防止意料之外的堵塞和阻塞焊料材料。

公开(公告)号：US08346584B2

公开(公告)日：2013-01-01

申请号：US12022552

申请日：2008-01-30

Applicant: Krishnan Suresh ,  Sankara Hari Gopalakrishnan

Inventor： Krishnan Suresh ,  Sankara Hari Gopalakrishnan

IPC: G06Q40/00

CPC classification number: G06F17/5018 ,  G06F2217/80 ,  G06Q10/0639

Abstract: An engineering simulation tool uses boundary regions of proposed design modifications to a finite design element to assess the impact of those proposed design modifications. This tool allows a designer to incorporate a new design feature into a proposed model and generate simulated performance results for the proposed design without re-execution of finite element method.

Abstract translation: 工程仿真工具使用拟议设计修改的边界区域对有限设计元素进行评估，以评估所提出的设计修改的影响。 该工具允许设计人员将新的设计特征纳入所提出的模型中，并为所提出的设计生成模拟性能结果，而无需重新执行有限元方法。

公开(公告)号：US06634545B2

公开(公告)日：2003-10-21

申请号：US10008211

申请日：2001-11-07

Applicant: Eli Razon ,  Vaughn Svendsen ,  Robert Kowtko ,  Kyle Dury ,  Krishnan Suresh

Inventor： Eli Razon ,  Vaughn Svendsen ,  Robert Kowtko ,  Kyle Dury ,  Krishnan Suresh

IPC: B23K3512

CPC classification number: B23K3/0623 ,  B23K2101/36 ,  H05K3/3478

Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.

公开(公告)号：US06227437B1

公开(公告)日：2001-05-08

申请号：US09382228

申请日：1999-08-24

Applicant: Eli Razon ,  Vaughn Svendsen ,  Krishnan Suresh ,  Robert Kowtko ,  Kyle Dury

Inventor： Eli Razon ,  Vaughn Svendsen ,  Krishnan Suresh ,  Robert Kowtko ,  Kyle Dury

IPC: B23K120

CPC classification number: B23K3/0623 ,  B23K2101/36 ,  H05K3/3478

Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.

Abstract translation: 公开了一种用于高速，可靠和可重复地将焊料材料递送和回流到衬底上的装置和方法。 该装置具有可重新定位的毛细管，以将单个焊料材料引导到基板上的特定位置。 能量源通过毛细管引导到焊料上以将焊料回流到衬底。 该装置提供将焊料材料单独引入毛细管并且将焊料材料从储存器推向毛细管，同时防止意料之外的堵塞和阻塞焊料材料。