摘要:
In an embodiment, the invention provides a PLCC package comprising first and second lead frames, a plastic structural body, a light source, an encapsulant, and an optical lens. The first lead frame comprises two tongues and a reflector cup. The first and second lead frames are attached to the plastic structural body. The light source is mounted and electrically connected at the bottom of the inside of the reflector cup. The light source is also electrically connected to the second lead frame by a wire bond. The reflector cup is surrounded on at least four sides by the encapsulant, the encapsulant having a domed portion that functions as the optical lens, the encapsulant being an integral single piece structure.
摘要:
Methods of making a light emitter are disclosed herein. An embodiment of a method comprises fabricating a line of first leads, the line of first leads comprising a plurality connected individual first leads; fabricating a line of second leads, the line of second leads comprising a plurality of connected individual second leads; physically connecting the line of first leads to the line of second leads, wherein a first individual first lead is adjacent a first individual second lead; attaching a light emitting device to the first individual first lead; electrically connecting the light emitting device to the first individual second lead; encapsulating a portion of the individual first lead and a portion of the individual second lead as a single unit; and separating the encapsulated first individual lead and the second individual lead from the first line of leads and the second line of leads.
摘要:
In an embodiment, the invention provides a light source comprising a plurality of light-emitting semiconductor chips, a plurality of electrical leads and an encapsulant. The plurality of electrical leads is connected to the plurality of light-emitting semiconductor chips. The encapsulant completely encases the plurality of semiconductor chips. The encapsulant partially encases the plurality of electrical leads.
摘要:
In an embodiment, the invention provides a light source comprising a plurality of light-emitting semiconductor chips, a plurality of electrical leads and an encapsulant. The plurality of electrical leads is connected to the plurality of light-emitting semiconductor chips. The encapsulant completely encases the plurality of semiconductor chips. The encapsulant partially encases the plurality of electrical leads.
摘要:
Methods of making a light emitter are disclosed herein. An embodiment of a method comprises fabricating a line of first leads, the line of first leads comprising a plurality connected individual first leads; fabricating a line of second leads, the line of second leads comprising a plurality of connected individual second leads; physically connecting the line of first leads to the line of second leads, wherein a first individual first lead is adjacent a first individual second lead; attaching a light emitting device to the first individual first lead; electrically connecting the light emitting device to the first individual second lead; encapsulating a portion of the individual first lead and a portion of the individual second lead as a single unit; and separating the encapsulated first individual lead and the second individual lead from the first line of leads and the second line of leads.
摘要:
A light-emitting device having an anode and a cathode is disclosed herein. An embodiment of the light-emitting device comprises a first lead connected to the anode of the light-emitting device and a second lead connected to the cathode of the light-emitting device. The first lead has a first bend, wherein the direction of the first bend indicates that the first lead is connected to the anode. The second lead has a second bend, wherein the direction of the second bend indicates that the second lead is connected to the cathode.
摘要:
In an embodiment, the invention provides a light source comprising a plurality of light-emitting semiconductor chips, a plurality of electrical leads and an encapsulant. The plurality of electrical leads is connected to the plurality of light-emitting semiconductor chips. The encapsulant completely encases the plurality of semiconductor chips. The encapsulant partially encases the plurality of electrical leads.
摘要:
A light-emitting device having an anode and a cathode is disclosed herein. An embodiment of the light-emitting device comprises a first lead connected to the anode of the light-emitting device and a second lead connected to the cathode of the light-emitting device. The first lead has a first bend, wherein the direction of the first bend indicates that the first lead is connected to the anode. The second lead has a second bend, wherein the direction of the second bend indicates that the second lead is connected to the cathode.
摘要:
A light source is described herein. An embodiment of the light source comprises a mounting surface and a first lead frame. The first lead frame extends from the mounting surface. The first lead frame comprises a first portion extending from the mounting surface; a cup portion having a cup portion first side and a cup portion second side, the cup portion first side configured to receive a light-emitting diode, the cup portion second side being located opposite the cup portion first side; and a second portion extending between the first portion and the cup portion second side.