公开(公告)号：US11424053B1

公开(公告)日：2022-08-23

申请号：US17236269

申请日：2021-04-21

申请人： Kyocera International, Inc.

发明人： Franklin Kim ,  Mark Eblen ,  Hiroshi Makino ,  Shinichi Hira

IPC分类号： B32B41/00 ,  H01B17/60

摘要： A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

公开(公告)号：US09859185B2

公开(公告)日：2018-01-02

申请号：US15418109

申请日：2017-01-27

申请人： Kyocera International, Inc.

发明人： Satoru Tomie ,  Mark Eblen ,  Eiji Watanabe ,  Eiji Tanaka

IPC分类号： H01L23/367 ,  H01L23/10 ,  H01L49/02 ,  H01L23/00 ,  H01L23/373 ,  H01L23/057

CPC分类号： H01L23/367 ,  H01L23/057 ,  H01L23/10 ,  H01L23/3736 ,  H01L24/48 ,  H01L28/40 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48155 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A semiconductor packaging structure includes a copper heat-sink with a shim projection which provides a stress release structure. The heat-sink with the shim projection may be used in conjunction with a pedestal in order to further reduce the thermal stress produced from the mismatch of thermal properties between the copper heat-sink metal and the ceramic frame. The copper heat-sink with a shim projection may also be part of the semiconductor package along with a lead frame, the ceramic frame, a semiconductor device, a capacitor, a wire bond and a ceramic lid or an encapsulation. The copper heat-sink, the ceramic frame and the lead frame are all chosen to be cost effective, and chosen such that the packaging process for the semiconductor device is able to achieve a smaller size while maintaining high reliability, low cost, and suitability for volume manufacturing.

公开(公告)号：US10410959B2

公开(公告)日：2019-09-10

申请号：US16015631

申请日：2018-06-22

申请人： Kyocera International, Inc.

发明人： Franklin Kim ,  Mark Eblen ,  Shinichi Hira

IPC分类号： H01L23/495 ,  H01L23/367 ,  H01L21/48 ,  H01L23/08 ,  H01L23/04 ,  H01L23/538 ,  H01L23/36

摘要： Package deflection and mechanical stress of microelectronic packaging is minimized in a two step manufacturing process. In a first step, a ceramic insulator is high-temperature bonded between a wraparound lead layer and a buffer layer of a same material as the lead layer to provide a symmetrically balanced three-layer structure. In a second step, the three-layer structure is high temperature bonded, using a lower melt point braze, to a heat spreader. This package configuration minimizes package deflection, and thereby improves thermal dissipation and reliability of the package.