公开(公告)号：US20060121203A1

公开(公告)日：2006-06-08

申请号：US10527712

申请日：2003-09-11

申请人： Kuniko Kimura ,  Kei Kobayashi ,  Hirofumi Yamada ,  Toshihisa Horiuchi ,  Kenji Ishida ,  Kazumi Matsushige

发明人： Kuniko Kimura ,  Kei Kobayashi ,  Hirofumi Yamada ,  Toshihisa Horiuchi ,  Kenji Ishida ,  Kazumi Matsushige

IPC分类号： B05D1/36

CPC分类号： B01J19/0013 ,  B01J19/1887 ,  B82B3/00 ,  G01Q80/00

摘要： A totally new method for manufacturing a thin film wherein only an arbitrary small region is structurally controlled. The structure of a film is controlled by applying a force to the entire film or an arbitrary region of the film using a part having a sharp tip during the film-forming process or after finishing the film formation. At this time, the temperature of the film is set at the glass transition point of the amorphous region or higher. An atomic force microscope can be used as an apparatus for realizing this manufacturing method.

摘要翻译： 一种全新的制造薄膜的方法，其中只有结构上控制任意的小区域。 通过在成膜过程中或在成膜完成之后，使用具有尖锐尖端的部分在膜的整个膜或任意区域上施加力来控制膜的结构。 此时，将膜的温度设定在非晶区域的玻璃化转变点以上。 原子力显微镜可以用作实现该制造方法的装置。

公开(公告)号：US20090072143A1

公开(公告)日：2009-03-19

申请号：US12282552

申请日：2007-03-19

申请人： Kenji Ishida ,  Shuichiro Kuwajima ,  Kazumi Matsushige ,  Toshihisa Horiuchi ,  Arifumi Matsumoto ,  Tetsuhiro Kodani ,  Meiten Koh

发明人： Kenji Ishida ,  Shuichiro Kuwajima ,  Kazumi Matsushige ,  Toshihisa Horiuchi ,  Arifumi Matsumoto ,  Tetsuhiro Kodani ,  Meiten Koh

IPC分类号： G01J5/00

CPC分类号： G01J5/34 ,  H01L37/025

摘要： There is provided a pyroelectric infrared sensor being capable of changing its shape and having high sensitivity. The sensor comprises the substrate 11 made of a polymer material such as polyimide or polyethylene terephthalate and having flexibility, the layer 13 comprising vinylidene fluoride (VDF), and the flexible electrodes 12 and 14 comprising an Al-deposited film and provided on and under the VDF oligomer layer 13. The pyroelectric infrared sensor of the present invention has flexibility as a whole due to flexibility of each component elements and can be formed into desired shapes. In addition, since a substrate made of a polymer material has heat capacity and heat conductivity lower than those of Si substrates used on conventional pyroelectric infrared sensors, sensitivity of the sensor can be increased.

摘要翻译： 提供了能够改变其形状并具有高灵敏度的热释电红外传感器。 该传感器包括由诸如聚酰亚胺或聚对苯二甲酸乙二醇酯的聚合物材料制成并具有柔性的衬底11，包含偏二氟乙烯（VDF）的层13以及包含Al沉积膜的柔性电极12和14， VDF低聚物层13.本发明的热电型红外线传感器由于各构成要素的柔软性而具有整体的柔软性，可以形成为所希望的形状。 此外，由于由聚合物材料制成的基板具有比常规热电型红外线传感器所使用的Si基板的热容量和导热率低的传热装置，所以能够提高传感器的灵敏度。

公开(公告)号：US06702175B1

公开(公告)日：2004-03-09

申请号：US10009168

申请日：2001-12-07

申请人： Kazumi Matsushige ,  Toshihisa Horiuchi ,  Takashi Ikari ,  Kenichiro Suetsugu ,  Masato Hirano ,  Shunji Hibino ,  Atsushi Yamaguchi

发明人： Kazumi Matsushige ,  Toshihisa Horiuchi ,  Takashi Ikari ,  Kenichiro Suetsugu ,  Masato Hirano ,  Shunji Hibino ,  Atsushi Yamaguchi

IPC分类号： B23K106

CPC分类号： B23K1/06 ,  B23K1/20 ,  B23K35/262 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3463

摘要： There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

摘要翻译： 提供了一种焊接无铅焊料的方法，其降低无铅焊料的熔点并防止在由无铅焊料接合的部分处的接合强度的劣化，以及使用 焊接方法。 作为不含铅的锡的合金的无铅焊料熔化，并且当熔融的铅 - 铅焊料作为熔融的铅 - 铅焊料时，超声波振动至少与通过无铅焊料接合的接合体或无铅焊料起作用， 自由焊料固化。 因此，无铅焊料中含有的成分的晶体变细，并且防止了被包含的部件在接合物的接合界面处偏析，从而可以提高接合界面处的接合强度。