公开(公告)号：US11466184B2

公开(公告)日：2022-10-11

申请号：US17045865

申请日：2019-06-17

Applicant: LG CHEM, LTD.

Inventor： Mi Jang ,  Sera Kim ,  Ji Ho Han ,  Kwang Joo Lee ,  Bora Yeon ,  Kwang Su Seo

IPC: C09J143/04 ,  C09J11/06 ,  C09J183/06 ,  C08F230/08 ,  C08K5/00 ,  C08F8/30 ,  C08K5/17

Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

公开(公告)号：US12024654B2

公开(公告)日：2024-07-02

申请号：US17286673

申请日：2020-06-12

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Ji Ho Han ,  Bora Yeon ,  Mi Jang

IPC: C09J163/00 ,  C09J7/24 ,  H01L23/00 ,  C08K5/29 ,  C09J7/40

CPC classification number: C09J163/00 ,  C09J7/245 ,  H01L24/27 ,  H01L24/29 ,  C08K5/29 ,  C09J7/40 ,  C09J2433/00 ,  H01L2224/29025 ,  H01L2224/2919 ,  H01L2924/0665

Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

公开(公告)号：US11424153B2

公开(公告)日：2022-08-23

申请号：US16964364

申请日：2019-06-04

Applicant: LG CHEM, LTD.

Inventor： Mi Seon Yoon ,  Sera Kim ,  Kwang Joo Lee ,  Bora Yeon ,  Sang Hwan Kim ,  Eun Yeong Kim

IPC: H01L21/683 ,  H01L21/304 ,  C09J7/29 ,  B32B27/36 ,  B32B7/14

Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of −30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.