公开(公告)号：US09406534B2

公开(公告)日：2016-08-02

申请号：US14525118

申请日：2014-10-27

Applicant: Lam Research Corporation

Inventor： Armen Avoyan ,  Kennet Baylon

IPC: H01L21/302 ,  H01L21/67 ,  H01L21/02 ,  B08B3/08

CPC classification number: H01L21/67017 ,  B08B3/08 ,  C23C16/4407 ,  H01J37/32862 ,  H01L21/02052 ,  H01L21/02054

Abstract: A system and method of cleaning a plasma processing chamber component includes removing the component from the plasma processing chamber, the removed component including a material deposited on the surface of the component. A heated oxidizing solution is applied to the material deposited on the component to oxidize a first portion deposited material. A stripping solution is applied to the component to remove the oxidized first portion of the deposited material. An etching solution is applied to remove a second portion of the deposited material and the cleaned component can be rinsed and dried.

Abstract translation: 清洁等离子体处理室部件的系统和方法包括从等离子体处理室移除部件，所移除的部件包括沉积在部件表面上的材料。 将加热的氧化溶液施加到沉积在部件上的材料以氧化第一部分沉积材料。 将剥离溶液施加到组分以除去沉积材料的氧化的第一部分。 施加蚀刻溶液以去除沉积材料的第二部分，并且可以清洗和干燥清洁的部件。

公开(公告)号：US20160079096A1

公开(公告)日：2016-03-17

申请号：US14525118

申请日：2014-10-27

Applicant: LAM RESEARCH CORPORATION

Inventor： Armen Avoyan ,  Kennet Baylon

IPC: H01L21/67 ,  B08B3/08 ,  H01L21/02

CPC classification number: H01L21/67017 ,  B08B3/08 ,  C23C16/4407 ,  H01J37/32862 ,  H01L21/02052 ,  H01L21/02054

Abstract: A system and method of cleaning a plasma processing chamber component includes removing the component from the plasma processing chamber, the removed component including a material deposited on the surface of the component. A heated oxidizing solution is applied to the material deposited on the component to oxidize a first portion deposited material. A stripping solution is applied to the component to remove the oxidized first portion of the deposited material. An etching solution is applied to remove a second portion of the deposited material and the cleaned component can be rinsed and dried.

Abstract translation: 清洁等离子体处理室部件的系统和方法包括从等离子体处理室移除部件，所移除的部件包括沉积在部件表面上的材料。 将加热的氧化溶液施加到沉积在部件上的材料以氧化第一部分沉积材料。 将剥离溶液施加到组分以除去沉积材料的氧化的第一部分。 施加蚀刻溶液以去除沉积材料的第二部分，并且可以清洗和干燥清洁的部件。

公开(公告)号：US10391526B2

公开(公告)日：2019-08-27

申请号：US14104356

申请日：2013-12-12

Applicant: Lam Research Corporation

Inventor： Armen Avoyan ,  Cliff LaCroix ,  Hong Shih ,  Kennet Baylon

IPC: H01L21/683 ,  B08B3/12 ,  B08B3/02 ,  B08B17/04 ,  H01L21/67 ,  B08B9/00

Abstract: A cleaning fixture assembly for protecting an electrostatic chuck suitable for supporting semiconductor substrates during a cleaning process contains a plate configured to align with and engage a backside of the electrostatic chuck, the plate having an annular seal portion surrounding a pocket. The cleaning fixture assembly also contains a first O-ring engaging the annular seal portion of the plate, a plurality of through-holes in the pocket of the plate, and a plurality of O-rings surrounding the plurality of through-holes in the pocket of the plate. The plurality of through-holes are configured to be aligned with and in fluid communication with lift pin holes and helium holes in the backside of the electrostatic chuck, and the plurality of O-rings are positioned to allow cleaning media to engage the lift pin holes and helium holes in the electrostatic chuck during a cleaning process while sealing the cleaning media from reaching the backside of the electrostatic chuck.

公开(公告)号：US20150165492A1

公开(公告)日：2015-06-18

申请号：US14104356

申请日：2013-12-12

Applicant: Lam Research Corporation

Inventor： Armen Avoyan ,  Cliff LaCroix ,  Hong Shih ,  Kennet Baylon

IPC: B08B3/12 ,  H01L21/683

CPC classification number: B08B3/12 ,  B08B3/02 ,  B08B9/00 ,  B08B17/04 ,  H01L21/67051 ,  H01L21/6831 ,  Y10T137/0402 ,  Y10T137/4238

Abstract: A cleaning fixture assembly for protecting an electrostatic chuck suitable for supporting semiconductor substrates during a cleaning process contains a plate configured to align with and engage a backside of the electrostatic chuck, the plate having an annular seal portion surrounding a pocket. The cleaning fixture assembly also contains a first O-ring engaging the annular seal portion of the plate, a plurality of through-holes in the pocket of the plate, and a plurality of O-rings surrounding the plurality of through-holes in the pocket of the plate. The plurality of through-holes are configured to be aligned with and in fluid communication with lift pin holes and helium holes in the backside of the electrostatic chuck, and the plurality of O-rings are positioned to allow cleaning media to engage the lift pin holes and helium holes in the electrostatic chuck during a cleaning process while sealing the cleaning media from reaching the backside of the electrostatic chuck.

Abstract translation: 一种用于在清洁过程中保护适合于支撑半导体衬底的静电吸盘的清洁固定装置包括配置成与静电吸盘的背面对准并与其接合的板，该板具有环绕袋的环形密封部分。 清洁固定组件还包括接合板的环形密封部分的第一O形环，在板的凹槽中的多个通孔和围绕袋中的多个通孔的多个O形环 的盘子。 多个通孔被构造成与静电卡盘的后侧中的提升销孔和氦孔对准并与其成流体连通，并且多个O形环被定位成允许清洁介质接合提升销孔 以及在清洁过程期间在静电卡盘中的氦孔，同时密封清洁介质到达静电卡盘的后侧。