公开(公告)号：US20150155211A1

公开(公告)日：2015-06-04

申请号：US14553049

申请日：2014-11-25

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： James E. Eder ,  David C. Schalcosky

IPC: H01L21/66 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L22/20 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/75343 ,  H01L2224/75701 ,  H01L2224/75734 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/81121 ,  H01L2224/8118 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.

Abstract translation: 一种用于接合半导体元件的接合机，所述接合机包括：用于支撑基板的支撑结构; 接合头组件，所述接合头组件包括被配置为将多个半导体元件结合到所述衬底的接合工具; 对准结构，包括第一对准标记; 对准元件，其被配置为使用所述接合工具放置在所述对准结构上，所述对准元件包括第二对准标记; 成像系统，被配置为对所述第一对准标记和对应的所述第二对准标记的相对位置进行成像; 以及计算机系统，被配置为在将所述多个半导体元件中的至少一个半导体元件接合到所述衬底期间提供对所述接合工具和所述支撑结构中的至少一个的位置的调整，所述计算机被配置为提供所述调整至少部分地基于 在第一对准标记和对应的第二对准标记的相对位置上，该调整特定于将多个半导体元件中的多个半导体元件与衬底的相应区域的接合。

公开(公告)号：US11295996B2

公开(公告)日：2022-04-05

申请号：US16872633

申请日：2020-05-12

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： James E. Eder ,  David C. Schalcosky

IPC: B32B41/00 ,  H01L21/66 ,  H01L23/544 ,  H01L23/00

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.

公开(公告)号：US20180090395A1

公开(公告)日：2018-03-29

申请号：US15830164

申请日：2017-12-04

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： James E. Eder ,  David C. Schalcosky

IPC: H01L21/66 ,  H01L23/544 ,  H01L23/00

CPC classification number: H01L22/20 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/75343 ,  H01L2224/75701 ,  H01L2224/75734 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/81121 ,  H01L2224/8118 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.

公开(公告)号：US20220384384A1

公开(公告)日：2022-12-01

申请号：US17828966

申请日：2022-05-31

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： Matthew B. Wasserman ,  James E. Eder ,  Michael P. Schmidt-Lange ,  Matthew E. Tarabulski

IPC: H01L23/00

Abstract: An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.

公开(公告)号：US20200273759A1

公开(公告)日：2020-08-27

申请号：US16872633

申请日：2020-05-12

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： James E. Eder ,  David C. Schalcosky

IPC: H01L21/66 ,  H01L23/544 ,  H01L23/00

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.

公开(公告)号：US10692783B2

公开(公告)日：2020-06-23

申请号：US15830164

申请日：2017-12-04

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： James E. Eder ,  David C. Schalcosky

IPC: B32B41/00 ,  H01L21/66 ,  H01L23/544 ,  H01L23/00

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.