Semiconductor device with scattering bars adjacent conductive lines
    1.
    发明授权
    Semiconductor device with scattering bars adjacent conductive lines 有权
    具有相邻导线的散射棒的半导体器件

    公开(公告)号:US07339272B2

    公开(公告)日:2008-03-04

    申请号:US10867076

    申请日:2004-06-14

    IPC分类号: H01L23/48 H01L23/52 H01L29/50

    CPC分类号: H01L21/31144 H01L21/76838

    摘要: A semiconductor device and method of manufacture thereof wherein scattering bars are disposed on both sides of an isolated conductive line of a semiconductor device to improve the lithography results. The scattering bars have a sufficient width and are spaced a sufficient distance from the isolated conductive line so as to increase the depth of focus of the isolated conductive line during the patterning of the semiconductor device. The scattering bars are left remaining in the finished semiconductor device after the manufacturing process is completed.

    摘要翻译: 一种半导体器件及其制造方法,其中散射棒设置在半导体器件的隔离导电线的两侧,以改善光刻结果。 散射棒具有足够的宽度并且与隔离导电线隔开足够的距离,以便在半导体器件的图案化期间增加隔离导线的焦深。 在制造过程完成之后,散射棒留在完成的半导体器件中。

    Semiconductor device with scattering bars adjacent conductive lines
    2.
    发明申请
    Semiconductor device with scattering bars adjacent conductive lines 有权
    具有相邻导线的散射棒的半导体器件

    公开(公告)号:US20050277067A1

    公开(公告)日:2005-12-15

    申请号:US10867076

    申请日:2004-06-14

    CPC分类号: H01L21/31144 H01L21/76838

    摘要: A semiconductor device and method of manufacture thereof wherein scattering bars are disposed on both sides of an isolated conductive line of a semiconductor device to improve the lithography results. The scattering bars have a sufficient width and are spaced a sufficient distance from the isolated conductive line so as to increase the depth of focus of the isolated conductive line during the patterning of the semiconductor device. The scattering bars are left remaining in the finished semiconductor device after the manufacturing process is completed.

    摘要翻译: 一种半导体器件及其制造方法,其中散射棒设置在半导体器件的隔离导电线的两侧,以改善光刻结果。 散射棒具有足够的宽度并且与隔离导电线隔开足够的距离,以便在半导体器件的图案化期间增加隔离导线的焦深。 在制造过程完成之后,散射棒留在完成的半导体器件中。

    METHOD OF FORMING AND USING PHOTOLITHOGRAPHY MASK HAVING A SCATTERING BAR STRUCTURE
    3.
    发明申请
    METHOD OF FORMING AND USING PHOTOLITHOGRAPHY MASK HAVING A SCATTERING BAR STRUCTURE 有权
    形成和使用具有散射条结构的光刻胶掩模的方法

    公开(公告)号:US20120040276A1

    公开(公告)日:2012-02-16

    申请号:US13277920

    申请日:2011-10-20

    IPC分类号: G03F7/20 G03F1/36

    CPC分类号: G03F1/36

    摘要: A method of forming a photolithography mask including forming a first linear non-dense feature on the mask and forming a plurality of parallel linear assist features disposed substantially perpendicular to the at least one linear non-dense design feature. In an embodiment, the photolithography mask further includes a first transverse linear assist feature disposed substantially transverse to the plurality of parallel linear assist features.

    摘要翻译: 一种形成光刻掩模的方法,包括在掩模上形成第一线性非致密特征并形成基本上垂直于至少一个线性非致密设计特征设置的多个平行线性辅助特征。 在一个实施例中,光刻掩模还包括基本横向于多个平行线性辅助特征设置的第一横向线性辅助特征。

    Photolithography scattering bar structure and method
    5.
    发明申请
    Photolithography scattering bar structure and method 审中-公开
    光刻散射棒结构及方法

