Abstract:
An method of forming buried wiring lines makes it possible not to limit usable materials for an insulative plate to those having excellent heat resistance and to improve the corrosion resistance of the terminals provided for the buried wiring lines. The surface of an insulative plate is selectively etched using a mask formed on the surface, thereby forming grooves in the surface. A metallic nanoparticle ink is placed over the whole surface of the plate to fill the grooves with the ink, where the mask is being left. The ink is heated for preliminary curing to form a metallic nanoparticle ink film. The part of the film placed on the mask is selectively removed by detaching the mask, thereby leaving the remainder of the film in the grooves. The remaining film in the grooves is heated for main curing, thereby forming desired buried wiring lines.
Abstract:
A printing plate for an offset printing is provide. it includes a substrate and a plurality of concave printing plate patterns formed on the substrate. At least one auxiliary pattern is located on a bottom of at least one of the concave printing plate patterns and away from a side face of the concave printing plate pattern. Thereby, even if a plurality of inside void parts occur in a function pattern, an area thereof is small and each inside void part is isolated.