公开(公告)号：US11466178B2

公开(公告)日：2022-10-11

申请号：US16969255

申请日：2019-03-07

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong Kim ,  Sera Kim ,  Kwang Joo Lee ,  Sang Hwan Kim ,  Sung Chan Park ,  Mi Seon Yoon

IPC: C09J7/29 ,  C09J133/08 ,  H01L21/683

Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.

公开(公告)号：US11424153B2

公开(公告)日：2022-08-23

申请号：US16964364

申请日：2019-06-04

Applicant: LG CHEM, LTD.

Inventor： Mi Seon Yoon ,  Sera Kim ,  Kwang Joo Lee ,  Bora Yeon ,  Sang Hwan Kim ,  Eun Yeong Kim

IPC: H01L21/683 ,  H01L21/304 ,  C09J7/29 ,  B32B27/36 ,  B32B7/14

Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of −30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.