公开(公告)号：US5266834A

公开(公告)日：1993-11-30

申请号：US915761

申请日：1992-07-21

申请人： Kunihiko Nishi ,  Michio Tanimoto ,  Toshihiro Yasuhara ,  Katsuhiro Tabata ,  Yasuhiro Yoshikawa ,  Isao Akima ,  Souichi Kunito ,  Toshio Nosaka ,  Hideaki Nakamura

发明人： Kunihiko Nishi ,  Michio Tanimoto ,  Toshihiro Yasuhara ,  Katsuhiro Tabata ,  Yasuhiro Yoshikawa ,  Isao Akima ,  Souichi Kunito ,  Toshio Nosaka ,  Hideaki Nakamura

IPC分类号： H01L23/495 ,  H01L25/10 ,  H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49568 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.

摘要翻译： 提供了用于实现更高的堆积密度和更高的存储器电路集成的封装，特别地，提供了具有堆叠的多个薄的表面贴装封装的结构。 每个层叠包装包括半导体颗粒，固定在颗粒的前表面的引线，固定到其后表面的散热板和树脂模制构件。 为了实现稳定的层压结构，模具构件在颗粒的前侧成形为凸形，并且在其后侧成为凹形，使得一个包装的凹部能够与凸部接合 的另一个包。