Laminated film for head applications
    1.
    发明申请
    Laminated film for head applications 有权
    用于头部应用的层压膜

    公开(公告)号:US20090009907A1

    公开(公告)日:2009-01-08

    申请号:US11825034

    申请日:2007-07-03

    IPC分类号: G11B5/127 G11B5/147

    CPC分类号: G11B5/3116 G11B5/1278

    摘要: A laminated main pole layer is disclosed in which a non-AFC scheme is used to break the magnetic coupling between adjacent high moment layers and reduce remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. An amorphous material layer with a thickness of 3 to 20 Angstroms and made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, or Si is inserted between adjacent high moment stacks. The laminated structure also includes an alignment layer below each high moment layer within each stack. In one embodiment, a Ru coupling layer is inserted between two high moment layers in each stack to introduce an AFC scheme. An uppermost Ru layer is used as a CMP stop layer. A post annealing process may be employed to further reduce the anisotropy field (Hk).

    摘要翻译: 公开了一种层叠主极层,其中使用非AFC方案来破坏相邻的高力矩层之间的磁耦合,并且在保持高磁矩的同时降低硬轴方向的剩磁,并实现Hch,Hce和 Hk。 由Hf,Zr,Ta,Al,Mg,Zn或Si中的一种或多种的氧化物,氮化物或氧氮化物形成的厚度为3〜20埃的无定形材料层插入相邻的高强度叠层之间。 层叠结构还包括在每个堆叠内的每个高力矩层下面的对准层。 在一个实施例中,Ru耦合层插入每个堆叠中的两个高矩层之间以引入AFC方案。 使用最上层的Ru层作为CMP停止层。 可以采用后退火工艺来进一步降低各向异性场(Hk)。

    Laminated film for head applications
    2.
    发明授权
    Laminated film for head applications 有权
    用于头部应用的层压膜

    公开(公告)号:US07773341B2

    公开(公告)日:2010-08-10

    申请号:US11825034

    申请日:2007-07-03

    IPC分类号: G11B5/33

    CPC分类号: G11B5/3116 G11B5/1278

    摘要: A laminated main pole layer is disclosed in which a non-AFC scheme is used to break the magnetic coupling between adjacent high moment layers and reduce remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. An amorphous material layer with a thickness of 3 to 20 Angstroms and made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, or Si is inserted between adjacent high moment stacks. The laminated structure also includes an alignment layer below each high moment layer within each stack. In one embodiment, a Ru coupling layer is inserted between two high moment layers in each stack to introduce an AFC scheme. An uppermost Ru layer is used as a CMP stop layer. A post annealing process may be employed to further reduce the anisotropy field (Hk).

    摘要翻译: 公开了一种层叠主极层,其中使用非AFC方案来破坏相邻的高力矩层之间的磁耦合,并且在保持高磁矩的同时降低硬轴方向的剩磁,并实现Hch,Hce和 Hk。 由Hf,Zr,Ta,Al,Mg,Zn或Si中的一种或多种的氧化物,氮化物或氧氮化物形成的厚度为3〜20埃的无定形材料层插入相邻的高强度叠层之间。 层叠结构还包括在每个堆叠内的每个高力矩层下面的对准层。 在一个实施例中,Ru耦合层插入每个堆叠中的两个高矩层之间以引入AFC方案。 使用最上层的Ru层作为CMP停止层。 可以采用后退火工艺来进一步降低各向异性场(Hk)。

    Fabrication of a coercivity hard bias using FePt containing film
    7.
    发明授权
    Fabrication of a coercivity hard bias using FePt containing film 有权
    使用含FePt膜制备高矫顽力硬偏压

    公开(公告)号:US08493694B2

    公开(公告)日:2013-07-23

    申请号:US12927697

    申请日:2010-11-22

    IPC分类号: G11B5/39

    摘要: The free layer of a CPP-TMR sensor is biased by laterally disposed hard bias (HB) layers that include a seedlayer structure, a magnetic layer structure of high coercivity material and a capping layer structure. The magnetic layer structure is a layer of FePt-containing material, such as FePtCu, while the seedlayers and capping layers include layers of Cr, CrTi, Fe, FeCo or FeCoMo. These combinations enable the promotion of the L10 phase of the FePt-containing material which provides a high coercivity magnetic layer structure at much lower annealing temperatures than in the prior art.

