Surface-Mount Inductor
    1.
    发明申请
    Surface-Mount Inductor 审中-公开
    表面贴装电感

    公开(公告)号:US20140062640A1

    公开(公告)日:2014-03-06

    申请号:US14019130

    申请日:2013-09-05

    IPC分类号: H01F3/08

    摘要: [TECHNICAL PROBLEM]The present invention provides a surface-mount inductor allowing the Q to be improved at a higher frequency and preventing the efficiency of the inductor from getting worse even at the higher frequency.[SOLUTION TO THE PROBLEM]A surface-mount inductor comprises: a coil formed by winding a conductive wire; and a core containing the coil and formed by subjecting a mixture of a magnetic powder and a binder to powder-compacting. The magnetic powder contains plural types of magnetic powders each having a different particle size from the other, and the plural types of magnetic powders are mixed to satisfy the following relationship: Σan·Φn≦10 μm, where an is a mixing ratio, Φn is an average particle size, and n is an integer of 2 or more.

    摘要翻译: 技术问题本发明提供了一种表面贴装电感器,其允许以更高的频率改进Q,并且甚至在较高的频率下也防止电感器的效率变差。 背景技术表面安装电感器包括:通过缠绕导线形成的线圈; 以及包含线圈并通过使磁粉和粘合剂的混合物进行粉末压实而形成的芯。 磁性粉末含有多种类型的各自具有不同粒径的磁性粉末,并且混合多种类型的磁性粉末以满足以下关系:Sigmaan·Phin @ 10um,其中a为混合比,Phin为 平均粒径,n为2以上的整数。

    Surface-Mount Inductor
    2.
    发明申请
    Surface-Mount Inductor 审中-公开
    表面贴装电感

    公开(公告)号:US20140062639A1

    公开(公告)日:2014-03-06

    申请号:US14019112

    申请日:2013-09-05

    IPC分类号: H01F3/08

    摘要: [TECHNICAL PROBLEM]Present invention provides a surface-mount inductor allowing the Q to be improved at a higher frequency and preventing the efficiency of the inductor from getting worse even at the higher frequency.[SOLUTION TO THE PROBLEM]A surface-mount inductor comprises: a coil formed by winding a conductive wire; and a core comprising mainly of a magnetic powder and a resin and containing the coil therein. The magnetic powder contains plural types of magnetic powders each having a different particle size from others, and the plural types of magnetic powders are mixed to satisfy the following relationship: Σan·Φn≦10 μm, where an is a mixing ratio, Φn is an average particle size, and n is an integer of 2 or more.

    摘要翻译: 技术问题本发明提供了一种表面贴装电感器,其允许以更高的频率改进Q,并且防止电感器即使在较高频率下也会变差。 背景技术表面安装电感器包括:通过缠绕导线形成的线圈; 以及主要由磁性粉末和树脂构成并且包含线圈的芯体。 磁性粉末含有与其他粒径不同的多种类型的磁性粉末,混合多种类型的磁性粉末以满足以下关系:Sigmaan·Phin @ 10um,其中a为混合比,Phin为 平均粒径,n为2以上的整数。

    Method for Producing Surface-Mount Inductor
    3.
    发明申请
    Method for Producing Surface-Mount Inductor 审中-公开
    生产表面贴装电感的方法

    公开(公告)号:US20130255071A1

    公开(公告)日:2013-10-03

    申请号:US13854590

    申请日:2013-04-01

    IPC分类号: H01F41/02

    摘要: A method of producing a surface-mount inductor having an external electrode with high connection reliability even in a high-humidity environment is provided.The method comprises the steps of: forming a coil by winding an electrically-conductive wire having a self-bonding coating; forming a core portion using a sealant comprising metal magnetic powders and a resin so as to encapsulate the coil while allowing each of opposite ends of the coil to be at least partially exposed on a surface of the core portion; applying an electrically-conductive paste containing metal fine particles having a sintering temperature of 250° C. or less onto the surface of the core portion; and forming an underlying electrode on the surface of the core portion by sintering the metal fine particles through a heat treatment of the core portion to achieve electrical conduction with the coil.

