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1.
公开(公告)号:US20240213669A1
公开(公告)日:2024-06-27
申请号:US18392920
申请日:2023-12-21
发明人: James Wang , Mike Yang
IPC分类号: H01Q3/36
CPC分类号: H01Q3/36
摘要: Method and system are provided for reducing the AWV table size for phased-array antenna. In one novel aspect, the AWV table is decomposed to a combination of a first AWV table and a second AWV table, with a combined size smaller than the size of the AWV table. In one novel aspect, a group of decomposable AWVs are identified and each decomposed into a decomposed first AWVs and a decomposed second AWVs. In one embodiment, the decomposable weights W that are decomposed into Wh being a function of both elevation θ and azimuth (φ and Wv being a function of elevation θ only. In one novel aspect, the AWV table for a phased-array antenna with N antenna elements with Mv weights in a vertical direction and Mh weights in a horizontal direction is decomposed into a first AWV table and a second AWV table with a combined size of N*(Mv+Mh).
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公开(公告)号:US11942703B2
公开(公告)日:2024-03-26
申请号:US17939284
申请日:2022-09-07
发明人: Carlos Carceller , Andy Piloto , Kawthar A. Zaki , Ali Atia , Joseph Tallo , Tyler Reid
CPC分类号: H01Q9/0414 , H01Q1/48 , H01Q9/0435 , H01Q9/0457 , H01Q9/0478 , H01Q21/0087 , H01Q21/065
摘要: A phased array antenna includes multiple antenna elements where each antenna element is an antenna apparatus that includes an antenna integrated with a filter. Each antenna apparatus includes a plurality of resonators where at least some of the resonators are each enclosed in a metal cavity and at least one resonator is exposed to free space to form a radiator element. Each antenna apparatus has a filter transfer function that is at least partially determined by dimensions of the radiator element and the position of the radiator element within the antenna apparatus. The scan volume of the phased array antenna is dependent on at least one physical dimension of the filter of the antenna apparatus.
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3.
公开(公告)号:US20230380077A1
公开(公告)日:2023-11-23
申请号:US18198361
申请日:2023-05-17
发明人: Hiroshi MAKINO , Paul GARLAND
CPC分类号: H05K3/4664 , H05K1/0298 , H05K2203/1126 , H05K2203/1476
摘要: The examples set forth herein involve inkjet printing one or more layers on a multilayer ceramic base. In some examples, the multilayer ceramic base is fired in a first firing process before one or more inkjet printed layers are printed on the multilayer ceramic base to form a combination package comprising the multilayer ceramic base and the one or more inkjet printed layers. In further examples, the combination package is fired in a second firing process.
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公开(公告)号:US11677154B2
公开(公告)日:2023-06-13
申请号:US17953589
申请日:2022-09-27
发明人: Carlos Carceller , Andy Piloto , Kawthar A. Zaki , Ali Atia , Joseph Tallo , Tyler Reid
CPC分类号: H01Q9/0414 , H01Q1/48 , H01Q9/0435 , H01Q9/0457 , H01Q9/0478 , H01Q21/0087 , H01Q21/065
摘要: An antenna apparatus includes an antenna integrated with a filter. The antenna apparatus includes a plurality of resonators where at least some of the resonators are each enclosed in a metal cavity and at least one resonator is exposed to free space to form a radiator element. The antenna apparatus has a filter transfer function that is at least partially determined by dimensions of the radiator element and the position of the radiator element within the antenna apparatus.
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公开(公告)号:US20220416426A1
公开(公告)日:2022-12-29
申请号:US17939284
申请日:2022-09-07
发明人: Carlos CARCELLER , Andy PILOTO , Kawthar A. ZAKI , Ali ATIA , Joseph TALLO , Tyler REID
摘要: A phased array antenna includes multiple antenna elements where each antenna element is an antenna apparatus that includes an antenna integrated with a filter. Each antenna apparatus includes a plurality of resonators where at least some of the resonators are each enclosed in a metal cavity and at least one resonator is exposed to free space to form a radiator element. Each antenna apparatus has a filter transfer function that is at least partially determined by dimensions of the radiator element and the position of the radiator element within the antenna apparatus. The scan volume of the phased array antenna is dependent on at least one physical dimension of the filter of the antenna apparatus.
