公开(公告)号：US06936923B2

公开(公告)日：2005-08-30

申请号：US10147245

申请日：2002-05-16

申请人： Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yen-Ming Chen ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Chiou Shian Peng ,  Shih-Jang Lin

发明人： Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yen-Ming Chen ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Chiou Shian Peng ,  Shih-Jang Lin

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05552

摘要： A new method and processing sequence is provided for the creation of interconnect bumps. A layer of passivation is deposited over a contact pad and patterned, creating an opening in the layer of passivation that aligns with the contact pad. A layer of UBM metal is deposited over the layer of passivation, the layer of UBM is overlying the contact pad and limited to the immediate surroundings of the contact pad. The central surface of the layer of UBM is selectively electroplated after which a layer of solder or solder alloy is solder printed over the electroplated surface of the layer of UBM. A solder flux or paste is applied over the surface of the solder printed solder compound or solder alloy. Flowing of the solder or solder alloy creates the solder bump of the invention.

摘要翻译： 提供了一种新的方法和处理顺序，用于创建互连凸块。 钝化层沉积在接触焊盘上并被图案化，在与接触焊盘对准的钝化层中产生开口。 一层UBM金属沉积在钝化层上，UBM层覆盖接触焊盘，并限制在接触焊盘的周围环境。 选择性地电镀UBM层的中心表面，然后在UBM层的电镀表面上焊接印刷一层焊料或焊料合金。 在焊料印刷的焊料化合物或焊料合金的表面上施加焊剂或糊料。 焊料或焊料合金的流动产生本发明的焊料凸块。