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公开(公告)号：USD532730S1
公开(公告)日：2006-11-28
申请号：US29261949
申请日：2006-06-23
申请人： Kunio Kohara , Keiko Itou , Shuichi Tsunoda , Osamu Nakajima
设计人： Kunio Kohara , Keiko Itou , Shuichi Tsunoda , Osamu Nakajima
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公开(公告)号：US07871842B2
公开(公告)日：2011-01-18
申请号：US12244799
申请日：2008-10-03
申请人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
发明人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/09701 , H01L2924/00014
摘要： The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
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公开(公告)号：USD534470S1
公开(公告)日：2007-01-02
申请号：US29261661
申请日：2006-06-19
申请人： Naoaki Tsuchiya , Shuichi Tsunoda
设计人： Naoaki Tsuchiya , Shuichi Tsunoda
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4.发明授权Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package 失效用于表面贴装陶瓷LED封装的生产工艺，由所述生产工艺生产的表面贴装陶瓷LED封装以及用于生产所述封装的模具公开(公告)号：US07943408B2
公开(公告)日：2011-05-17
申请号：US12960875
申请日：2010-12-06
申请人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
发明人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/09701 , H01L2924/00014
摘要： The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
摘要翻译： 本发明涉及一种表面安装陶瓷LED封装及其制造方法，包括：将具有孔的陶瓷生片和第二陶瓷生片分层，将具有凹槽的模具插入底部形成隔板 的陶瓷生片基板，烧成陶瓷生片基板。
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公开(公告)号：US07923277B1
公开(公告)日：2011-04-12
申请号：US12960886
申请日：2010-12-06
申请人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
发明人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/09701 , H01L2924/00014
摘要： The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
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公开(公告)号：US20110076793A1
公开(公告)日：2011-03-31
申请号：US12960875
申请日：2010-12-06
申请人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
发明人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
IPC分类号： H01L33/48
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/09701 , H01L2924/00014
摘要： The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
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7.发明申请PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE 有权表面安装陶瓷LED封装，由生产工艺生产的表面安装陶瓷LED封装的生产工艺和用于生产包装的模具公开(公告)号：US20110073242A1
公开(公告)日：2011-03-31
申请号：US12960886
申请日：2010-12-06
申请人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
发明人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/09701 , H01L2924/00014
摘要： The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
摘要翻译： 本发明涉及一种表面安装陶瓷LED封装及其制造方法，包括：将具有孔的陶瓷生片和第二陶瓷生片分层，将具有凹槽的模具插入底部形成隔板 的陶瓷生片基板，烧成陶瓷生片基板。
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