摘要:
A display substrate includes a gate line, a gate insulating layer, a data line, a thin-film transistor (TFT), a storage line, a passivation layer, a color filter layer, a pixel electrode, a first light-blocking layer and a second light-blocking layer. The storage line includes the same material as the gate line. The passivation layer covers the data line. The color filter layer is formed on the passivation layer. The pixel electrode is formed on the color filter layer in each pixel. The first light-blocking layer is formed between adjacent pixel electrodes, and includes the same material as the gate line. The second light-blocking layer is formed between the first light-blocking layer, and includes the same material as the data line. Therefore, an aperture ratio may be increased.
摘要:
A display substrate includes a gate line, a gate insulating layer, a data line, a thin-film transistor (TFT), a storage line, a passivation layer, a color filter layer, a pixel electrode, a first light-blocking layer and a second light-blocking layer. The storage line includes the same material as the gate line. The passivation layer covers the data line. The color filter layer is formed on the passivation layer. The pixel electrode is formed on the color filter layer in each pixel. The first light-blocking layer is formed between adjacent pixel electrodes, and includes the same material as the gate line. The second light-blocking layer is formed between the first light-blocking layer, and includes the same material as the data line. Therefore, an aperture ratio may be increased.
摘要:
A display substrate includes a TFT layer, a passivation layer, an organic layer, an inorganic insulating layer and a pixel electrode. The TFT layer includes gate and data lines, a thin film transistor and a storage electrode. The data line crosses the gate line, and is electrically insulated from the gate line by a gate insulating layer. The TFT is electrically connected to the gate and data lines. The passivation layer covers the TFT layer. The organic layer is on the passivation layer. The inorganic insulating layer of a low temperature deposition is on the organic layer, and the low temperature is about 100° C. to about 250° C. The pixel electrode is on the inorganic insulating layer to be electrically connected to the TFT through a contact hole that is formed through the inorganic insulating layer, the organic layer and the passivation layer. The inorganic insulating layer helps to block leakage of impurities from the organic layer to layers above the inorganic insulating layer.
摘要:
The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.
摘要:
The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.
摘要:
A thin film transistor array panel is provided, which includes a gate line, a data line intersecting the gate line, a storage electrode apart from the gate and data lines, a thin film transistor connected to the gate and data lines and having a drain electrode, a pixel electrode connected to the drain electrode, a first insulating layer over the thin film transistor and disposed under the pixel electrode, and a second insulating layer disposed on the first insulating layer and having an opening exposing the first insulating layer on the storage electrode.
摘要:
The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.
摘要:
A thin film transistor array panel includes a substrate, a first gate line and a second gate line formed on the substrate, a storage electrode line between the first gate line and the second gate line, a data line intersecting the first gate line and the second gate line, a first thin film transistor connected to the first gate line and the data line, at least one color filter formed on the first thin film transistor, wherein the color filter comprises a first portion adjacent the first gate line with respect to the storage electrode line, a second portion adjacent the second gate line with respect to the storage electrode line, and a first connection connecting the first portion and the second portion and having a narrower width than that of the first and second portions, a first sub-pixel electrode formed on the color filter and connected to the first thin film transistor, and a second sub-pixel electrode facing the first sub-pixel electrode with respect to a gap, wherein at least one of an edge of the first sub-pixel electrode and an edge of the second sub-pixel electrode crosses over the first connection of the color filter, the edge of the first sub-pixel electrode, and the edge of the second sub-pixel electrode defining the gap between the first sub-pixel electrode and the second sub-pixel electrode.
摘要:
In a thin-film transistor (TFT) substrate, a gate insulating layer is disposed on a gate electrode electrically connected to a gate line. A semiconductor layer is disposed on the gate insulating layer. A source electrode is electrically connected to a data line that intersects the gate line. A drain electrode faces the source electrode and defines a channel area of a semiconductor layer. An organic layer is disposed on the data line and has a first opening exposing the channel area. An inorganic insulating layer is disposed on the organic layer. A pixel electrode is disposed on the inorganic insulating layer and electrically connected to the drain electrode. The inorganic insulating layer covers the first opening, and thickness of the inorganic insulating layer is substantially uniform.
摘要:
The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.