METHOD FOR MANUFACTURING PIXEL STRUCTURE
    1.
    发明申请
    METHOD FOR MANUFACTURING PIXEL STRUCTURE 有权
    制造像素结构的方法

    公开(公告)号:US20100055853A1

    公开(公告)日:2010-03-04

    申请号:US12617712

    申请日:2009-11-12

    IPC分类号: H01L21/336

    CPC分类号: H01L27/1248 H01L27/1288

    摘要: A method for manufacturing a pixel structure is provided. A gate and a gate insulating layer are sequentially formed on a substrate. A semiconductor layer and a second metal layer are sequentially formed on the gate insulating layer. The semiconductor layer and the second metal layer are patterned to form a channel layer, a source and a drain by using a patterned photoresist layer formed thereon, wherein the source and drain are disposed on a portion of the channel layer. The gate, channel, source and drain form a thin film transistor. A passivation layer is formed on the patterned photoresist layer, the gate insulating layer and the thin film transistor. Then, the patterned photoresist layer is removed, such that the passivation layer thereon is removed simultaneously to form a patterned passivation layer and the drain is exposed. A pixel electrode is formed on the patterned passivation layer and the drain.

    摘要翻译: 提供了一种用于制造像素结构的方法。 栅极和栅极绝缘层依次形成在基板上。 半导体层和第二金属层依次形成在栅极绝缘层上。 通过使用形成在其上的图案化光致抗蚀剂层,将半导体层和第二金属层图案化以形成沟道层,源极和漏极,其中源极和漏极设置在沟道层的一部分上。 栅极,沟道,源极和漏极形成薄膜晶体管。 在图案化的光致抗蚀剂层,栅极绝缘层和薄膜晶体管上形成钝化层。 然后,去除图案化的光致抗蚀剂层,使得其上的钝化层被同时去除以形成图案化的钝化层,并且漏极被暴露。 在图案化的钝化层和漏极上形成像素电极。

    METHOD FOR FABRICATING PIXEL STRUCTURE
    2.
    发明申请
    METHOD FOR FABRICATING PIXEL STRUCTURE 有权
    制造像素结构的方法

    公开(公告)号:US20090148972A1

    公开(公告)日:2009-06-11

    申请号:US12105279

    申请日:2008-04-18

    IPC分类号: H01L21/00

    摘要: A method for fabricating a pixel structure includes following steps. First, a substrate is provided. Next, a first conductive layer is formed on the substrate. Next, a first shadow mask is disposed over the first conductive layer. Next, a laser is applied through the first shadow mask to irradiate the first conductive layer to form a gate. Next, a gate dielectric layer is formed on the substrate to cover the gate. After that, a channel layer, a source and a drain are simultaneously formed on the gate dielectric layer over the gate, wherein the gate, the channel layer, the source and the drain together form a thin film transistor. A patterned passivation layer is formed on the thin film transistor and the patterned passivation layer exposes a part of the drain. Furthermore, a pixel electrode electrically connecting to the drain is formed.

    摘要翻译: 一种用于制造像素结构的方法包括以下步骤。 首先,提供基板。 接下来,在基板上形成第一导电层。 接下来,在第一导电层上设置第一荫罩。 接下来,通过第一荫罩施加激光以照射第一导电层以形成栅极。 接下来,在基板上形成栅电介质层以覆盖栅极。 之后,沟道层,源极和漏极同时形成在栅极上的栅极电介质层上,其中栅极,沟道层,源极和漏极一起形成薄膜晶体管。 图案化的钝化层形成在薄膜晶体管上,并且图案化的钝化层露出一部分漏极。 此外,形成电连接到漏极的像素电极。

    Method for fabricating pixel structure
    3.
    发明授权
    Method for fabricating pixel structure 有权
    制造像素结构的方法