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公开(公告)号:US20220278450A1
公开(公告)日:2022-09-01
申请号:US17682497
申请日:2022-02-28
发明人: Kevin Jiang
摘要: A method for designing a phased-array antenna embedded into stacked high impedance surfaces (HIS) structure is proposed. The stacked HIS structure comprises a plurality of HIS cell, which has two plate layers with adjustable height of the lower layer. Each HIS cell has a corresponding LC tank structure. Under a given height (HIS cell volume), the overall capacitance increases when the height of the lower layer plate increases. By adjusting the height of the lower layer plate, a variable capacitance of the corresponding LC tank can be achieved to allow lower operation frequencies of the phased-array antenna and to realize the benefit of HIS in band of interest. In addition, different design conditions can be achieved for the phased-array antenna.
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公开(公告)号:US11424053B1
公开(公告)日:2022-08-23
申请号:US17236269
申请日:2021-04-21
发明人: Franklin Kim , Mark Eblen , Hiroshi Makino , Shinichi Hira
摘要: A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.
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公开(公告)号:US20220060152A1
公开(公告)日:2022-02-24
申请号:US17406585
申请日:2021-08-19
发明人: Kun-Long Wu , James June-Ming Wang
摘要: A wideband power amplifier (PA) linearization technique is proposed. A current interpolation technique is proposed to linearize power amplifiers over a wide bandwidth. The wideband power amplifier linearization technique employs a novel transconductance Gm linearizer using a current interpolation technique that achieves improvement in the third order intermodulation over wide bandwidth for a sub-micron CMOS differential power amplifier. By using a small amount of compensating bias into an opposite phase differential pair, linearization over wide bandwidth is achieved and can be optimized by adjusting the compensating bias.
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公开(公告)号:US09859185B2
公开(公告)日:2018-01-02
申请号:US15418109
申请日:2017-01-27
发明人: Satoru Tomie , Mark Eblen , Eiji Watanabe , Eiji Tanaka
IPC分类号: H01L23/367 , H01L23/10 , H01L49/02 , H01L23/00 , H01L23/373 , H01L23/057
CPC分类号: H01L23/367 , H01L23/057 , H01L23/10 , H01L23/3736 , H01L24/48 , H01L28/40 , H01L2224/48137 , H01L2224/48139 , H01L2224/48155 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要: A semiconductor packaging structure includes a copper heat-sink with a shim projection which provides a stress release structure. The heat-sink with the shim projection may be used in conjunction with a pedestal in order to further reduce the thermal stress produced from the mismatch of thermal properties between the copper heat-sink metal and the ceramic frame. The copper heat-sink with a shim projection may also be part of the semiconductor package along with a lead frame, the ceramic frame, a semiconductor device, a capacitor, a wire bond and a ceramic lid or an encapsulation. The copper heat-sink, the ceramic frame and the lead frame are all chosen to be cost effective, and chosen such that the packaging process for the semiconductor device is able to achieve a smaller size while maintaining high reliability, low cost, and suitability for volume manufacturing.
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公开(公告)号:US20170221790A1
公开(公告)日:2017-08-03
申请号:US15418109
申请日:2017-01-27
发明人: Satoru TOMIE , Mark EBLEN , Eiji WATANABE , Eiji TANAKA
IPC分类号: H01L23/367 , H01L23/10 , H01L49/02 , H01L23/00 , H01L23/373 , H01L23/057
CPC分类号: H01L23/367 , H01L23/057 , H01L23/10 , H01L23/3736 , H01L24/48 , H01L28/40 , H01L2224/48137 , H01L2224/48139 , H01L2224/48155 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要: A semiconductor packaging structure includes a copper heat-sink with a shim projection which provides a stress release structure. The heat-sink with the shim projection may be used in conjunction with a pedestal in order to further reduce the thermal stress produced from the mismatch of thermal properties between the copper heat-sink metal and the ceramic frame. The copper heat-sink with a shim projection may also be part of the semiconductor package along with a lead frame, the ceramic frame, a semiconductor device, a capacitor, a wire bond and a ceramic lid or an encapsulation. The copper heat-sink, the ceramic frame and the lead frame are all chosen to be cost effective, and chosen such that the packaging process for the semiconductor device is able to achieve a smaller size while maintaining high reliability, low cost, and suitability for volume manufacturing.
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