SYSTEM AND METHOD FOR EFFICIENT ANTENNA WEIGHT VECTOR TABLES WITHIN PHASED-ARRAY ANTENNAS

    公开(公告)号:US20240213669A1

    公开(公告)日:2024-06-27

    申请号:US18392920

    申请日:2023-12-21

    发明人: James Wang Mike Yang

    IPC分类号: H01Q3/36

    CPC分类号: H01Q3/36

    摘要: Method and system are provided for reducing the AWV table size for phased-array antenna. In one novel aspect, the AWV table is decomposed to a combination of a first AWV table and a second AWV table, with a combined size smaller than the size of the AWV table. In one novel aspect, a group of decomposable AWVs are identified and each decomposed into a decomposed first AWVs and a decomposed second AWVs. In one embodiment, the decomposable weights W that are decomposed into Wh being a function of both elevation θ and azimuth (φ and Wv being a function of elevation θ only. In one novel aspect, the AWV table for a phased-array antenna with N antenna elements with Mv weights in a vertical direction and Mh weights in a horizontal direction is decomposed into a first AWV table and a second AWV table with a combined size of N*(Mv+Mh).

    ANTENNA ARRAY HAVING ANTENNA ELEMENTS WITH INTEGRATED FILTERS

    公开(公告)号:US20220416426A1

    公开(公告)日:2022-12-29

    申请号:US17939284

    申请日:2022-09-07

    摘要: A phased array antenna includes multiple antenna elements where each antenna element is an antenna apparatus that includes an antenna integrated with a filter. Each antenna apparatus includes a plurality of resonators where at least some of the resonators are each enclosed in a metal cavity and at least one resonator is exposed to free space to form a radiator element. Each antenna apparatus has a filter transfer function that is at least partially determined by dimensions of the radiator element and the position of the radiator element within the antenna apparatus. The scan volume of the phased array antenna is dependent on at least one physical dimension of the filter of the antenna apparatus.

    Low-Profile Low-Cost Phased-Array Antenna-in-Package

    公开(公告)号:US20220278450A1

    公开(公告)日:2022-09-01

    申请号:US17682497

    申请日:2022-02-28

    发明人: Kevin Jiang

    IPC分类号: H01Q3/32 H01Q9/04

    摘要: A method for designing a phased-array antenna embedded into stacked high impedance surfaces (HIS) structure is proposed. The stacked HIS structure comprises a plurality of HIS cell, which has two plate layers with adjustable height of the lower layer. Each HIS cell has a corresponding LC tank structure. Under a given height (HIS cell volume), the overall capacitance increases when the height of the lower layer plate increases. By adjusting the height of the lower layer plate, a variable capacitance of the corresponding LC tank can be achieved to allow lower operation frequencies of the phased-array antenna and to realize the benefit of HIS in band of interest. In addition, different design conditions can be achieved for the phased-array antenna.

    Ceramic feedthrough assemblies for electronic devices with metal housings

    公开(公告)号:US11424053B1

    公开(公告)日:2022-08-23

    申请号:US17236269

    申请日:2021-04-21

    IPC分类号: B32B41/00 H01B17/60

    摘要: A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

    Wideband Amplifier Linearization Techniques

    公开(公告)号:US20220060152A1

    公开(公告)日:2022-02-24

    申请号:US17406585

    申请日:2021-08-19

    IPC分类号: H03F1/32 H03F3/45 H03F1/42

    摘要: A wideband power amplifier (PA) linearization technique is proposed. A current interpolation technique is proposed to linearize power amplifiers over a wide bandwidth. The wideband power amplifier linearization technique employs a novel transconductance Gm linearizer using a current interpolation technique that achieves improvement in the third order intermodulation over wide bandwidth for a sub-micron CMOS differential power amplifier. By using a small amount of compensating bias into an opposite phase differential pair, linearization over wide bandwidth is achieved and can be optimized by adjusting the compensating bias.