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公开(公告)号：US20170126233A1
公开(公告)日：2017-05-04
申请号：US15406506
申请日：2017-01-13
发明人： Kazuya YAMADA , Toshihisa SONE , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
CPC分类号： H03L1/026 , G01R1/44 , G01R21/00 , G01R22/061 , G01R22/10 , G01R35/04 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/3025 , H03K3/011 , H03L1/02 , H03L1/027 , H03L1/04 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
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公开(公告)号：US20190190449A1
公开(公告)日：2019-06-20
申请号：US16277601
申请日：2019-02-15
发明人： Kengo TAKEMASA , Yuichi YOSHIDA , Toshihisa SONE , Kazuya YAMADA , Akihiro TAKEI
CPC分类号： H03B5/30 , H01L21/565 , H01L23/3107 , H01L23/34 , H01L23/49541 , H01L23/49575 , H01L23/49596 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H03L1/022 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
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公开(公告)号：US20180006604A1
公开(公告)日：2018-01-04
申请号：US15691986
申请日：2017-08-31
发明人： Kengo TAKEMASA , Yuichi YOSHIDA , Toshihisa SONE , Kazuya YAMADA , Akihiro TAKEI
CPC分类号： H03B5/30 , H01L21/565 , H01L23/3107 , H01L23/34 , H01L23/49541 , H01L23/49575 , H01L23/49596 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H03L1/022 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
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公开(公告)号：US20130285640A1
公开(公告)日：2013-10-31
申请号：US13871030
申请日：2013-04-26
发明人： Kazuya YAMADA , Toshihisa SONE , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
CPC分类号： H03L1/026 , G01R1/44 , G01R21/00 , G01R22/061 , G01R22/10 , G01R35/04 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/3025 , H03K3/011 , H03L1/02 , H03L1/027 , H03L1/04 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
摘要翻译： 半导体器件包括以特定频率振荡的振荡器，集成了检测周围温度的温度传感器的半导体集成电路和电连接到振荡器的控制器，并且校正了振荡频率的温度相关误差 基于由温度传感器检测到的温度的振荡器和一体地密封振荡器和半导体集成电路的密封构件。
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公开(公告)号：US20220223505A1
公开(公告)日：2022-07-14
申请号：US17708955
申请日：2022-03-30
发明人： Toshihisa SONE , Kazuya YAMADA , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L25/18
摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
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公开(公告)号：US20200235046A1
公开(公告)日：2020-07-23
申请号：US16841293
申请日：2020-04-06
发明人： Toshihisa SONE , Kazuya YAMADA , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L25/18
摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
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公开(公告)号：US20160049944A1
公开(公告)日：2016-02-18
申请号：US14926534
申请日：2015-10-29
发明人： Kazuya YAMADA , Toshihisa SONE , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
CPC分类号： H03L1/026 , G01R1/44 , G01R21/00 , G01R22/061 , G01R22/10 , G01R35/04 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/3025 , H03K3/011 , H03L1/02 , H03L1/027 , H03L1/04 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
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公开(公告)号：US20240105565A1
公开(公告)日：2024-03-28
申请号：US18536112
申请日：2023-12-11
发明人： Toshihisa SONE , Kazuya YAMADA , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
IPC分类号： H01L23/495 , H01L23/00 , H01L23/31 , H01L25/18
CPC分类号： H01L23/49596 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L24/49 , H01L25/18 , H01L21/565 , H01L2224/45144 , H01L2924/181 , H01L2924/3025
摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
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公开(公告)号：US20160118938A1
公开(公告)日：2016-04-28
申请号：US14987084
申请日：2016-01-04
发明人： Kengo TAKEMASA , Yuichi YOSHIDA , Toshihisa SONE , Kazuya YAMADA , Akihiro TAKEI
IPC分类号： H03B5/30 , H01L23/31 , H01L23/495 , H01L23/00
CPC分类号： H03B5/30 , H01L21/565 , H01L23/3107 , H01L23/34 , H01L23/49541 , H01L23/49575 , H01L23/49596 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H03L1/022 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
摘要翻译： 半导体器件包括电子部件，其包括振荡器，并且在一个面上具有端子。 半导体芯片电连接到电子部件，并且还包括其一个面上的端子。 电子部件和半导体芯片安装到安装基座，使得电子部件的端子和半导体芯片的端子朝向相同的方向。 第一接合线连接到半导体芯片的端子，并且具有比第一接合线小的顶点高度的第二接合线将电子部件的端子连接到半导体芯片的端子。 密封件至少完全密封电子部件。
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公开(公告)号：US20150076673A1
公开(公告)日：2015-03-19
申请号：US14552510
申请日：2014-11-25
发明人： Toshihisa SONE , Kazuya YAMADA , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
IPC分类号： H01L23/495 , H01L23/00 , H01L25/18
CPC分类号： H01L23/49596 , H01L21/565 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/18 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49052 , H01L2224/4917 , H01L2224/49171 , H01L2924/07811 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/37001 , H01L2924/3701 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction: a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
摘要翻译： 半导体器件包括：振荡器，包括设置在沿第一方向具有特定距离的第一面上的外部端子; 包括沿着一侧形成有第一电极焊盘的第一区域和在所述第一区域的两个相对侧上形成有第二电极焊盘的第二区域的集成电路; 引线框架，其包括在周边部分的端子，并且其上安装有振荡器和集成电路，使得外部端子，第一和第二电极焊盘面向大致相同的方向，并且使得集成电路的一侧为 基本上平行于第一方向：将一个外部端子连接到一个第一电极焊盘的第一接合线; 将一个引线框架的一个端子连接到一个第二电极焊盘的第二焊接线; 以及密封所有部件的密封构件。
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