公开(公告)号：US11466178B2

公开(公告)日：2022-10-11

申请号：US16969255

申请日：2019-03-07

申请人： LG CHEM, LTD.

发明人： Eun Yeong Kim ,  Sera Kim ,  Kwang Joo Lee ,  Sang Hwan Kim ,  Sung Chan Park ,  Mi Seon Yoon

IPC分类号： C09J7/29 ,  C09J133/08 ,  H01L21/683

摘要： A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.

公开(公告)号：US12065595B2

公开(公告)日：2024-08-20

申请号：US16966696

申请日：2019-04-11

申请人： LG CHEM, LTD.

发明人： Sera Kim ,  Ji Ho Han ,  Mi Jang ,  Kwang Joo Lee

IPC分类号： C09J7/32 ,  C09J7/24 ,  C09J7/25 ,  C09J7/40 ,  C09J133/14 ,  H01L21/683 ,  C08K5/29 ,  C08K5/5397

CPC分类号： C09J7/243 ,  C09J7/255 ,  C09J7/40 ,  C09J133/14 ,  H01L21/6836 ,  C08K5/29 ,  C08K5/5397 ,  C09J2301/208 ,  C09J2301/408 ,  C09J2301/416 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/2809 ,  Y10T428/2848 ,  Y10T428/2891

摘要： The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.

公开(公告)号：US11424153B2

公开(公告)日：2022-08-23

申请号：US16964364

申请日：2019-06-04

申请人： LG CHEM, LTD.

发明人： Mi Seon Yoon ,  Sera Kim ,  Kwang Joo Lee ,  Bora Yeon ,  Sang Hwan Kim ,  Eun Yeong Kim

IPC分类号： H01L21/683 ,  H01L21/304 ,  C09J7/29 ,  B32B27/36 ,  B32B7/14

摘要： The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of −30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.

公开(公告)号：US11178730B2

公开(公告)日：2021-11-16

申请号：US16084185

申请日：2016-12-23

申请人： LG CHEM, LTD.

发明人： Ji Eun Myung ,  Sera Kim ,  Jooyeon Kim ,  Chang Yoon Lim ,  Seung Heon Lee ,  Mun Seop Song ,  Kwang Joo Lee ,  Ji Young Hwang

IPC分类号： H05B3/84 ,  C23F1/02 ,  H05B3/26

摘要： The present specification relates to a heating element and a method for manufacturing the same.

公开(公告)号：US10796818B2

公开(公告)日：2020-10-06

申请号：US16084424

申请日：2016-12-23

申请人： LG CHEM, LTD.

发明人： Ji Eun Myung ,  Sera Kim ,  Jooyeon Kim ,  Chang Yoon Lim ,  Seung Heon Lee ,  Mun Seop Song ,  Kwang Joo Lee ,  Ji Young Hwang

IPC分类号： H05K1/03 ,  H01B5/14 ,  H05B3/84 ,  H05B3/26 ,  H05K1/02 ,  H05K1/11

摘要： The present specification relates to a heating element and a method for manufacturing the same.

公开(公告)号：US11702571B2

公开(公告)日：2023-07-18

申请号：US16762863

申请日：2019-03-28

申请人： LG CHEM, LTD.

发明人： Sera Kim ,  Ji Ho Han ,  Kwang Joo Lee

IPC分类号： C09J7/22 ,  C09J7/40 ,  C09J133/08 ,  C09J133/24 ,  C09J7/38 ,  C09J167/02 ,  H01L21/683

CPC分类号： C09J7/22 ,  C09J7/385 ,  C09J7/40 ,  C09J133/08 ,  C09J133/24 ,  C09J167/02 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/208 ,  C09J2301/312 ,  C09J2301/416 ,  C09J2433/00 ,  H01L2221/68386

摘要： An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

公开(公告)号：US11466184B2

公开(公告)日：2022-10-11

申请号：US17045865

申请日：2019-06-17

申请人： LG CHEM, LTD.

发明人： Mi Jang ,  Sera Kim ,  Ji Ho Han ,  Kwang Joo Lee ,  Bora Yeon ,  Kwang Su Seo

IPC分类号： C09J143/04 ,  C09J11/06 ,  C09J183/06 ,  C08F230/08 ,  C08K5/00 ,  C08F8/30 ,  C08K5/17

摘要： The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.