    公开(公告)号:US07816159B2

    公开(公告)日:2010-10-19

    申请号:US12105279

    申请日:2008-04-18

    IPC分类号: H01L21/00

    摘要: A method for fabricating a pixel structure includes following steps. First, a substrate is provided. Next, a first conductive layer is formed on the substrate. Next, a first shadow mask is disposed over the first conductive layer. Next, a laser is applied through the first shadow mask to irradiate the first conductive layer to form a gate. Next, a gate dielectric layer is formed on the substrate to cover the gate. After that, a channel layer, a source and a drain are simultaneously formed on the gate dielectric layer over the gate, wherein the gate, the channel layer, the source and the drain together form a thin film transistor. A patterned passivation layer is formed on the thin film transistor and the patterned passivation layer exposes a part of the drain. Furthermore, a pixel electrode electrically connecting to the drain is formed.

    摘要翻译: 一种用于制造像素结构的方法包括以下步骤。 首先,提供基板。 接下来,在基板上形成第一导电层。 接下来,在第一导电层上设置第一荫罩。 接下来,通过第一荫罩施加激光以照射第一导电层以形成栅极。 接下来,在基板上形成栅电介质层以覆盖栅极。 之后,沟道层,源极和漏极同时形成在栅极上的栅极电介质层上,其中栅极,沟道层,源极和漏极一起形成薄膜晶体管。 图案化的钝化层形成在薄膜晶体管上,并且图案化的钝化层露出一部分漏极。 此外,形成电连接到漏极的像素电极。

    Method for manufacturing pixel structure
    4.
    发明授权
    Method for manufacturing pixel structure 有权
    像素结构制造方法

    公开(公告)号:US07811867B2

    公开(公告)日:2010-10-12

    申请号:US12617712

    申请日:2009-11-12

    IPC分类号: H01L21/00

    CPC分类号: H01L27/1248 H01L27/1288

    摘要: A method for manufacturing a pixel structure is provided. A gate and a gate insulating layer are sequentially formed on a substrate. A semiconductor layer and a second metal layer are sequentially formed on the gate insulating layer. The semiconductor layer and the second metal layer are patterned to form a channel layer, a source and a drain by using a patterned photoresist layer formed thereon, wherein the source and drain are disposed on a portion of the channel layer. The gate, channel, source and drain form a thin film transistor. A passivation layer is formed on the patterned photoresist layer, the gate insulating layer and the thin film transistor. Then, the patterned photoresist layer is removed, such that the passivation layer thereon is removed simultaneously to form a patterned passivation layer and the drain is exposed. A pixel electrode is formed on the patterned passivation layer and the drain.

    摘要翻译: 提供了一种用于制造像素结构的方法。 栅极和栅极绝缘层依次形成在基板上。 半导体层和第二金属层依次形成在栅极绝缘层上。 通过使用形成在其上的图案化光致抗蚀剂层,将半导体层和第二金属层图案化以形成沟道层,源极和漏极,其中源极和漏极设置在沟道层的一部分上。 栅极,沟道,源极和漏极形成薄膜晶体管。 在图案化的光致抗蚀剂层,栅极绝缘层和薄膜晶体管上形成钝化层。 然后,去除图案化的光致抗蚀剂层,使得其上的钝化层被同时去除以形成图案化的钝化层,并且漏极被暴露。 在图案化的钝化层和漏极上形成像素电极。

    Semiconductor Structures
    5.
    发明申请
    Semiconductor Structures 有权
    半导体结构

    公开(公告)号:US20100084660A1

    公开(公告)日:2010-04-08

    申请号:US12633975

    申请日:2009-12-09

    IPC分类号: H01L27/06 H01L29/786

    摘要: A semiconductor structure is provided. The semiconductor structure includes a substrate, a gate disposed thereon, an insulation layer disposed on the substrate and overlying the gate, a patterned semiconductor layer disposed on the insulation layer, a source and a drain disposed on the patterned semiconductor layer, a protective layer overlying the insulation layer, the source and the boundary of the drain to expose a portion of the drain, and a pixel electrode disposed on the substrate, overlying the protective layer overlying the boundary of the drain, electrically connected to the exposed drain.

