公开(公告)号：US08662959B2

公开(公告)日：2014-03-04

申请号：US12608037

申请日：2009-10-29

申请人： Kunitaka Kuriyama ,  Masahiko Fukuta ,  Katsuhiko Sekiya ,  Yasuo Yamane

发明人： Kunitaka Kuriyama ,  Masahiko Fukuta ,  Katsuhiko Sekiya ,  Yasuo Yamane

IPC分类号： B24B1/00

CPC分类号： B24B13/046 ,  B23B1/00 ,  B23B5/36 ,  B23B27/20 ,  B23B2222/28 ,  B23Q5/28

摘要： A method of cutting a workpiece made of a highly-hard material is provided. The workpiece is cut by a machining device including a workpiece holder that holds the workpiece, a spindle device that rotates the workpiece holder, a tool holder that holds a tool, and a relative moving mechanism that relatively moves the workpiece holder and the tool holder at least in two axial directions orthogonal to each other. In the machining device, positioning errors in the axial directions are within 5 nm.

摘要翻译： 提供了切割由高硬度材料制成的工件的方法。 工件由包括保持工件的工件保持器，旋转工件保持架的主轴装置，保持工具的工具夹具和相对移动机构切削，该相对移动机构使工件保持器和工具夹具相对移动 至少在彼此正交的两个轴向方向上。 在加工装置中，轴向的定位误差在5nm以内。

公开(公告)号：US07929136B2

公开(公告)日：2011-04-19

申请号：US12532097

申请日：2007-09-19

申请人： Tadashi Makiyama ,  Takuya Kawamoto ,  Yasuo Yamane ,  Katsuhiko Sekiya

发明人： Tadashi Makiyama ,  Takuya Kawamoto ,  Yasuo Yamane ,  Katsuhiko Sekiya

IPC分类号： G01N21/00

CPC分类号： B23Q17/24 ,  B23Q11/1046 ,  G01N21/53 ,  G01N2021/4726 ,  Y02P70/169

摘要： An object of the present invention is to provide a mist measuring apparatus in which visual confirmation performance is enhanced, and high-accuracy detection is enabled. In the mist measuring apparatus including a housing, and a light source that is provided in this housing and emits light to a misty cutting fluid, the housing is provided around an ejection part of the misty cutting fluid, the light emitted from the light source is a visible ray, and the housing is provided with an observation part for observing scattered light from the misty cutting fluid.

摘要翻译： 本发明的目的是提供一种能够提高视觉确认性能并能够进行高精度检测的雾度测量装置。 在包括壳体的雾度测量装置和设置在该壳体中并发光到雾状切削液的光源中，壳体设置在雾状切削液的喷射部分周围，从光源发射的光是 可见光线，并且壳体设置有用于观察来自雾状切削液的散射光的观察部。

公开(公告)号：US20100103415A1

公开(公告)日：2010-04-29

申请号：US12532097

申请日：2007-09-19

申请人： Tadashi Makiyama ,  Takuya Kawamoto ,  Yasuo Yamane ,  Katsuhiko Sekiya

发明人： Tadashi Makiyama ,  Takuya Kawamoto ,  Yasuo Yamane ,  Katsuhiko Sekiya

IPC分类号： G01N21/00

CPC分类号： B23Q17/24 ,  B23Q11/1046 ,  G01N21/53 ,  G01N2021/4726 ,  Y02P70/169

摘要： An object of the present invention is to provide a mist measuring apparatus in which visual confirmation performance is enhanced, and high-accuracy detection is enabled. In the mist measuring apparatus including a housing, and a light source that is provided in this housing and emits light to a misty cutting fluid, the housing is provided around an ejection part of the misty cutting fluid, the light emitted from the light source is a visible ray, and the housing is provided with an observation part for observing scattered light from the misty cutting fluid.

摘要翻译： 本发明的目的是提供一种能够提高视觉确认性能并能够进行高精度检测的雾度测量装置。 在包括壳体的雾度测量装置和设置在该壳体中并发光到雾状切削液的光源中，壳体设置在雾状切削液的喷射部分周围，从光源发射的光是 可见光线，并且壳体设置有用于观察来自雾状切削液的散射光的观察部。

公开(公告)号：US20110097875A1

公开(公告)日：2011-04-28

申请号：US12909078

申请日：2010-10-21

申请人： Yohei Gokita ,  Takashi Yamaguchi ,  Masashi Koyama ,  Masashi Aoki ,  Masaaki Suzuki ,  Katsuhiko Sekiya ,  Ye Chen ,  Keiichi Kajiyama ,  Toshiharu Daii

发明人： Yohei Gokita ,  Takashi Yamaguchi ,  Masashi Koyama ,  Masashi Aoki ,  Masaaki Suzuki ,  Katsuhiko Sekiya ,  Ye Chen ,  Keiichi Kajiyama ,  Toshiharu Daii

IPC分类号： H01L21/78

CPC分类号： H01L21/78

摘要： A wafer processing method for dividing a wafer into individual devices along a plurality of crossing streets formed on the front side of the wafer, the individual devices being respectively formed in a plurality of regions partitioned by the streets. The wafer processing method includes the steps of attaching the front side of the wafer to a dicing tape supported to an annular dicing frame, grinding the back side of the wafer to reduce the thickness of the wafer to a predetermined thickness, forming a break start point along each street from the back side of the wafer, applying an external force to the wafer to break the wafer along each street where the break start point is formed, thereby dividing the wafer into the individual devices, attaching the back side of the wafer to a front side of an adhesive tape supported to an annular frame and next removing the adhesive tape from the front side of the adhesive tape, and peeling off and picking up each device from the adhesive tape.

摘要翻译： 一种晶片处理方法，用于沿着形成在晶片的前侧上的多个交叉街道将晶片分割为各个装置，各个装置分别形成在由街道分隔开的多个区域中。 晶片处理方法包括以下步骤：将晶片的前侧附接到支撑在环形切割框架上的切割带，研磨晶片的背面以将晶片厚度减小到预定厚度，形成断点起点 沿着从晶片的背面的每个街道，向晶片施加外力，以沿着形成断裂起点的每个街道破碎晶片，从而将晶片分成各个装置，将晶片的背面附着到 将胶带的前侧支撑在环形框架上，然后从胶带的前侧去除胶带，并从胶带上剥离和拾取每个装置。