    摘要翻译: 提供了即使在高湿度环境下也具有具有高连接可靠性的外部电极的表面安装电感器的制造方法。 该方法包括以下步骤:通过缠绕具有自粘合涂层的导电丝来形成线圈; 使用包含金属磁性粉末和树脂的密封剂形成芯部,以便使所述线圈封装,同时使所述线圈的每个相对端至少部分地暴露在所述芯部的表面上; 将含有烧结温度为250℃以下的金属微粒的导电性糊料涂布在芯部的表面上; 以及通过对所述芯部进行热处理来烧结所述金属微粒而在所述芯部的表面上形成下面的电极,以实现与所述线圈的导电。

    Surface mount coil component
    5.
    发明申请
    Surface mount coil component 审中-公开
    表面贴装线圈组件

    公开(公告)号:US20060022788A1

    公开(公告)日:2006-02-02

    申请号:US11193596

    申请日:2005-07-29

    IPC分类号: H01F27/30

    摘要: An object is to provide a highly reliable surface mount coil component quickly and reliably forming thermo-compression bonding on an occasion of thermo-compression bonding by a heater chip, and reliably fixing the metal plate terminal, in a surface mount coil component having thermo-compression bonding of a winding wire and a metal plate terminal. In a surface mount coil component including a winding wire 2, a core 1 and a metal plate terminal 3, the metal plate terminal 3 integrally includes a fixing part 3b which is bonded and fixed to the core 1, a joint part 3a to which an end of the winding wire is bonded by thermo-compression bonding, and a mount part 3c which is connected to an external circuit, the fixing part 3c is integrally included between the joint part 3a and the mount part 3b, and a sectional reduced portion 5 is formed between the joint part 3a and the fixing part 3b.

    摘要翻译: 本发明的目的是提供一种高可靠性的表面安装线圈部件,其在通过加热片进行热压接的情况下快速且可靠地形成热压接,并且将金属板端子可靠地固定在具有热敏粘合的表面安装线圈部件中, 绕组线和金属板端子的压接。 在包括绕组线2,芯1和金属板端子3的表面安装线圈部件中,金属板端子3一体地包括固定部3b,其固定到芯部1上,接合部分3a〜 绕组线的一端通过热压接合而结合,以及与外部电路连接的安装部分3c,固定部分3c整体地包括在接合部分3a和安装部分3b之间, 并且在接合部分3a和固定部分3b之间形成有截面减小部分5。

    Resin Composition, Electronic Component using the Same and Production Method Therefor
    6.
    发明申请
    Resin Composition, Electronic Component using the Same and Production Method Therefor 有权
    树脂组合物,使用该组合物的电子部件及其制造方法

    公开(公告)号:US20120299688A1

    公开(公告)日:2012-11-29

    申请号:US13571015

    申请日:2012-08-09

    IPC分类号: H01F5/00

    CPC分类号: H01F1/28 H01F1/37 H01F41/0246

    摘要: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa.s as measured at room temperature.

    摘要翻译: 公开了一种树脂组合物,其包含其中含有40体积%以上的热固性树脂,其中含有5〜30体积%的蜡,其中:所述热固性树脂在室温下以液体形式存在 ; 蜡在室温下呈粉末形式存在,熔点为70〜150℃,树脂组合物在室温下的粘度为50000〜150000mPa.s。

    Resin Composition, Electronic Component using the Same and Production Method Therefor
    7.
    发明申请
    Resin Composition, Electronic Component using the Same and Production Method Therefor 审中-公开
    树脂组合物,使用该组合物的电子部件及其制造方法

    公开(公告)号:US20100155648A1

    公开(公告)日:2010-06-24

    申请号:US12640792

    申请日:2009-12-17

    IPC分类号: H01F1/00 B05D5/12

    CPC分类号: H01F1/28 H01F1/37 H01F41/0246

    摘要: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa·s as measured at room temperature.

    摘要翻译: 公开了一种树脂组合物,其包含其中含有40体积%以上的热固性树脂,其中含有5〜30体积%的蜡,其中:所述热固性树脂在室温下以液体形式存在 ; 蜡在室温下呈粉末状存在,熔点为70〜150℃,树脂组合物的室温下的粘度为50000〜150000mPa·s。

    Resin composition, electronic component using the same and production method therefor
    8.
    发明授权
    Resin composition, electronic component using the same and production method therefor 有权
    树脂组合物,使用该组合物的电子部件及其制造方法

    公开(公告)号:US08610526B2

    公开(公告)日:2013-12-17

    申请号:US13571015

    申请日:2012-08-09

    CPC分类号: H01F1/28 H01F1/37 H01F41/0246

    摘要: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa·s as measured at room temperature.

    摘要翻译: 公开了一种树脂组合物,其包含其中含有40体积%以上的热固性树脂,其中含有5〜30体积%的蜡,其中:所述热固性树脂在室温下以液体形式存在 ; 蜡在室温下呈粉末状存在,熔点为70〜150℃,树脂组合物的室温下的粘度为50000〜150000mPa·s。