Abstract:
A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.
Abstract:
A system and method of cleaning a plasma processing chamber component includes removing the component from the plasma processing chamber, the removed component including a material deposited on the surface of the component. A heated oxidizing solution is applied to the material deposited on the component to oxidize a first portion deposited material. A stripping solution is applied to the component to remove the oxidized first portion of the deposited material. An etching solution is applied to remove a second portion of the deposited material and the cleaned component can be rinsed and dried.
Abstract:
In one embodiment, a dual phase cleaning chamber may include a turbulent mixing chamber, a fluid diffuser, an isostatic pressure chamber and a rupture mitigating nozzle. The turbulent mixing chamber may be in fluid communication with a first fluid inlet and a second fluid inlet. The fluid diffuser may be in fluid communication with the turbulent mixing chamber. The rupture mitigating nozzle may include a first fluid collecting offset, a second fluid collecting offset, and a displacement damping projection. The displacement damping projection may be disposed between the first and second fluid collecting offset and may be offset away from each of the first fluid collecting offset and the second fluid collecting offset, and towards the fluid diffuser. A pressurized cleaning fluid introduced from the first fluid inlet, the second fluid inlet, or both flows through the outlet passage of the first and second fluid collecting offset.
Abstract:
A sonic cleaning tool having a component retaining fixture, a sonic bath, and a cleaning fluid circulating system. The sonic bath has a sound field transducer and is structurally configured to place the component retaining fixture in sonic communication with the sound field transducer within the sonic bath. The component retaining fixture comprises a first end plate, a second end plate, a first component securing member, a second component securing member, and a plurality of compression studs. The first component securing member projects from the first end plate and is structurally configured for repeatable transition between a retracted position and an extended position. The second component securing member projects from the second end plate. The compression studs of the component retaining fixture span from the first end plate to the second end plate and are spaced to form a plurality of sonic transmission windows between the compression studs. The sonic transmission windows collectively place a majority of a component disposed in the component retaining fixture in substantially unobstructed sonic communication with the sound field transducer of the sonic bath. The cleaning fluid circulating system has a cleaning fluid, a cleaning fluid supply reservoir, a deionized water supply, and a compressed dry air supply, which are fluidly connected to the component retaining fixture.
Abstract:
An apparatus for measuring contaminants on a surface of a component is provided. An extraction vessel for holding a measurement fluid has an opening adapted to form a meniscus using the measurement fluid. An actuator moves at least one of the extraction vessel and the component to a position where the meniscus is in contact with the surface of the component. A transducer is positioned to provide acoustic energy to the measurement fluid.
Abstract:
A system and method of cleaning a plasma processing chamber component includes removing the component from the plasma processing chamber, the removed component including a material deposited on the surface of the component. A heated oxidizing solution is applied to the material deposited on the component to oxidize a first portion deposited material. A stripping solution is applied to the component to remove the oxidized first portion of the deposited material. An etching solution is applied to remove a second portion of the deposited material and the cleaned component can be rinsed and dried.
Abstract:
A process is provided for polishing a silicon electrode utilizing a polishing turntable and a dual function electrode platen secured to the polishing, which can comprise a plurality of electrode mounts arranged to project from an electrode engaging face of the dual function electrode platen. The electrode mounts and mount receptacles can be configured to permit non-destructive engagement and disengagement of the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode. The silicon electrode can be polished by (i) engaging the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode via the electrode mounts and mount receptacles, (ii) utilizing the polishing turntable to impart rotary, and (iii) contacting an exposed face of the silicon electrode with a polishing surface as the silicon electrode. Additional embodiments are contemplated, disclosed and claimed.
Abstract:
A sonic cleaning tool having a component retaining fixture, a sonic bath, and a cleaning fluid circulating system. The sonic bath has a sound field transducer and is structurally configured to place the component retaining fixture in sonic communication with the sound field transducer within the sonic bath. The component retaining fixture comprises a first end plate, a second end plate, a first component securing member, a second component securing member, and a plurality of compression studs. The first component securing member projects from the first end plate and is structurally configured for repeatable transition between a retracted position and an extended position. The second component securing member projects from the second end plate. The compression studs of the component retaining fixture span from the first end plate to the second end plate and are spaced to form a plurality of sonic transmission windows between the compression studs. The sonic transmission windows collectively place a majority of a component disposed in the component retaining fixture in substantially unobstructed sonic communication with the sound field transducer of the sonic bath. The cleaning fluid circulating system has a cleaning fluid, a cleaning fluid supply reservoir, a deionized water supply, and a compressed dry air supply, which are fluidly connected to the component retaining fixture.
Abstract:
An injector cleaning apparatus with a concentric dual flow introducer and a flow-dispersing injector seat along with a method of cleaning an injector. The concentric dual flow introducer has concentric cleaning fluid flowpaths configured to communicate with a central passage and a plurality of peripheral passages of a gas injector. The input-side injector engaging interface of the concentric dual flow introducer and the flow-dispersing injector seat each have a compressible sealing portion having compressibility sufficient to yield under fluid cleaning surges attributable to initiation and termination of cleaning fluid flow through the injector cleaning apparatus along with resiliency sufficient to prevent abutment of the gas injector and a rigid facing portion of the input-side injector engaging interface and output-side injector engaging interface respectively.
Abstract:
A particle removal tool having a sound field transducer, a cleaning chamber, and an open sealing face. The cleaning chamber having a cleaning fluid guiding chamber extending from the sound field transducer to the open sealing face, a cleaning fluid delivery channel in fluid communication with the cleaning fluid guiding chamber, and a cleaning fluid return channel. The open sealing face has a cleaning portal disposed contiguous with a plane formed by the open sealing face and a chamber-to-surface interface seal which forms a fluid tight seal with a cleaning surface plane. The sound field transducer is disposed within a line-of-sight of the cleaning portal and generates acoustic waves with a frequency between approximately 20 kHz and approximately 2 MHz.