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    System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
    2.
    发明申请
    System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control 审中-公开

    公开(公告)号：US20060105685A1

    公开(公告)日：2006-05-18

    申请号：US11282223

    申请日：2005-11-18

    申请人： Jiro Kajiwara ,  Gerard Moloney ,  Huey-Ming Wang ,  David Hansen ,  Alejandro Reyes

    发明人： Jiro Kajiwara ,  Gerard Moloney ,  Huey-Ming Wang ,  David Hansen ,  Alejandro Reyes

    IPC分类号： B24B7/30 ,  B24B29/00

    CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

    摘要： In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface. A carrier or subcarrier for a CMP apparatus that includes: a plate having an outer surface; a first pressure chamber for exerting a force to urge the plate in a predetermined direction; a spacer coupled to a peripheral outer edge of the plate; a membrane coupled to the plate via the spacer and separated from the plate by a thickness of the spacer; and a second pressure chamber defined between the membrane and the plate surface for exerting a second force to urge the membrane in a third predetermined direction. Substrate, such as a semiconductor wafer, processed or fabricated according to the invention.

    Slurry distributor for chemical mechanical polishing apparatus and method of using the same
    5.
    发明申请
    Slurry distributor for chemical mechanical polishing apparatus and method of using the same 审中-公开
    化学机械抛光装置用浆料分配器及其使用方法

    公开(公告)号：US20050130566A1

    公开(公告)日：2005-06-16

    申请号：US11043531

    申请日：2005-01-25

    申请人： Jiro Kajiwara ,  Gerard Moloney ,  Jun Liu ,  Junsheng Yang ,  Ernesto Saldana ,  Cormac Walsh ,  Alejandro Reyes

    发明人： Jiro Kajiwara ,  Gerard Moloney ,  Jun Liu ,  Junsheng Yang ,  Ernesto Saldana ,  Cormac Walsh ,  Alejandro Reyes

    IPC分类号： B24B37/04 ,  B24B57/02 ,  H01L21/304 ,  B24B49/00

    CPC分类号： B24B37/04 ,  B24B57/02

    摘要： A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, apparatus (100) includes: (i) platen (106) with polishing surface (110); (ii) head (116) adapted to hold substrate (102) against polishing surface; (iii) mechanism to rotate platen (106) during polishing; (iv) dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) distributor (125) between the nozzles (126, 128) and head (116). In one embodiment, apparatus (100) further includes a wiper (180) between head (116) and distributor (125) to remove used slurry and polishing byproducts from surface (110), thereby reducing agglomerations or deposits that can damage substrate (102) and improving yield. Optionally, apparatus (100) further includes dispenser (186) for dispensing a fluid before and/or after wiper (180) to substantially eliminate buildup of deposits. Method for polishing and substrate polished according to method.

    摘要翻译： 提供抛光装置（100），用于抛光具有改善平坦化均匀性的浆料分配器（125）的基底（102）。 通常，设备（100）包括：（i）具有抛光表面（110）的压板（106）; （ii）适于将衬底（102）保持在抛光表面上的头部（116） （iii）在抛光期间旋转压板（106）的机构; （iv）具有喷嘴（126,128）的分配器（124），用于在所述表面（110）上分配浆料; 和（v）在喷嘴（126,128）和头部（116）之间的分配器（125）。 在一个实施例中，设备（100）还包括头部（116）和分配器（125）之间的擦拭器（180），以去除使用的浆料并从表面（110）抛光副产物，从而减少可损坏基底（102）的团聚或沉积， 并提高产量。 可选地，装置（100）还包括用于在擦拭器（180）之前和/或之后分配流体以基本上消除沉积物累积的分配器（186）。 抛光方法和基材抛光方法。

    Slurry distributor for chemical mechanical polishing apparatus and method of using the same
    6.
    发明授权
    Slurry distributor for chemical mechanical polishing apparatus and method of using the same 失效
    化学机械抛光装置用浆料分配器及其使用方法

    公开(公告)号：US06887132B2

    公开(公告)日：2005-05-03

    申请号：US10234780

    申请日：2002-09-03

    申请人： Jiro Kajiwara ,  Gerard Moloney ,  Jun Liu ,  Junsheng Yang ,  Ernesto Saldana ,  Cormac Walsh ,  Alejandro Reyes

    发明人： Jiro Kajiwara ,  Gerard Moloney ,  Jun Liu ,  Junsheng Yang ,  Ernesto Saldana ,  Cormac Walsh ,  Alejandro Reyes

    IPC分类号： B24B37/04 ,  B24B57/02 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B37/04 ,  B24B57/02

    摘要： A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield. Optionally, the apparatus (100) further includes a dispenser (186) for dispensing a cleaning fluid before and/or after the wiper (180) to substantially eliminate buildup of deposits.

    摘要翻译： 提供抛光装置（100），用于抛光具有改善平坦化均匀性的浆料分配器（125）的基底（102）。 通常，设备（100）包括：（i）具有抛光表面（110）的压板（106）; （ii）适于将衬底（102）保持在抛光表面上的头部（116）; （iii）在抛光期间使压板（106）旋转的机构; （iv）具有用于在所述表面（110）上分配浆料的喷嘴（126,128）的分配器（124）; 和（v）在喷嘴（126,128）和头部（116）之间的分配器（125）。 在一个实施例中，设备（100）还包括位于头部（116）和分配器（125）之间的擦拭器（180），以从表面（110）去除所使用的浆料和抛光副产品，从而减少可能损坏的附聚物 基底（102）并提高产量。 可选地，装置（100）还包括用于在擦拭器（180）之前和/或之后分配清洁流体以基本上消除沉积物累积的分配器（186）。