BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND
    1.
    发明申请
    BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND 审中-公开
    粘合方法,粘合剂改性剂,表面改性方法,表面改性剂和新化合物

    公开(公告)号:US20160152641A1

    公开(公告)日:2016-06-02

    申请号:US14954147

    申请日:2015-11-30

    摘要: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

    摘要翻译: 为了提供一种可以在材料表面上有效形成-OH基团的技术,其目的在于使材料适合于利用化学反应(化学结合)的结合(例如,用于分子键合)。 [解决方案]接合基板A和基板B的接合方法,其包括:在基板A的表面上涂覆含有下述化合物(α)的试剂的工序; 将基板B配置成与基板A的表面上存在的化合物(α)相对的步骤; 以及通过对基板A和/或基板B施加力将基板A和基板B一体接合的步骤。化合物(α)是具有OH基或OH形成基的化合物,叠氮化物 基团和三嗪环,并且基材A使用聚合物构成。