    摘要翻译: 提供半导体结构。 半导体结构包括衬底,设置在其上的栅极,设置在衬底上并覆盖栅极的绝缘层,设置在绝缘层上的图案化半导体层,设置在图案化半导体层上的源极和漏极,保护层覆盖 所述绝缘层,所述漏极的源极和边界以暴露所述漏极的一部分,以及设置在所述衬底上的像素电极,覆盖所述保护层,所述保护层覆盖所述漏极的边界,电连接到所述暴露的漏极。

    Method for manufacturing pixel structure
    6.
    发明授权
    Method for manufacturing pixel structure 有权
    像素结构制造方法

    公开(公告)号:US07648865B1

    公开(公告)日:2010-01-19

    申请号:US12233607

    申请日:2008-09-19

    IPC分类号: H01L21/00

    CPC分类号: H01L27/1248 H01L27/1288

    摘要: A method for manufacturing a pixel structure is provided. First, a gate and a gate insulating layer are sequentially formed on the substrate. A channel layer and a second metal layer are sequentially formed on the gate insulating layer. The second metal layer is patterned to form a source and a drain by using a patterned photoresist layer formed thereon, wherein the source and the drain are disposed on a portion of the channel layer. The gate, the channel, the source and the drain form a thin film transistor. A passivation layer is formed on the patterned photoresist layer, the gate insulating layer and the thin film transistor. Then, the patterned photoresist layer is removed, such that the passivation layer thereon is removed simultaneously to form a patterned passivation layer and the drain is exposed. A pixel electrode is formed on the patterned passivation layer and the drain.

    摘要翻译: 提供了一种用于制造像素结构的方法。 首先,在基板上依次形成栅极和栅极绝缘层。 沟道层和第二金属层依次形成在栅极绝缘层上。 图案化第二金属层以通过使用其上形成的图案化光致抗蚀剂层来形成源极和漏极,其中源极和漏极设置在沟道层的一部分上。 栅极,沟道,源极和漏极形成薄膜晶体管。 在图案化的光致抗蚀剂层,栅极绝缘层和薄膜晶体管上形成钝化层。 然后,去除图案化的光致抗蚀剂层,使得其上的钝化层被同时去除以形成图案化的钝化层,并且漏极被暴露。 在图案化的钝化层和漏极上形成像素电极。

    Semiconductor structures
    7.
    发明授权
    Semiconductor structures 有权
    半导体结构

    公开(公告)号:US08431929B2

    公开(公告)日:2013-04-30

    申请号:US12633975

    申请日:2009-12-09

    摘要: A semiconductor structure is provided. The semiconductor structure includes a substrate, a gate disposed thereon, an insulation layer disposed on the substrate and overlying the gate, a patterned semiconductor layer disposed on the insulation layer, a source and a drain disposed on the patterned semiconductor layer, a protective layer overlying the insulation layer, the source and the boundary of the drain to expose a portion of the drain, and a pixel electrode disposed on the substrate, overlying the protective layer overlying the boundary of the drain, electrically connected to the exposed drain.

    摘要翻译: 提供半导体结构。 半导体结构包括衬底,设置在其上的栅极,设置在衬底上并覆盖栅极的绝缘层,设置在绝缘层上的图案化半导体层,设置在图案化半导体层上的源极和漏极,保护层覆盖 所述绝缘层,所述漏极的源极和边界以暴露所述漏极的一部分,以及设置在所述衬底上的像素电极,覆盖所述保护层,所述保护层覆盖所述漏极的边界,电连接到所述暴露的漏极。

    Semiconductor structures and method for fabricating the same
    8.
    发明授权
    Semiconductor structures and method for fabricating the same 有权
    半导体结构及其制造方法

    公开(公告)号:US07651876B2

    公开(公告)日:2010-01-26

    申请号:US11949081

    申请日:2007-12-03

    IPC分类号: H01L21/00 H01L21/84 H01L21/44

    摘要: A semiconductor structure is provided. The semiconductor structure includes a substrate, a gate disposed thereon, an insulation layer disposed on the substrate and overlying the gate, a patterned semiconductor layer disposed on the insulation layer, a source and a drain disposed on the patterned semiconductor layer, a protective layer overlying the insulation layer, the source and the boundary of the drain to expose a portion of the drain, and a pixel electrode disposed on the substrate, overlying the protective layer overlying the boundary of the drain, electrically connected to the exposed drain.