    公开(公告)号:US20070111109A1

    公开(公告)日:2007-05-17

    申请号:US11273140

    申请日:2005-11-14

    IPC分类号: G03F1/00

    CPC分类号: G03F1/36

    摘要: A photolithography mask includes a design feature located in an isolated or semi-isolated region of the mask and a plurality of parallel linear assist features disposed substantially perpendicular to the design feature. The plurality of parallel linear assist features may include a first series of parallel assist features disposed on a first side of the design feature and perpendicularly thereto, and a second series of parallel assist features disposed on a second side of the design feature and perpendicularly thereto

    摘要翻译: 光刻掩模包括位于掩模的隔离或半隔离区域中的设计特征以及基本垂直于设计特征设置的多个平行线性辅助特征。 多个平行线性辅助特征可以包括设置在设计特征的第一侧并且垂直于其的第一系列平行辅助特征,以及设置在设计特征的第二侧上且垂直于其的第二系列平行辅助特征

    Method of forming and using photolithography mask having a scattering bar structure
    7.
    发明授权
    Method of forming and using photolithography mask having a scattering bar structure 有权
    具有散射棒结构的光刻掩模的形成和使用方法

    公开(公告)号:US08677290B2

    公开(公告)日:2014-03-18

    申请号:US13277920

    申请日:2011-10-20

    IPC分类号: G03F1/36 G03F1/80 G06F17/50

    CPC分类号: G03F1/36

    摘要: A method of forming a photolithography mask including forming a first linear non-dense feature on the mask and forming a plurality of parallel linear assist features disposed substantially perpendicular to the at least one linear non-dense design feature. In an embodiment, the photolithography mask further includes a first transverse linear assist feature disposed substantially transverse to the plurality of parallel linear assist features.

    摘要翻译: 一种形成光刻掩模的方法,包括在掩模上形成第一线性非致密特征并形成基本上垂直于至少一个线性非致密设计特征设置的多个平行线性辅助特征。 在一个实施例中,光刻掩模还包括基本横向于多个平行线性辅助特征设置的第一横向线性辅助特征。

    Photolithography Scattering Bar Structure And Method
    9.
    发明申请
    Photolithography Scattering Bar Structure And Method 有权
    光刻散射棒结构与方法

    公开(公告)号:US20090246648A1

    公开(公告)日:2009-10-01

    申请号:US12480309

    申请日:2009-06-08

    IPC分类号: G03F1/00

    CPC分类号: G03F1/36

    摘要: A photolithography mask includes a design feature located in an isolated or semi-isolated region of the mask and a plurality of parallel linear assist features disposed substantially perpendicular to the design feature. The plurality of parallel linear assist features may include a first series of parallel assist features disposed on a first side of the design feature and perpendicularly thereto, and a second series of parallel assist features disposed on a second side of the design feature and perpendicularly thereto.

    摘要翻译: 光刻掩模包括位于掩模的隔离或半隔离区域中的设计特征以及基本垂直于设计特征设置的多个平行线性辅助特征。 多个平行线性辅助特征可以包括设置在设计特征的第一侧并且垂直于其的第一系列平行辅助特征,以及设置在设计特征的第二侧上且垂直于其的第二系列平行辅助特征。

    Photolithography mask having a scattering bar structure that includes transverse linear assist features
    10.
    发明授权
    Photolithography mask having a scattering bar structure that includes transverse linear assist features 有权
    具有包括横向线性辅助特征的散射棒结构的光刻掩模

    公开(公告)号:US08048590B2

    公开(公告)日:2011-11-01

    申请号:US12480309

    申请日:2009-06-08

    IPC分类号: G03F1/00

    CPC分类号: G03F1/36

    摘要: A photolithography mask includes a design feature located in an isolated or semi-isolated region of the mask and a plurality of parallel linear assist features disposed substantially perpendicular to the design feature. The plurality of parallel linear assist features may include a first series of parallel assist features disposed on a first side of the design feature and perpendicularly thereto, and a second series of parallel assist features disposed on a second side of the design feature and perpendicularly thereto.

    摘要翻译: 光刻掩模包括位于掩模的隔离或半隔离区域中的设计特征以及基本垂直于设计特征设置的多个平行线性辅助特征。 多个平行线性辅助特征可以包括设置在设计特征的第一侧并且垂直于其的第一系列平行辅助特征,以及设置在设计特征的第二侧上且垂直于其的第二系列平行辅助特征。