    摘要翻译: CPP-TMR传感器的自由层由横向设置的硬偏置(HB)层偏置,其包括种层结构,高矫顽力材料的磁性层结构和覆盖层结构。 磁性层结构是含FePt的材料层,例如FePtCu,而层和覆盖层包括Cr,CrTi,Fe,FeCo或FeCoMo层。 这些组合使得能够促进含FePt的材料的L10相,其提供比现有技术低得多的退火温度下的高矫顽磁性层结构。

    Fabrication of a coercivity hard bias using FePt containing film
    9.
    发明申请
    Fabrication of a coercivity hard bias using FePt containing film 有权
    使用含FePt的膜制造矫顽力硬偏差

    公开(公告)号:US20120129007A1

    公开(公告)日:2012-05-24

    申请号:US12927697

    申请日:2010-11-22

    IPC分类号: G11B5/39 C23C14/14 G11B5/33

    摘要: The free layer of a CPP-TMR sensor is biased by laterally disposed hard bias (HB) layers that include a seedlayer structure, a magnetic layer structure of high coercivity material and a capping layer structure. The magnetic layer structure is a layer of FePt-containing material, such as FePtCu, while the seedlayers and capping layers include layers of Cr, CrTi, Fe, FeCo or FeCoMo. These combinations enable the promotion of the L10 phase of the FePt-containing material which provides a high coercivity magnetic layer structure at much lower annealing temperatures than in the prior art.

    摘要翻译: CPP-TMR传感器的自由层由横向设置的硬偏置(HB)层偏置,其包括种层结构,高矫顽力材料的磁性层结构和覆盖层结构。 磁性层结构是含FePt的材料层,例如FePtCu,而层和覆盖层包括Cr,CrTi,Fe,FeCo或FeCoMo层。 这些组合使得能够促进含FePt的材料的L10相,其提供比现有技术低得多的退火温度下的高矫顽磁性层结构。

    Ta/W film as heating device for dynamic fly height adjustment
    10.
    发明申请
    Ta/W film as heating device for dynamic fly height adjustment 有权
    Ta / W薄膜作为动态飞行高度调节的加热装置

    公开(公告)号:US20090323227A1

    公开(公告)日:2009-12-31

    申请号:US12215825

    申请日:2008-06-30

    IPC分类号: G11B5/33

    CPC分类号: G11B5/314 G11B5/6064

    摘要: A dynamic fly heater (DFH) for improved lifetime and better film uniformity is disclosed for a magnetic head. The heater has a lower amorphous Ta layer and an upper W layer to promote small grain size and reduced electro-migration. The composite film is especially advantageous for heaters greater than 1000 Angstroms thick where dR/R is difficult to control in the prior art. The DFH may be a (Ta/W)n laminate in which the Ta layers are about 30 Angstroms thick and the combined thickness of the W layers is from 400 to 1200 Angstroms. A Ta film is preferably sputter deposited with an Ar pressure of 3 to 5 mTorr and the W film is sputter deposited in the same chamber with a 3 to 20 mTorr Ar pressure. In one embodiment, a merged read/write head has one DFH in the read head and a second DFH in the write head.

    摘要翻译: 公开了一种用于改善寿命和更好的膜均匀性的动态飞行加热器(DFH)。 加热器具有较低的非晶Ta层和上W层,以促进小晶粒尺寸和减少的电迁移。 复合膜对于现有技术中dR / R难以控制的大于1000埃的加热器是特别有利的。 DFH可以是(Ta / W)n层叠体,其中Ta层的厚度约为30埃,W层的组合厚度为400至1200埃。 优选以3至5mTorr的Ar压力溅射沉积Ta膜,并将W膜以3至20mTorr Ar压力溅射沉积在相同的室中。 在一个实施例中,合并的读/写头在读头中具有一个DFH,在写头中具有第二DFH。