    摘要翻译: 提供半导体结构。 半导体结构包括衬底,设置在其上的栅极,设置在衬底上并覆盖栅极的绝缘层,设置在绝缘层上的图案化半导体层,设置在图案化半导体层上的源极和漏极,保护层覆盖 所述绝缘层,所述漏极的源极和边界以暴露所述漏极的一部分,以及设置在所述衬底上的像素电极,覆盖所述保护层,所述保护层覆盖所述漏极的边界,电连接到所述暴露的漏极。

    SEMICONDUCTOR STRUCTURES AND METHOD FOR FABRICATING THE SAME
    9.
    发明申请
    SEMICONDUCTOR STRUCTURES AND METHOD FOR FABRICATING THE SAME 有权
    半导体结构及其制造方法

    公开(公告)号:US20080197372A1

    公开(公告)日:2008-08-21

    申请号:US11949081

    申请日:2007-12-03

    IPC分类号: H01L33/00

    摘要: A semiconductor structure is provided. The semiconductor structure includes a substrate, a gate disposed thereon, an insulation layer disposed on the substrate and overlying the gate, a patterned semiconductor layer disposed on the insulation layer, a source and a drain disposed on the patterned semiconductor layer, a protective layer overlying the insulation layer, the source and the boundary of the drain to expose a portion of the drain, and a pixel electrode disposed on the substrate, overlying the protective layer overlying the boundary of the drain, electrically connected to the exposed drain.

    摘要翻译: 提供半导体结构。 半导体结构包括衬底,设置在其上的栅极,设置在衬底上并覆盖栅极的绝缘层,设置在绝缘层上的图案化半导体层,设置在图案化半导体层上的源极和漏极,保护层覆盖 所述绝缘层,所述漏极的源极和边界以暴露所述漏极的一部分,以及设置在所述衬底上的像素电极,覆盖所述保护层,所述保护层覆盖所述漏极的边界,电连接到所述暴露的漏极。

    Method of fabricating pixel structure
    10.
    发明申请
    Method of fabricating pixel structure 审中-公开
    制作像素结构的方法

    公开(公告)号:US20080213951A1

    公开(公告)日:2008-09-04

    申请号:US11953878

    申请日:2007-12-11

    IPC分类号: H01L21/84

    摘要: A method of fabricating a pixel structure including the following procedures is provided. First, a substrate having an active device thereon is provided. A patterned passivation layer is formed on the substrate and the active device, and the patterned passivation layer exposes a portion of the active device. Then, a conductive layer is formed over the patterned passivation layer, and the conductive layer is electrically connected to the active device. A mask exposing a portion of the conductive layer is provided above the conductive layer. A laser is used to irradiate the conductive layer via the mask to remove the portion of the conductive layer exposed by the mask. As a result, the remained portion of the conductive layer constitutes a pixel electrode, and the pixel electrode is electrically connected to the active device. The method simplifies the fabrication process of a pixel structure, and thus reduces the fabrication cost.

    摘要翻译: 提供了一种制造包括以下步骤的像素结构的方法。 首先,提供其上具有有源器件的衬底。 图案化的钝化层形成在衬底和有源器件上,并且图案化的钝化层露出有源器件的一部分。 然后,在图案化的钝化层上形成导电层,并且导电层电连接到有源器件。 暴露导电层的一部分的掩模设置在导电层的上方。 激光用于通过掩模照射导电层以去除由掩模暴露的导电层的部分。 结果,导电层的残留部分构成像素电极,像素电极与有源器件电连接。 该方法简化了像素结构的制造工艺,从而降低了制造成本。